FR2926890B1 - Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques - Google Patents
Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniquesInfo
- Publication number
- FR2926890B1 FR2926890B1 FR0850582A FR0850582A FR2926890B1 FR 2926890 B1 FR2926890 B1 FR 2926890B1 FR 0850582 A FR0850582 A FR 0850582A FR 0850582 A FR0850582 A FR 0850582A FR 2926890 B1 FR2926890 B1 FR 2926890B1
- Authority
- FR
- France
- Prior art keywords
- electronic modules
- handling
- equipment
- transporting
- testing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53022—Means to assemble or disassemble with means to test work or product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0850582A FR2926890B1 (fr) | 2008-01-30 | 2008-01-30 | Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques |
EP09705834A EP2238466A1 (fr) | 2008-01-30 | 2009-01-28 | Procédé et dispositif pour transporter des modules électroniques |
KR1020107017550A KR20100129724A (ko) | 2008-01-30 | 2009-01-28 | 전자 모듈 전송을 위한 방법 및 장치 |
US12/864,867 US8448332B2 (en) | 2008-01-30 | 2009-01-28 | Method and device for transporting electronic modules |
PCT/EP2009/050903 WO2009095389A1 (fr) | 2008-01-30 | 2009-01-28 | Procédé et dispositif pour transporter des modules électroniques |
JP2010544680A JP5406856B2 (ja) | 2008-01-30 | 2009-01-28 | 電子モジュールの移送のための方法及びデバイス |
CN200980103610.1A CN101971041B (zh) | 2008-01-30 | 2009-01-28 | 用于传送电子模块的方法和装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0850582A FR2926890B1 (fr) | 2008-01-30 | 2008-01-30 | Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2926890A1 FR2926890A1 (fr) | 2009-07-31 |
FR2926890B1 true FR2926890B1 (fr) | 2011-01-07 |
Family
ID=39712617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0850582A Expired - Fee Related FR2926890B1 (fr) | 2008-01-30 | 2008-01-30 | Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques |
Country Status (7)
Country | Link |
---|---|
US (1) | US8448332B2 (fr) |
EP (1) | EP2238466A1 (fr) |
JP (1) | JP5406856B2 (fr) |
KR (1) | KR20100129724A (fr) |
CN (1) | CN101971041B (fr) |
FR (1) | FR2926890B1 (fr) |
WO (1) | WO2009095389A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012209353B4 (de) * | 2012-06-04 | 2018-12-06 | Continental Automotive Gmbh | Prüfvorrichtung zum Testen einer Flachbaugruppe |
TWI566918B (zh) * | 2015-07-29 | 2017-01-21 | 財團法人工業技術研究院 | 立體列印系統 |
US9698040B2 (en) | 2015-10-29 | 2017-07-04 | Stmicroelectronics (Malta) Ltd | Semiconductor device carrier tape with image sensor detectable dimples |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3785507A (en) * | 1968-12-19 | 1974-01-15 | Teledyne Inc | Die sorting system |
GB1294973A (fr) * | 1969-02-12 | 1972-11-01 | ||
US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
US3859723A (en) * | 1973-11-05 | 1975-01-14 | Microsystems Int Ltd | Bonding method for multiple chip arrays |
US3949925A (en) * | 1974-10-03 | 1976-04-13 | The Jade Corporation | Outer lead bonder |
US4149665A (en) * | 1977-11-04 | 1979-04-17 | Nasa | Bonding machine for forming a solar array strip |
US4624358A (en) * | 1983-03-07 | 1986-11-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Device for transferring lead frame |
DE3336606A1 (de) * | 1983-10-07 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur mikropackherstellung |
US4801561A (en) * | 1984-07-05 | 1989-01-31 | National Semiconductor Corporation | Method for making a pre-testable semiconductor die package |
