DE69412772D1 - Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position - Google Patents

Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position

Info

Publication number
DE69412772D1
DE69412772D1 DE69412772T DE69412772T DE69412772D1 DE 69412772 D1 DE69412772 D1 DE 69412772D1 DE 69412772 T DE69412772 T DE 69412772T DE 69412772 T DE69412772 T DE 69412772T DE 69412772 D1 DE69412772 D1 DE 69412772D1
Authority
DE
Germany
Prior art keywords
assembling
component
specific position
assembly device
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69412772T
Other languages
English (en)
Other versions
DE69412772T2 (de
Inventor
Hiroshi Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Application granted granted Critical
Publication of DE69412772D1 publication Critical patent/DE69412772D1/de
Publication of DE69412772T2 publication Critical patent/DE69412772T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69412772T 1993-12-27 1994-12-27 Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position Expired - Lifetime DE69412772T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5331222A JPH07193397A (ja) 1993-12-27 1993-12-27 実装機の吸着ポイント補正装置

Publications (2)

Publication Number Publication Date
DE69412772D1 true DE69412772D1 (de) 1998-10-01
DE69412772T2 DE69412772T2 (de) 1999-01-14

Family

ID=18241266

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69412772T Expired - Lifetime DE69412772T2 (de) 1993-12-27 1994-12-27 Verfahren und Montagevorrichtung zum Montieren eines Bauelementes auf eine spezifische Position

Country Status (4)

Country Link
US (1) US5566447A (de)
EP (1) EP0660657B1 (de)
JP (1) JPH07193397A (de)
DE (1) DE69412772T2 (de)

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JP4480840B2 (ja) * 2000-03-23 2010-06-16 パナソニック株式会社 部品実装装置、及び部品実装方法
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JP2003031994A (ja) * 2001-07-18 2003-01-31 Juki Corp 電子部品装着方法及び装置
US7043820B2 (en) * 2001-07-27 2006-05-16 Fuji Machine Mfg. Co., Ltd. Electric-component mounting system
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US6874225B2 (en) * 2001-12-18 2005-04-05 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus
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JP3973439B2 (ja) * 2002-02-07 2007-09-12 松下電器産業株式会社 電子部品実装装置及び方法
JP4033705B2 (ja) * 2002-05-08 2008-01-16 富士機械製造株式会社 プリント配線板位置誤差取得方法，プログラムおよび電子回路部品装着システム
DE10228555B4 (de) * 2002-06-26 2004-07-15 Siemens Ag Vorrichtung zum Abholen von IC's von einem Wafer
JP4147923B2 (ja) * 2002-12-03 2008-09-10 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
TW200419640A (en) * 2003-02-25 2004-10-01 Matsushita Electric Ind Co Ltd Electronic component placement machine and electronic component placement method
JP4044017B2 (ja) * 2003-04-22 2008-02-06 松下電器産業株式会社 部品実装装置及びその方法
JP4387745B2 (ja) 2003-09-30 2009-12-24 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
US7706595B2 (en) 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US7630465B2 (en) * 2004-11-23 2009-12-08 Harris Corporation Wireless communications device providing time and frequency-domain channel estimates interpolation and related methods
WO2007033349A1 (en) 2005-09-14 2007-03-22 Cyberoptics Corporation Pick and place machine with improved component pick image processing
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
JP4580972B2 (ja) * 2006-11-09 2010-11-17 パナソニック株式会社 部品実装方法
WO2008115532A1 (en) 2007-03-20 2008-09-25 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
WO2008142744A1 (ja) * 2007-05-09 2008-11-27 Advantest Corporation 部品搬送装置、電子部品試験装置および部品搬送装置の最適距離の認識方法
US8068664B2 (en) * 2007-06-05 2011-11-29 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
US8447430B1 (en) 2010-06-30 2013-05-21 Western Digital Technologies, Inc. Systems and methods for assembly tool calibration verification
US8447551B1 (en) * 2010-06-30 2013-05-21 Western Digital Technologies, Inc. Hard drive assembly tool calibration verification
JP6484335B2 (ja) 2015-06-02 2019-03-13 株式会社Ｆｕｊｉ 部品実装装置及び吸着位置設定方法
DE112015006636T5 (de) * 2015-06-19 2018-03-01 Yamaha Hatsudoki Kabushiki Kaisha Bauteilmontagevorrichtung und Verfahren zur Bauteilmontage
US10175658B2 (en) * 2016-06-29 2019-01-08 GM Global Technology Operations LLC Systems and methods for sensor platform
US10288458B2 (en) 2016-06-29 2019-05-14 GM Global Technology Operations LLC Systems and methods for sensor platform
US11490553B2 (en) * 2018-02-21 2022-11-01 Fuji Corporation Component mounting system and component grasping method
WO2021166133A1 (ja) * 2020-02-19 2021-08-26 株式会社Ｆｕｊｉ 部品実装機

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Also Published As

Publication number Publication date
EP0660657B1 (de) 1998-08-26
EP0660657A1 (de) 1995-06-28
US5566447A (en) 1996-10-22
JPH07193397A (ja) 1995-07-28
DE69412772T2 (de) 1999-01-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition