TW267294B - - Google Patents
Info
- Publication number
- TW267294B TW267294B TW083112143A TW83112143A TW267294B TW 267294 B TW267294 B TW 267294B TW 083112143 A TW083112143 A TW 083112143A TW 83112143 A TW83112143 A TW 83112143A TW 267294 B TW267294 B TW 267294B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5136—Separate tool stations for selective or successive operation on work
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Collation Of Sheets And Webs (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE9301370A BE1007866A3 (nl) | 1993-12-10 | 1993-12-10 | Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager. |
Publications (1)
Publication Number | Publication Date |
---|---|
TW267294B true TW267294B (zh) | 1996-01-01 |
Family
ID=3887628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083112143A TW267294B (zh) | 1993-12-10 | 1994-12-24 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5680699A (zh) |
EP (1) | EP0658080B1 (zh) |
JP (1) | JP3548615B2 (zh) |
KR (1) | KR100327455B1 (zh) |
BE (1) | BE1007866A3 (zh) |
DE (1) | DE69417168T2 (zh) |
TW (1) | TW267294B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6324752B1 (en) * | 1999-11-05 | 2001-12-04 | U.S. Philips Corporation | Component placement machine |
JP2004513523A (ja) | 2000-11-02 | 2004-04-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 構成部分を配置する機械 |
NL1024819C2 (nl) * | 2003-11-20 | 2005-05-23 | Fico Bv | Inrichting en werkwijze voor het productafhankelijk instellen van een inrichting voor het verwerken van een drager met elektronische componenten. |
TWI331491B (en) * | 2007-04-04 | 2010-10-01 | Unimicron Technology Corp | Apparatus for transplanting multi-circuit boards |
FR2926890B1 (fr) * | 2008-01-30 | 2011-01-07 | St Microelectronics Grenoble | Procede et dispositif de transport de modules electroniques et equipements de manipulation et de test de modules electroniques |
CN115009676B (zh) * | 2022-05-31 | 2023-06-20 | 安徽明天氢能科技股份有限公司 | 一种燃料电池极板转运工装 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1294973A (zh) * | 1969-02-12 | 1972-11-01 | ||
US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
US3949925A (en) * | 1974-10-03 | 1976-04-13 | The Jade Corporation | Outer lead bonder |
US4624358A (en) * | 1983-03-07 | 1986-11-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Device for transferring lead frame |
US4943342A (en) * | 1988-08-29 | 1990-07-24 | Golemon Valia S | Component feeding device for circuit board mounting apparatus |
DE3919080A1 (de) * | 1989-06-10 | 1990-12-13 | Georg Sillner | Vorrichtung zum einsetzen von bauteilen, insbesondere elektrischen bauteilen in ausnehmungen eines gurtes |
US5295296A (en) * | 1990-02-06 | 1994-03-22 | Citizen Watch Co., Ltd. | Method and apparatus for working a clad material |
JP2767970B2 (ja) * | 1990-04-04 | 1998-06-25 | 松下電器産業株式会社 | 電子部品の実装装置及び実装方法 |
JPH0574865A (ja) * | 1991-09-11 | 1993-03-26 | Furukawa Electric Co Ltd:The | テープキヤリアの製造方法 |
-
1993
- 1993-12-10 BE BE9301370A patent/BE1007866A3/nl not_active IP Right Cessation
-
1994
- 1994-12-05 DE DE69417168T patent/DE69417168T2/de not_active Expired - Fee Related
- 1994-12-05 EP EP94203523A patent/EP0658080B1/en not_active Expired - Lifetime
- 1994-12-09 KR KR1019940033399A patent/KR100327455B1/ko not_active IP Right Cessation
- 1994-12-12 JP JP30758394A patent/JP3548615B2/ja not_active Expired - Fee Related
- 1994-12-24 TW TW083112143A patent/TW267294B/zh active
-
1996
- 1996-07-30 US US08/688,581 patent/US5680699A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07195237A (ja) | 1995-08-01 |
KR950017689A (ko) | 1995-07-20 |
BE1007866A3 (nl) | 1995-11-07 |
DE69417168T2 (de) | 1999-09-23 |
EP0658080A1 (en) | 1995-06-14 |
DE69417168D1 (de) | 1999-04-22 |
JP3548615B2 (ja) | 2004-07-28 |
EP0658080B1 (en) | 1999-03-17 |
KR100327455B1 (ko) | 2002-08-14 |
US5680699A (en) | 1997-10-28 |