JPS62220460A (ja) * | 1986-03-14 | 1987-09-28 | 松下電器産業株式会社 | 電子部品集合体 |
JPH0266474A (ja) * | 1988-09-01 | 1990-03-06 | Tokyo Electron Ltd | 半導体素子の検査方法 |
US5173451A (en) * | 1991-06-04 | 1992-12-22 | Micron Technology, Inc. | Soft bond for semiconductor dies |
US5203143A (en) * | 1992-03-28 | 1993-04-20 | Tempo G | Multiple and split pressure sensitive adhesive stratums for carrier tape packaging system |
BE1007866A3 (nl) * | 1993-12-10 | 1995-11-07 | Koninkl Philips Electronics Nv | Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager. |
JPH0969636A (ja) * | 1995-08-30 | 1997-03-11 | Fuji Electric Co Ltd | 複合ダイオードチップ及びブリッジ整流器 |
EP0962777A3 (fr) * | 1998-06-02 | 2002-12-11 | Nihon Densan Read Kabushiki Kaisha, (Nidec-Read Corporation) | Appareil pour tester des plaques de circuits imprimés |
US6136137A (en) * | 1998-07-06 | 2000-10-24 | Micron Technology, Inc. | System and method for dicing semiconductor components |
US6543512B1 (en) * | 1998-10-28 | 2003-04-08 | Micron Technology, Inc. | Carrier, method and system for handling semiconductor components |
US6433360B1 (en) * | 1999-01-15 | 2002-08-13 | Xilinx, Inc. | Structure and method of testing failed or returned die to determine failure location and type |
TW451372B (en) * | 1999-06-17 | 2001-08-21 | Shinkawa Kk | Die-holding mechanism, die-packing device and die-bonding device |
US6790710B2 (en) * | 2002-01-31 | 2004-09-14 | Asat Limited | Method of manufacturing an integrated circuit package |
JP2003066109A (ja) * | 2001-08-28 | 2003-03-05 | Fujitsu Ltd | 半導体試験装置及び半導体試験方法 |
US7127805B2 (en) * | 2002-11-20 | 2006-10-31 | Intel Corporation | Electronic device carrier and manufacturing tape |
JP2004170337A (ja) * | 2002-11-22 | 2004-06-17 | Kawasaki Microelectronics Kk | Icパッケージトレイ、icテスト装置およびテスト方法 |
JP4408690B2 (ja) * | 2003-12-09 | 2010-02-03 | Necエレクトロニクス株式会社 | 半導体パッケージのテストシステム及びテスト方法 |
US7257887B2 (en) * | 2004-06-14 | 2007-08-21 | David Lee | Die holding apparatus for bonding systems |
US7151388B2 (en) * | 2004-09-30 | 2006-12-19 | Kes Systems, Inc. | Method for testing semiconductor devices and an apparatus therefor |
JP4403458B2 (ja) * | 2004-10-28 | 2010-01-27 | 東洋精密工業株式会社 | チップトレイ |
US8069636B1 (en) * | 2008-03-05 | 2011-12-06 | Charles Gutentag | Method and apparatus to facilitate retention and removal of components placed on adhesive backed carrier tape for automated handling |
US8793650B2 (en) * | 2010-06-11 | 2014-07-29 | Microsoft Corporation | Dynamic web application notifications including task bar overlays |
-
2008
- 2008-01-30 FR FR0850582A patent/FR2926890B1/fr not_active Expired - Fee Related
-
2009
- 2009-01-28 EP EP09705834A patent/EP2238466A1/fr not_active Withdrawn
- 2009-01-28 CN CN200980103610.1A patent/CN101971041B/zh active Active
- 2009-01-28 KR KR1020107017550A patent/KR20100129724A/ko not_active Application Discontinuation
- 2009-01-28 US US12/864,867 patent/US8448332B2/en active Active
- 2009-01-28 JP JP2010544680A patent/JP5406856B2/ja not_active Expired - Fee Related
- 2009-01-28 WO PCT/EP2009/050903 patent/WO2009095389A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN101971041B (zh) | 2014-08-20 |
JP2011512522A (ja) | 2011-04-21 |
KR20100129724A (ko) | 2010-12-09 |
JP5406856B2 (ja) | 2014-02-05 |
FR2926890A1 (fr) | 2009-07-31 |
CN101971041A (zh) | 2011-02-09 |
WO2009095389A1 (fr) | 2009-08-06 |
US8448332B2 (en) | 2013-05-28 |
US20100325870A1 (en) | 2010-12-30 |
EP2238466A1 (fr) | 2010-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20150930 |