DE69504269D1 - Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifischen Position - Google Patents

Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifischen Position

Info

Publication number
DE69504269D1
DE69504269D1 DE69504269T DE69504269T DE69504269D1 DE 69504269 D1 DE69504269 D1 DE 69504269D1 DE 69504269 T DE69504269 T DE 69504269T DE 69504269 T DE69504269 T DE 69504269T DE 69504269 D1 DE69504269 D1 DE 69504269D1
Authority
DE
Germany
Prior art keywords
assembling
specific position
specific
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69504269T
Other languages
English (en)
Other versions
DE69504269T2 (de
Inventor
Naoki Hanamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Application granted granted Critical
Publication of DE69504269D1 publication Critical patent/DE69504269D1/de
Publication of DE69504269T2 publication Critical patent/DE69504269T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/044—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53048—Multiple station assembly or disassembly apparatus
    • Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Automatic Assembly (AREA)
DE69504269T 1994-10-19 1995-10-18 Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifischen Position Expired - Fee Related DE69504269T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25381394A JP3222334B2 (ja) 1994-10-19 1994-10-19 表面実装機における認識用ノズル高さ調整方法及び同装置

Publications (2)

Publication Number Publication Date
DE69504269D1 true DE69504269D1 (de) 1998-10-01
DE69504269T2 DE69504269T2 (de) 1999-01-07

Family

ID=17256503

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69504269T Expired - Fee Related DE69504269T2 (de) 1994-10-19 1995-10-18 Verfahren und Vorrichtung zur Montage eines Teils auf einer spezifischen Position

Country Status (4)

Country Link
US (1) US5749142A (de)
EP (1) EP0708587B1 (de)
JP (1) JP3222334B2 (de)
DE (1) DE69504269T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109479393A (zh) * 2016-06-08 2019-03-15 诺信公司 用于将液体或粘性材料分配到基板上的系统和方法

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US6400459B1 (en) 1995-02-24 2002-06-04 Cyberoptics Corp. Methods and apparatus for using optical sensors in component replacement heads
JP3301304B2 (ja) * 1996-03-28 2002-07-15 松下電器産業株式会社 電子部品実装装置および電子部品実装装置におけるノズル交換方法
DE19708464C2 (de) * 1997-02-19 2001-10-04 Hubert Zach Bestückungsvorrichtung zum koplanaren Aufsetzen von Bauelementen auf Leiterplatten
US5953812A (en) * 1997-07-03 1999-09-21 Schlumberger Technologies, Inc. Misinsert sensing in pick and place tooling
JPH11220298A (ja) * 1998-02-02 1999-08-10 Matsushita Electric Ind Co Ltd 電子部品実装方法
DE19840628B4 (de) * 1998-09-05 2005-10-27 Walter Maschinenbau Gmbh Meßverfahren und -vorrichtung
US6587743B1 (en) 1999-01-29 2003-07-01 B P Microsystems, Inc. Pick and place teaching method and apparatus for implementing the same
EP1081998B1 (de) * 1999-09-03 2005-11-30 Matsushita Electric Industrial Co., Ltd. Bauteilen-bestückungsverfahren und Einrichtung
CN1251566C (zh) * 2000-05-23 2006-04-12 西门子公司 用于装夹带有电构件的基底的装置
US6762847B2 (en) 2001-01-22 2004-07-13 Cyberoptics Corporation Laser align sensor with sequencing light sources
US6909515B2 (en) 2001-01-22 2005-06-21 Cyberoptics Corporation Multiple source alignment sensor with improved optics
US7555831B2 (en) * 2001-11-13 2009-07-07 Cyberoptics Corporation Method of validating component feeder exchanges
US7239399B2 (en) * 2001-11-13 2007-07-03 Cyberoptics Corporation Pick and place machine with component placement inspection
US7813559B2 (en) 2001-11-13 2010-10-12 Cyberoptics Corporation Image analysis for pick and place machines with in situ component placement inspection
US7559134B2 (en) * 2003-11-04 2009-07-14 Cyberoptics Corporation Pick and place machine with improved component placement inspection
US7706595B2 (en) * 2003-11-07 2010-04-27 Cyberoptics Corporation Pick and place machine with workpiece motion inspection
US20050125993A1 (en) * 2003-11-07 2005-06-16 Madsen David D. Pick and place machine with improved setup and operation procedure
DE102004008082A1 (de) * 2004-02-19 2005-09-08 Marconi Communications Gmbh Verfahren zum Bestücken eines Schaltungsträgers
US20060016066A1 (en) * 2004-07-21 2006-01-26 Cyberoptics Corporation Pick and place machine with improved inspection
US20060075631A1 (en) * 2004-10-05 2006-04-13 Case Steven K Pick and place machine with improved component pick up inspection
US20070003126A1 (en) * 2005-05-19 2007-01-04 Case Steven K Method and apparatus for evaluating a component pick action in an electronics assembly machine
WO2007015561A1 (en) * 2005-08-02 2007-02-08 Matsushita Electric Industrial Co., Ltd. Electronic component mounter and mounting method
JP4896136B2 (ja) * 2005-09-14 2012-03-14 サイバーオプティクス コーポレーション 改善された構成部品ピックイメージ処理を備えたピックアンドプレース機
JP2009514234A (ja) * 2005-10-31 2009-04-02 サイバーオプティクス コーポレーション 組み込み型半田ペースト検査を備える電子アセンブリマシン
US20070276867A1 (en) * 2006-05-23 2007-11-29 David Fishbaine Embedded inspection image archival for electronics assembly machines
WO2008115532A1 (en) 2007-03-20 2008-09-25 Cyberoptics Corporation Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam
JP4887205B2 (ja) * 2007-04-26 2012-02-29 株式会社日立ハイテクインスツルメンツ 電子部品装着方法及び電子部品装着装置
WO2008153885A1 (en) * 2007-06-05 2008-12-18 Cyberoptics Corporation Component sensor for pick and place machine using improved shadow imaging
JP5059686B2 (ja) * 2008-05-22 2012-10-24 Ｊｕｋｉ株式会社 表面実装装置
NL1036851C2 (nl) * 2009-04-14 2010-10-18 Assembléon B V Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.
JP6016683B2 (ja) * 2013-03-21 2016-10-26 ヤマハ発動機株式会社 電子部品装着装置における装着ヘッドの高さ検出方法及び電子部品装着装置
CN103884292B (zh) * 2014-04-16 2016-09-21 湖南德魅信息技术有限公司 一种用于长期检测的激光发射器支架的安装结构及其安装调试方法
CN106604563B (zh) * 2017-01-24 2019-10-18 深圳市朤科自动化设备有限公司 用于贴片机的机械矫正装置和方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JPS62144392A (ja) * 1985-12-19 1987-06-27 ティーディーケイ株式会社 電子部品実装方法
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
JPH02303100A (ja) * 1989-05-17 1990-12-17 Matsushita Electric Ind Co Ltd 部品装着方法
JPH0618215A (ja) * 1992-07-01 1994-01-25 Yamaha Motor Co Ltd 部品装着方法及び装置
JP2554437B2 (ja) * 1992-08-07 1996-11-13 ヤマハ発動機株式会社 部品装着方法及び同装置
JP3090567B2 (ja) * 1993-12-29 2000-09-25 ヤマハ発動機株式会社 実装機における部品認識方法および同装置
JP3086578B2 (ja) * 1993-12-27 2000-09-11 ヤマハ発動機株式会社 部品装着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109479393A (zh) * 2016-06-08 2019-03-15 诺信公司 用于将液体或粘性材料分配到基板上的系统和方法
CN109479393B (zh) * 2016-06-08 2021-12-28 诺信公司 用于将液体或粘性材料分配到基板上的系统和方法

Also Published As

Publication number Publication date
DE69504269T2 (de) 1999-01-07
EP0708587B1 (de) 1998-08-26
JPH08125389A (ja) 1996-05-17
JP3222334B2 (ja) 2001-10-29
EP0708587A1 (de) 1996-04-24
US5749142A (en) 1998-05-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee