DE69412772D1 - Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position - Google Patents
Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische PositionInfo
- Publication number
- DE69412772D1 DE69412772D1 DE69412772T DE69412772T DE69412772D1 DE 69412772 D1 DE69412772 D1 DE 69412772D1 DE 69412772 T DE69412772 T DE 69412772T DE 69412772 T DE69412772 T DE 69412772T DE 69412772 D1 DE69412772 D1 DE 69412772D1
- Authority
- DE
- Germany
- Prior art keywords
- assembling
- component
- specific position
- assembly device
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5331222A JPH07193397A (ja) | 1993-12-27 | 1993-12-27 | 実装機の吸着ポイント補正装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69412772D1 true DE69412772D1 (de) | 1998-10-01 |
DE69412772T2 DE69412772T2 (de) | 1999-01-14 |
Family
ID=18241266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69412772T Expired - Lifetime DE69412772T2 (de) | 1993-12-27 | 1994-12-27 | Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position |
Country Status (4)
Country | Link |
---|---|
US (1) | US5566447A (de) |
EP (1) | EP0660657B1 (de) |
JP (1) | JPH07193397A (de) |
DE (1) | DE69412772T2 (de) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6400459B1 (en) | 1995-02-24 | 2002-06-04 | Cyberoptics Corp. | Methods and apparatus for using optical sensors in component replacement heads |
JP3196626B2 (ja) * | 1995-12-26 | 2001-08-06 | ソニー株式会社 | 部品実装方法 |
JP3477321B2 (ja) * | 1996-07-25 | 2003-12-10 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
US6868603B2 (en) | 1996-08-27 | 2005-03-22 | Matsushita Electric Industrial Co., Ltd. | Method of mounting component on circuit board |
JPH1070395A (ja) | 1996-08-27 | 1998-03-10 | Matsushita Electric Ind Co Ltd | 部品装着装置 |
JP3749585B2 (ja) * | 1997-01-17 | 2006-03-01 | 松下電器産業株式会社 | 部品のテーピング方法と装置 |
JP3789188B2 (ja) | 1997-02-24 | 2006-06-21 | 富士機械製造株式会社 | 回路部品装着システム |
US5953812A (en) * | 1997-07-03 | 1999-09-21 | Schlumberger Technologies, Inc. | Misinsert sensing in pick and place tooling |
US6128801A (en) * | 1997-07-28 | 2000-10-10 | Winsor Corporation | Shoe sole cleaners |
JP3596243B2 (ja) * | 1997-08-07 | 2004-12-02 | 松下電器産業株式会社 | 電子部品実装方法 |
JPH11289194A (ja) * | 1998-04-06 | 1999-10-19 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
US6292261B1 (en) | 1998-05-22 | 2001-09-18 | Cyberoptics Corporation | Rotary sensor system with at least two detectors |
US6538750B1 (en) | 1998-05-22 | 2003-03-25 | Cyberoptics Corporation | Rotary sensor system with a single detector |
DE19840210A1 (de) | 1998-09-03 | 2000-03-09 | Fraunhofer Ges Forschung | Verfahren zur Handhabung einer Mehrzahl von Schaltungschips |
GB2347741A (en) | 1998-11-05 | 2000-09-13 | Cyberoptics Corp | Electronics assembly apparatus with improved imaging system |
KR100307611B1 (ko) * | 1999-02-08 | 2001-09-26 | 이중구 | 멀티노즐 헤드 |
JP2000288969A (ja) * | 1999-04-01 | 2000-10-17 | Mirae Corp | 表面実装機のマウンタヘッド |
IE20000566A1 (en) * | 1999-07-13 | 2001-02-21 | Mv Res Ltd | A circuit production method |
WO2001019156A1 (fr) * | 1999-09-02 | 2001-03-15 | Matsushita Electric Industrial Co., Ltd. | Procede et dispositif d'identification et de montage de pieces |
US6729018B1 (en) * | 1999-09-03 | 2004-05-04 | Matsushita Electric Industrial Co., Ltd. | Apparatus for mounting components |
JP3996768B2 (ja) * | 1999-09-27 | 2007-10-24 | 松下電器産業株式会社 | 部品実装方法及び部品実装装置 |
US6538244B1 (en) | 1999-11-03 | 2003-03-25 | Cyberoptics Corporation | Pick and place machine with improved vision system including a linescan sensor |
JP4037593B2 (ja) * | 1999-12-07 | 2008-01-23 | 松下電器産業株式会社 | 部品実装方法及びその装置 |
JP4480840B2 (ja) * | 2000-03-23 | 2010-06-16 | パナソニック株式会社 | 部品実装装置、及び部品実装方法 |
US6535291B1 (en) * | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
US6606790B2 (en) * | 2000-06-21 | 2003-08-19 | Matsushita Electric Industrial Co., Ltd. | Component mounter and mounting method |
JP2002050896A (ja) * | 2000-08-03 | 2002-02-15 | Sony Corp | 部品把持位置補正装置および補正方法 |
JP2003031994A (ja) * | 2001-07-18 | 2003-01-31 | Juki Corp | 電子部品装着方法及び装置 |
US7043820B2 (en) * | 2001-07-27 | 2006-05-16 | Fuji Machine Mfg. Co., Ltd. | Electric-component mounting system |
US7555831B2 (en) * | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
US7239399B2 (en) * | 2001-11-13 | 2007-07-03 | Cyberoptics Corporation | Pick and place machine with component placement inspection |
US7813559B2 (en) | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US6874225B2 (en) * | 2001-12-18 | 2005-04-05 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus |
SG104292A1 (en) * | 2002-01-07 | 2004-06-21 | Advance Systems Automation Ltd | Flip chip bonder and method therefor |
JP3973439B2 (ja) * | 2002-02-07 | 2007-09-12 | 松下電器産業株式会社 | 電子部品実装装置及び方法 |
JP4033705B2 (ja) * | 2002-05-08 | 2008-01-16 | 富士機械製造株式会社 | プリント配線板位置誤差取得方法,プログラムおよび電子回路部品装着システム |
DE10228555B4 (de) * | 2002-06-26 | 2004-07-15 | Siemens Ag | Vorrichtung zum Abholen von IC's von einem Wafer |
JP4147923B2 (ja) * | 2002-12-03 | 2008-09-10 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
TW200419640A (en) * | 2003-02-25 | 2004-10-01 | Matsushita Electric Ind Co Ltd | Electronic component placement machine and electronic component placement method |
JP4044017B2 (ja) * | 2003-04-22 | 2008-02-06 | 松下電器産業株式会社 | 部品実装装置及びその方法 |
JP4387745B2 (ja) | 2003-09-30 | 2009-12-24 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
US7706595B2 (en) | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
US20060016066A1 (en) * | 2004-07-21 | 2006-01-26 | Cyberoptics Corporation | Pick and place machine with improved inspection |
US7630465B2 (en) * | 2004-11-23 | 2009-12-08 | Harris Corporation | Wireless communications device providing time and frequency-domain channel estimates interpolation and related methods |
WO2007033349A1 (en) | 2005-09-14 | 2007-03-22 | Cyberoptics Corporation | Pick and place machine with improved component pick image processing |
US20070276867A1 (en) * | 2006-05-23 | 2007-11-29 | David Fishbaine | Embedded inspection image archival for electronics assembly machines |
JP4580972B2 (ja) * | 2006-11-09 | 2010-11-17 | パナソニック株式会社 | 部品実装方法 |
WO2008115532A1 (en) | 2007-03-20 | 2008-09-25 | Cyberoptics Corporation | Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam |
WO2008142744A1 (ja) * | 2007-05-09 | 2008-11-27 | Advantest Corporation | 部品搬送装置、電子部品試験装置および部品搬送装置の最適距離の認識方法 |
US8068664B2 (en) * | 2007-06-05 | 2011-11-29 | Cyberoptics Corporation | Component sensor for pick and place machine using improved shadow imaging |
US8447430B1 (en) | 2010-06-30 | 2013-05-21 | Western Digital Technologies, Inc. | Systems and methods for assembly tool calibration verification |
US8447551B1 (en) * | 2010-06-30 | 2013-05-21 | Western Digital Technologies, Inc. | Hard drive assembly tool calibration verification |
JP6484335B2 (ja) | 2015-06-02 | 2019-03-13 | 株式会社Fuji | 部品実装装置及び吸着位置設定方法 |
DE112015006636T5 (de) * | 2015-06-19 | 2018-03-01 | Yamaha Hatsudoki Kabushiki Kaisha | Bauteilmontagevorrichtung und Verfahren zur Bauteilmontage |
US10175658B2 (en) * | 2016-06-29 | 2019-01-08 | GM Global Technology Operations LLC | Systems and methods for sensor platform |
US10288458B2 (en) | 2016-06-29 | 2019-05-14 | GM Global Technology Operations LLC | Systems and methods for sensor platform |
US11490553B2 (en) * | 2018-02-21 | 2022-11-01 | Fuji Corporation | Component mounting system and component grasping method |
WO2021166133A1 (ja) * | 2020-02-19 | 2021-08-26 | 株式会社Fuji | 部品実装機 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3337941A (en) * | 1965-05-27 | 1967-08-29 | Ibm | Recycle control circuit for a chip positioning machine |
US3487226A (en) * | 1967-10-10 | 1969-12-30 | Remington Arms Co Inc | Method and apparatus for determining the coordinate of a projectile by measuring the time interval between the interception of successive light screens |
US3624401A (en) * | 1969-10-06 | 1971-11-30 | Us Navy | Ultraviolet target hit scoring system |
US3622396A (en) * | 1970-02-19 | 1971-11-23 | Esb Inc | Method for detecting mispositioned parts |
NL7211841A (de) * | 1972-08-31 | 1974-03-04 | ||
IT1047161B (it) * | 1975-09-03 | 1980-09-10 | Olivetti & Co Spa | Centro di lavorazione per automazione programmabile con dispositivo tattile autoadattivo |
US4144449A (en) * | 1977-07-08 | 1979-03-13 | Sperry Rand Corporation | Position detection apparatus |
US4151945A (en) * | 1977-12-08 | 1979-05-01 | Universal Instruments Corporation | Automated hybrid circuit board assembly apparatus |
CA1109539A (en) * | 1978-04-05 | 1981-09-22 | Her Majesty The Queen, In Right Of Canada, As Represented By The Ministe R Of Communications | Touch sensitive computer input device |
EP0020879A1 (de) * | 1979-06-06 | 1981-01-07 | Erwin Sick GmbH Optik-Elektronik | Opto-elektronischer Abstandsmesser |
JPS5645337A (en) * | 1979-09-11 | 1981-04-25 | Hitachi Ltd | Feeding and assembling device for parts |
EP0144717B1 (de) * | 1983-11-05 | 1988-10-19 | Zevatech AG | Verfahren und Vorrichtung zur Positionierung von Bauteilen auf einem Werkstück |
JPS60189951A (ja) * | 1984-03-12 | 1985-09-27 | Fujitsu Ltd | 方形体のエツジ検出方法 |
DE3532500C2 (de) * | 1984-09-17 | 1996-03-14 | Tdk Corp | Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette |
US4738025A (en) * | 1986-12-23 | 1988-04-19 | Northern Telecom Limited | Automated apparatus and method for positioning multicontact component |
GB2223429B (en) * | 1988-08-24 | 1993-02-17 | Tdk Corp | Apparatus for and method of automatically mounting electronic component on printed circuit board |
US5342460A (en) * | 1989-06-13 | 1994-08-30 | Matsushita Electric Industrial Co., Ltd. | Outer lead bonding apparatus |
JPH0810795B2 (ja) * | 1989-09-06 | 1996-01-31 | 松下電器産業株式会社 | 電子部品の実装装置及び実装方法 |
JPH0494600A (ja) * | 1990-08-11 | 1992-03-26 | Tdk Corp | 電子部品装着方法及び装置 |
US5249349A (en) * | 1991-01-24 | 1993-10-05 | Matsushita Electric Works, Ltd. | Parts mounting device |
US5278634A (en) * | 1991-02-22 | 1994-01-11 | Cyberoptics Corporation | High precision component alignment sensor system |
JPH04291795A (ja) * | 1991-03-20 | 1992-10-15 | Matsushita Electric Ind Co Ltd | 電子部品装着装置 |
JPH0618215A (ja) * | 1992-07-01 | 1994-01-25 | Yamaha Motor Co Ltd | 部品装着方法及び装置 |
-
1993
- 1993-12-27 JP JP5331222A patent/JPH07193397A/ja active Pending
-
1994
- 1994-12-23 US US08/363,374 patent/US5566447A/en not_active Expired - Lifetime
- 1994-12-27 EP EP94120727A patent/EP0660657B1/de not_active Expired - Lifetime
- 1994-12-27 DE DE69412772T patent/DE69412772T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0660657B1 (de) | 1998-08-26 |
EP0660657A1 (de) | 1995-06-28 |
US5566447A (en) | 1996-10-22 |
JPH07193397A (ja) | 1995-07-28 |
DE69412772T2 (de) | 1999-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |