DE69417168T2 - Verfahren zum Aufbringen eines Bauteiles auf einen bandförmigen Träger und Vorrichtung zum Aufbringen eines Bauteiles auf einen bandförmigen Träger - Google Patents
Verfahren zum Aufbringen eines Bauteiles auf einen bandförmigen Träger und Vorrichtung zum Aufbringen eines Bauteiles auf einen bandförmigen TrägerInfo
- Publication number
- DE69417168T2 DE69417168T2 DE69417168T DE69417168T DE69417168T2 DE 69417168 T2 DE69417168 T2 DE 69417168T2 DE 69417168 T DE69417168 T DE 69417168T DE 69417168 T DE69417168 T DE 69417168T DE 69417168 T2 DE69417168 T2 DE 69417168T2
- Authority
- DE
- Germany
- Prior art keywords
- pattern
- carrier
- reference holes
- pins
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 16
- 230000007246 mechanism Effects 0.000 claims description 13
- 239000011888 foil Substances 0.000 description 11
- 238000006073 displacement reaction Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 8
- 239000003570 air Substances 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 239000000872 buffer Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Collation Of Sheets And Webs (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE9301370A BE1007866A3 (nl) | 1993-12-10 | 1993-12-10 | Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69417168D1 DE69417168D1 (de) | 1999-04-22 |
| DE69417168T2 true DE69417168T2 (de) | 1999-09-23 |
Family
ID=3887628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69417168T Expired - Fee Related DE69417168T2 (de) | 1993-12-10 | 1994-12-05 | Verfahren zum Aufbringen eines Bauteiles auf einen bandförmigen Träger und Vorrichtung zum Aufbringen eines Bauteiles auf einen bandförmigen Träger |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5680699A (enExample) |
| EP (1) | EP0658080B1 (enExample) |
| JP (1) | JP3548615B2 (enExample) |
| KR (1) | KR100327455B1 (enExample) |
| BE (1) | BE1007866A3 (enExample) |
| DE (1) | DE69417168T2 (enExample) |
| TW (1) | TW267294B (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6324752B1 (en) * | 1999-11-05 | 2001-12-04 | U.S. Philips Corporation | Component placement machine |
| EP1369006A1 (en) | 2000-11-02 | 2003-12-10 | Assembléon N.V. | Component placement machine |
| NL1024819C2 (nl) * | 2003-11-20 | 2005-05-23 | Fico Bv | Inrichting en werkwijze voor het productafhankelijk instellen van een inrichting voor het verwerken van een drager met elektronische componenten. |
| TWI331491B (en) * | 2007-04-04 | 2010-10-01 | Unimicron Technology Corp | Apparatus for transplanting multi-circuit boards |
| FR2926890B1 (fr) * | 2008-01-30 | 2011-01-07 | St Microelectronics Grenoble | Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques |
| CN115009676B (zh) * | 2022-05-31 | 2023-06-20 | 安徽明天氢能科技股份有限公司 | 一种燃料电池极板转运工装 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1294973A (enExample) * | 1969-02-12 | 1972-11-01 | ||
| US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
| US3949925A (en) * | 1974-10-03 | 1976-04-13 | The Jade Corporation | Outer lead bonder |
| US4624358A (en) * | 1983-03-07 | 1986-11-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Device for transferring lead frame |
| US4943342A (en) * | 1988-08-29 | 1990-07-24 | Golemon Valia S | Component feeding device for circuit board mounting apparatus |
| DE3919080A1 (de) * | 1989-06-10 | 1990-12-13 | Georg Sillner | Vorrichtung zum einsetzen von bauteilen, insbesondere elektrischen bauteilen in ausnehmungen eines gurtes |
| DE69128745T2 (de) * | 1990-02-06 | 1998-06-18 | Citizen Watch Co Ltd | Verfahren zum bearbeiten eines beschichteten bleches |
| JP2767970B2 (ja) * | 1990-04-04 | 1998-06-25 | 松下電器産業株式会社 | 電子部品の実装装置及び実装方法 |
| JPH0574865A (ja) * | 1991-09-11 | 1993-03-26 | Furukawa Electric Co Ltd:The | テープキヤリアの製造方法 |
-
1993
- 1993-12-10 BE BE9301370A patent/BE1007866A3/nl not_active IP Right Cessation
-
1994
- 1994-12-05 DE DE69417168T patent/DE69417168T2/de not_active Expired - Fee Related
- 1994-12-05 EP EP94203523A patent/EP0658080B1/en not_active Expired - Lifetime
- 1994-12-09 KR KR1019940033399A patent/KR100327455B1/ko not_active Expired - Fee Related
- 1994-12-12 JP JP30758394A patent/JP3548615B2/ja not_active Expired - Fee Related
- 1994-12-24 TW TW083112143A patent/TW267294B/zh active
-
1996
- 1996-07-30 US US08/688,581 patent/US5680699A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0658080B1 (en) | 1999-03-17 |
| BE1007866A3 (nl) | 1995-11-07 |
| EP0658080A1 (en) | 1995-06-14 |
| JP3548615B2 (ja) | 2004-07-28 |
| KR100327455B1 (ko) | 2002-08-14 |
| JPH07195237A (ja) | 1995-08-01 |
| TW267294B (enExample) | 1996-01-01 |
| KR950017689A (ko) | 1995-07-20 |
| US5680699A (en) | 1997-10-28 |
| DE69417168D1 (de) | 1999-04-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: ASSEMBLEON N.V., EINDHOVEN, NL |
|
| 8328 | Change in the person/name/address of the agent |
Free format text: VOLMER, G., DIPL.-ING., PAT.-ANW., 52064 AACHEN |
|
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Representative=s name: ACKMANN MENGES PATENT- UND RECHTSANWAELTE, 80469 M |
|
| 8339 | Ceased/non-payment of the annual fee |