DE69414027T2 - Resistzusammensetzungen für gedruckte Schaltungen - Google Patents

Resistzusammensetzungen für gedruckte Schaltungen

Info

Publication number
DE69414027T2
DE69414027T2 DE1994614027 DE69414027T DE69414027T2 DE 69414027 T2 DE69414027 T2 DE 69414027T2 DE 1994614027 DE1994614027 DE 1994614027 DE 69414027 T DE69414027 T DE 69414027T DE 69414027 T2 DE69414027 T2 DE 69414027T2
Authority
DE
Germany
Prior art keywords
printed circuits
resist compositions
resist
compositions
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1994614027
Other languages
English (en)
Other versions
DE69414027D1 (de
Inventor
Masato Kawade
Motoo Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of DE69414027D1 publication Critical patent/DE69414027D1/de
Application granted granted Critical
Publication of DE69414027T2 publication Critical patent/DE69414027T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
DE1994614027 1993-05-07 1994-05-06 Resistzusammensetzungen für gedruckte Schaltungen Expired - Lifetime DE69414027T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05106406A JP3115449B2 (ja) 1993-05-07 1993-05-07 配線板用めっきレジスト組成物およびプリント配線板

Publications (2)

Publication Number Publication Date
DE69414027D1 DE69414027D1 (de) 1998-11-26
DE69414027T2 true DE69414027T2 (de) 1999-03-18

Family

ID=14432802

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1994614027 Expired - Lifetime DE69414027T2 (de) 1993-05-07 1994-05-06 Resistzusammensetzungen für gedruckte Schaltungen

Country Status (3)

Country Link
EP (2) EP0802456A1 (de)
JP (1) JP3115449B2 (de)
DE (1) DE69414027T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016193591A (ja) * 2015-03-31 2016-11-17 太陽インキ製造株式会社 積層フィルム

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6010823A (en) * 1996-03-13 2000-01-04 Ibiden Co., Ltd. Resist compositions for plating
EP1796446B1 (de) * 1996-11-20 2011-05-11 Ibiden Co., Ltd. Leiterplatten
US6583198B2 (en) 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
DE19955969A1 (de) * 1999-11-19 2001-05-31 Inst Mikrotechnik Mainz Gmbh Verwendung von Polyimid für Haftschichten und lithographisches Verfahren zur Herstellung von Mikrobauteilen
TWI296738B (de) 2001-03-29 2008-05-11 Hitachi Chemical Co Ltd
JP2016060809A (ja) * 2014-09-17 2016-04-25 日本ゼオン株式会社 硬化性樹脂組成物、硬化性樹脂成形体、硬化物、積層体、複合体および多層プリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JPS62273226A (ja) * 1986-05-20 1987-11-27 Nippon Soda Co Ltd 無電解メッキ用光硬化性レジスト樹脂組成物
JPH0748109B2 (ja) * 1988-04-01 1995-05-24 イビデン株式会社 感光性樹脂組成物
JPH0823694B2 (ja) * 1988-08-04 1996-03-06 富士写真フイルム株式会社 液状感光性樹脂組成物
WO1993017457A1 (en) * 1989-07-01 1993-09-02 Ryo Enomoto Substrate for mounting semiconductor and method of producing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016193591A (ja) * 2015-03-31 2016-11-17 太陽インキ製造株式会社 積層フィルム

Also Published As

Publication number Publication date
DE69414027D1 (de) 1998-11-26
JPH06317904A (ja) 1994-11-15
EP0623852B1 (de) 1998-10-21
EP0623852A1 (de) 1994-11-09
EP0802456A1 (de) 1997-10-22
JP3115449B2 (ja) 2000-12-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition