DE69420201D1 - Kubikpackung mit Polyimidisolierung von gestapelten Halbleiterchips - Google Patents

Kubikpackung mit Polyimidisolierung von gestapelten Halbleiterchips

Info

Publication number
DE69420201D1
DE69420201D1 DE69420201T DE69420201T DE69420201D1 DE 69420201 D1 DE69420201 D1 DE 69420201D1 DE 69420201 T DE69420201 T DE 69420201T DE 69420201 T DE69420201 T DE 69420201T DE 69420201 D1 DE69420201 D1 DE 69420201D1
Authority
DE
Germany
Prior art keywords
chip
cube
semiconductor chips
chips
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69420201T
Other languages
English (en)
Other versions
DE69420201T2 (de
Inventor
Claude Louis Bertin
Farrar, Sr
Wayne John Howell
Christopher Paul Miller
David Jacob Perlman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69420201D1 publication Critical patent/DE69420201D1/de
Publication of DE69420201T2 publication Critical patent/DE69420201T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06524—Electrical connections formed on device or on substrate, e.g. a deposited or grown layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06551—Conductive connections on the side of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
DE69420201T 1993-06-21 1994-06-03 Kubikpackung mit Polyimidisolierung von gestapelten Halbleiterchips Expired - Fee Related DE69420201T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8045393A 1993-06-21 1993-06-21

Publications (2)

Publication Number Publication Date
DE69420201D1 true DE69420201D1 (de) 1999-09-30
DE69420201T2 DE69420201T2 (de) 2000-03-23

Family

ID=22157489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69420201T Expired - Fee Related DE69420201T2 (de) 1993-06-21 1994-06-03 Kubikpackung mit Polyimidisolierung von gestapelten Halbleiterchips

Country Status (9)

Country Link
US (1) US5478781A (de)
EP (1) EP0631310B1 (de)
JP (1) JP2786597B2 (de)
KR (1) KR0145033B1 (de)
AT (1) ATE183851T1 (de)
CA (1) CA2118994A1 (de)
DE (1) DE69420201T2 (de)
ES (1) ES2135507T3 (de)
TW (1) TW234778B (de)

Families Citing this family (77)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6048751A (en) * 1993-06-25 2000-04-11 Lucent Technologies Inc. Process for manufacture of composite semiconductor devices
US5502667A (en) * 1993-09-13 1996-03-26 International Business Machines Corporation Integrated multichip memory module structure
MY114888A (en) * 1994-08-22 2003-02-28 Ibm Method for forming a monolithic electronic module by stacking planar arrays of integrated circuit chips
US5661330A (en) * 1995-03-14 1997-08-26 International Business Machines Corporation Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses
US5691248A (en) * 1995-07-26 1997-11-25 International Business Machines Corporation Methods for precise definition of integrated circuit chip edges
US5903045A (en) * 1996-04-30 1999-05-11 International Business Machines Corporation Self-aligned connector for stacked chip module
US5935763A (en) * 1996-06-11 1999-08-10 International Business Machines Corporation Self-aligned pattern over a reflective layer
US5656552A (en) * 1996-06-24 1997-08-12 Hudak; John James Method of making a thin conformal high-yielding multi-chip module
US6034438A (en) * 1996-10-18 2000-03-07 The Regents Of The University Of California L-connect routing of die surface pads to the die edge for stacking in a 3D array
US6498074B2 (en) 1996-10-29 2002-12-24 Tru-Si Technologies, Inc. Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
US6882030B2 (en) * 1996-10-29 2005-04-19 Tru-Si Technologies, Inc. Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate
WO1998019337A1 (en) 1996-10-29 1998-05-07 Trusi Technologies, Llc Integrated circuits and methods for their fabrication
US5933752A (en) * 1996-11-28 1999-08-03 Sony Corporation Method and apparatus for forming solder bumps for a semiconductor device
US5818107A (en) * 1997-01-17 1998-10-06 International Business Machines Corporation Chip stacking by edge metallization
US5903437A (en) * 1997-01-17 1999-05-11 International Business Machines Corporation High density edge mounting of chips
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US6069026A (en) * 1997-08-18 2000-05-30 Texas Instruments Incorporated Semiconductor device and method of fabrication
US5904502A (en) * 1997-09-04 1999-05-18 International Business Machines Corporation Multiple 3-dimensional semiconductor device processing method and apparatus
JP3152180B2 (ja) 1997-10-03 2001-04-03 日本電気株式会社 半導体装置及びその製造方法
KR100253352B1 (ko) * 1997-11-19 2000-04-15 김영환 적층가능한 반도체 칩 및 적층된 반도체 칩 모듈의 제조 방법
US6303988B1 (en) * 1998-04-22 2001-10-16 Packard Hughes Interconnect Company Wafer scale burn-in socket
US5990566A (en) * 1998-05-20 1999-11-23 Micron Technology, Inc. High density semiconductor package
AU8592098A (en) * 1998-07-27 2000-02-21 Reveo, Inc. Three-dimensional packaging technology for multi-layered integrated circuits
US6037668A (en) * 1998-11-13 2000-03-14 Motorola, Inc. Integrated circuit having a support structure
US6965165B2 (en) * 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
US6117704A (en) * 1999-03-31 2000-09-12 Irvine Sensors Corporation Stackable layers containing encapsulated chips
EP1041624A1 (de) 1999-04-02 2000-10-04 Interuniversitair Microelektronica Centrum Vzw Transfermethode ultra-dünner Substrate und Anwendung zur Herstellung von Mehrlagen-Dünnschichtstrukturen
EP1041620A3 (de) * 1999-04-02 2005-01-05 Interuniversitair Microelektronica Centrum Vzw Transfermethode ultradünner Substrate und Anwendung auf die Herstellung einer Mehrlagen-Dünnschicht-Anordnung
TW434854B (en) * 1999-11-09 2001-05-16 Advanced Semiconductor Eng Manufacturing method for stacked chip package
US6723620B1 (en) * 1999-11-24 2004-04-20 International Rectifier Corporation Power semiconductor die attach process using conductive adhesive film
US6322903B1 (en) 1999-12-06 2001-11-27 Tru-Si Technologies, Inc. Package of integrated circuits and vertical integration
KR100401018B1 (ko) * 1999-12-30 2003-10-08 앰코 테크놀로지 코리아 주식회사 반도체패키지를 위한 웨이퍼의 상호 접착 방법
US6319745B1 (en) 2000-05-31 2001-11-20 International Business Machines Corporation Formation of charge-coupled-device with image pick-up array
JP3879816B2 (ja) 2000-06-02 2007-02-14 セイコーエプソン株式会社 半導体装置及びその製造方法、積層型半導体装置、回路基板並びに電子機器
JP4329235B2 (ja) 2000-06-27 2009-09-09 セイコーエプソン株式会社 半導体装置及びその製造方法
SG97938A1 (en) * 2000-09-21 2003-08-20 Micron Technology Inc Method to prevent die attach adhesive contamination in stacked chips
US6630725B1 (en) 2000-10-06 2003-10-07 Motorola, Inc. Electronic component and method of manufacture
KR100419451B1 (ko) * 2000-10-09 2004-03-11 드림바이오젠 주식회사 천연물로부터 유래한 혈전용해 단백질
DE10101875B4 (de) * 2001-01-16 2006-05-04 Infineon Technologies Ag Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips und Verfahren zu seiner Herstellung
US6717254B2 (en) 2001-02-22 2004-04-06 Tru-Si Technologies, Inc. Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufacture
US20020163072A1 (en) * 2001-05-01 2002-11-07 Subhash Gupta Method for bonding wafers to produce stacked integrated circuits
US6900528B2 (en) * 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package
US6831370B2 (en) 2001-07-19 2004-12-14 Micron Technology, Inc. Method of using foamed insulators in three dimensional multichip structures
US6433413B1 (en) 2001-08-17 2002-08-13 Micron Technology, Inc. Three-dimensional multichip module
US6747347B2 (en) * 2001-08-30 2004-06-08 Micron Technology, Inc. Multi-chip electronic package and cooling system
US6686654B2 (en) * 2001-08-31 2004-02-03 Micron Technology, Inc. Multiple chip stack structure and cooling system
US6787916B2 (en) 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
US6787058B2 (en) * 2001-11-13 2004-09-07 Delphi Technologies, Inc. Low-cost MR fluids with powdered iron
US7279787B1 (en) 2001-12-31 2007-10-09 Richard S. Norman Microelectronic complex having clustered conductive members
US6848177B2 (en) 2002-03-28 2005-02-01 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6908845B2 (en) * 2002-03-28 2005-06-21 Intel Corporation Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US20030183943A1 (en) * 2002-03-28 2003-10-02 Swan Johanna M. Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
US6620638B1 (en) 2002-06-05 2003-09-16 Micron Technology, Inc. Testing of multi-chip electronic modules
WO2004015764A2 (en) * 2002-08-08 2004-02-19 Leedy Glenn J Vertical system integration
EP1562751B1 (de) * 2002-11-20 2013-01-02 Biolink Gesellschaft für Verbindungstechnologien mbH Verfahren zur herstellung eines bauteils
DE10326507A1 (de) * 2003-06-12 2005-01-13 Infineon Technologies Ag Verfahren zur Herstellung eines bruchfesten scheibenförmigen Gegenstands sowie zugehörige Halbleiterschaltungsanordung
DE10326508A1 (de) * 2003-06-12 2005-01-13 Infineon Technologies Ag Verfahren zur Herstellung eines bruchfesten scheibenförmigen Gegenstands sowie zugehörige Halbleiterschaltungsanordnung
US20050046034A1 (en) 2003-09-03 2005-03-03 Micron Technology, Inc. Apparatus and method for high density multi-chip structures
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
US6998703B2 (en) * 2003-12-04 2006-02-14 Palo Alto Research Center Inc. Thin package for stacking integrated circuits
KR100536043B1 (ko) * 2004-06-25 2005-12-12 삼성전자주식회사 적층형 반도체 장치 및 그 제조 방법
US7930814B2 (en) * 2006-07-26 2011-04-26 Raytheon Company Manufacturing method for a septum polarizer
US7486525B2 (en) * 2006-08-04 2009-02-03 International Business Machines Corporation Temporary chip attach carrier
SG148901A1 (en) 2007-07-09 2009-01-29 Micron Technology Inc Packaged semiconductor assemblies and methods for manufacturing such assemblies
US7989950B2 (en) 2008-08-14 2011-08-02 Stats Chippac Ltd. Integrated circuit packaging system having a cavity
US9355975B2 (en) 2010-05-11 2016-05-31 Xintec Inc. Chip package and method for forming the same
US9209124B2 (en) 2010-05-11 2015-12-08 Xintec Inc. Chip package
US8507321B2 (en) 2010-05-11 2013-08-13 Chao-Yen Lin Chip package and method for forming the same
US9437478B2 (en) 2010-05-11 2016-09-06 Xintec Inc. Chip package and method for forming the same
US9425134B2 (en) 2010-05-11 2016-08-23 Xintec Inc. Chip package
US8518748B1 (en) * 2011-06-29 2013-08-27 Western Digital (Fremont), Llc Method and system for providing a laser submount for an energy assisted magnetic recording head
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
EP2838114A3 (de) * 2013-08-12 2015-04-08 Xintec Inc. Chip-Verkapselung
KR102595276B1 (ko) 2016-01-14 2023-10-31 삼성전자주식회사 반도체 패키지
CN106971993B (zh) * 2016-01-14 2021-10-15 三星电子株式会社 半导体封装件
KR20180090494A (ko) 2017-02-03 2018-08-13 삼성전자주식회사 기판 구조체 제조 방법
KR102572457B1 (ko) * 2018-02-26 2023-08-30 엘지전자 주식회사 냉장고 및 냉장고의 제어 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4525921A (en) * 1981-07-13 1985-07-02 Irvine Sensors Corporation High-density electronic processing package-structure and fabrication
US4672737A (en) * 1984-01-23 1987-06-16 Irvine Sensors Corporation Detector array module fabrication process
JP2680364B2 (ja) * 1988-08-05 1997-11-19 株式会社日立製作所 半導体装置の製造方法
US5107586A (en) * 1988-09-27 1992-04-28 General Electric Company Method for interconnecting a stack of integrated circuits at a very high density
US5075253A (en) * 1989-04-12 1991-12-24 Advanced Micro Devices, Inc. Method of coplanar integration of semiconductor IC devices
US5104820A (en) * 1989-07-07 1992-04-14 Irvine Sensors Corporation Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting
JP2665383B2 (ja) * 1989-11-09 1997-10-22 日東電工株式会社 ダイシング・ダイボンドフィルム
AU8519891A (en) * 1990-08-01 1992-03-02 Staktek Corporation Ultra high density integrated circuit packages, method and apparatus
US5380681A (en) * 1994-03-21 1995-01-10 United Microelectronics Corporation Three-dimensional multichip package and methods of fabricating

Also Published As

Publication number Publication date
TW234778B (en) 1994-11-21
ATE183851T1 (de) 1999-09-15
CA2118994A1 (en) 1994-12-22
JP2786597B2 (ja) 1998-08-13
DE69420201T2 (de) 2000-03-23
JPH0883881A (ja) 1996-03-26
ES2135507T3 (es) 1999-11-01
EP0631310B1 (de) 1999-08-25
US5478781A (en) 1995-12-26
KR950001997A (ko) 1995-01-04
KR0145033B1 (ko) 1998-07-01
EP0631310A1 (de) 1994-12-28

Similar Documents

Publication Publication Date Title
DE69420201T2 (de) Kubikpackung mit Polyimidisolierung von gestapelten Halbleiterchips
JP2818390B2 (ja) 電子モジュール
EP0335741A3 (de) Halbleitersubstrat mit dielektrischer Isolierung
US7071568B1 (en) Stacked-die extension support structure and method thereof
WO1992017903A3 (en) Three-dimensional multichip module systems and methods of fabrication
EP0246458A3 (de) Modul für die Verpackung von integrierten Schaltungs-Halbleiterchips auf einem Basissubstrat
SG45692G (en) Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
WO2003030247A3 (de) Verfahren zum kontaktieren elektrischer kontaktflächen eines substrats und vorrichtung aus einem substrat mit elektrischen kontaktflächen
CA2105039A1 (en) Semiconductor Device and Wafer Structure Having a Planar Buried Interconnect by Wafer Bonding
US20060128061A1 (en) Fabrication of stacked die and structures formed thereby
KR970008442A (ko) 멀티칩 스택용 단부캡 칩, 멀티칩 스택 및 단부캡 칩 형성 방법
EP0952611A3 (de) Halbleiteranordnung
ATE93118T1 (de) Elektronische module hoher dichte, verfahren und erzeugnis.
US4474639A (en) Method and device for processing individual integrated circuits into film-mounted, integrated circuits (micropacks)
KR920008789A (ko) 반도체 정류장치와 그것을 이용하여 만든 전파 정류기
US20050078436A1 (en) Method for stacking chips within a multichip module package
US20070045793A1 (en) Semiconductor device and method for fabricating the same
US20020180020A1 (en) Three-dimension multi-chip stack package technology
WO1991000683A3 (en) Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting
DE3681689D1 (en) Integrated semiconductor memory circuit for security or credit system
CA2035724A1 (en) Power semiconductor device with heat dissipating property
JPS5236985A (en) Method of connecting semiconductor devices etc.
KR20020042958A (ko) 적층 칩 패키지
Mukai et al. High packing linear integrated circuits using planar metallization with polymer
JPS645044A (en) Semiconductor integrated circuit device

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee