DE69322494D1 - Integrierte Schaltungs-Verpackung - Google Patents

Integrierte Schaltungs-Verpackung

Info

Publication number
DE69322494D1
DE69322494D1 DE69322494T DE69322494T DE69322494D1 DE 69322494 D1 DE69322494 D1 DE 69322494D1 DE 69322494 T DE69322494 T DE 69322494T DE 69322494 T DE69322494 T DE 69322494T DE 69322494 D1 DE69322494 D1 DE 69322494D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit packaging
packaging
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69322494T
Other languages
English (en)
Other versions
DE69322494T2 (de
Inventor
Tadashi Katsui
Katsuhiko Nakata
Takashi Kitahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
PFU Ltd
Original Assignee
Fujitsu Ltd
PFU Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd, PFU Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69322494D1 publication Critical patent/DE69322494D1/de
Publication of DE69322494T2 publication Critical patent/DE69322494T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69322494T 1993-03-19 1993-09-03 Integrierte Schaltungs-Verpackung Expired - Fee Related DE69322494T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5060005A JP2938704B2 (ja) 1993-03-19 1993-03-19 集積回路パッケージ

Publications (2)

Publication Number Publication Date
DE69322494D1 true DE69322494D1 (de) 1999-01-21
DE69322494T2 DE69322494T2 (de) 1999-04-29

Family

ID=13129549

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69322494T Expired - Fee Related DE69322494T2 (de) 1993-03-19 1993-09-03 Integrierte Schaltungs-Verpackung

Country Status (5)

Country Link
US (1) US5629560A (de)
EP (1) EP0620592B1 (de)
JP (1) JP2938704B2 (de)
KR (1) KR940022809A (de)
DE (1) DE69322494T2 (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5484262A (en) * 1992-10-23 1996-01-16 Nidec Corporation Low profile fan body with heat transfer characteristics
DE4427426A1 (de) * 1993-11-05 1995-05-11 Horng Ching Shen Motor mit einer Anordnung zur Wärmeableitung
JP2978730B2 (ja) * 1994-12-27 1999-11-15 日本電気株式会社 半導体装置用ヒートシンク装置
GB2298520B (en) * 1995-03-03 1999-09-08 Hong Chen Fu In Heat sink device for integrated circuit
JP3578825B2 (ja) * 1995-03-17 2004-10-20 富士通株式会社 ヒートシンク
DE29505830U1 (de) * 1995-04-05 1996-08-08 Papst-Motoren GmbH & Co KG, 78112 St Georgen Anordnung zur Kühlung von elektronischen Bauteilen
JPH09149598A (ja) * 1995-11-20 1997-06-06 Seiko Epson Corp 冷却ファンおよび冷却ファン組立体
JPH09172113A (ja) * 1995-12-18 1997-06-30 Nec Corp 半導体装置用ヒートシンク
US5785116A (en) * 1996-02-01 1998-07-28 Hewlett-Packard Company Fan assisted heat sink device
GB2314453B (en) * 1996-06-19 2001-03-14 Hong Chen Fu In Fan assembly for an integrated circuit
JPH10224061A (ja) * 1997-02-10 1998-08-21 Matsushita Electric Ind Co Ltd ヒートシンクユニット及び電子機器
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
JP4290232B2 (ja) 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
US6176299B1 (en) 1999-02-22 2001-01-23 Agilent Technologies, Inc. Cooling apparatus for electronic devices
JP2001118629A (ja) * 1999-10-18 2001-04-27 Jst Mfg Co Ltd コネクタ及びコネクタに装着された電子モジュールの冷却方法
US6702001B2 (en) 2001-08-21 2004-03-09 Agilent Technologies, Inc. Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly
US6664673B2 (en) * 2001-08-27 2003-12-16 Advanced Rotary Systems Llc Cooler for electronic devices
US6739846B2 (en) * 2002-07-24 2004-05-25 Maxxan Systems, Inc. Stacked redundant blowers
US7416388B2 (en) 2003-07-02 2008-08-26 Delta Electronics, Inc. Fan
CN2757508Y (zh) * 2004-12-04 2006-02-08 鸿富锦精密工业（深圳）有限公司 散热装置
US8679674B2 (en) * 2005-03-25 2014-03-25 Front Edge Technology, Inc. Battery with protective packaging
US7846579B2 (en) 2005-03-25 2010-12-07 Victor Krasnov Thin film battery with protective packaging
WO2006112027A1 (ja) 2005-04-15 2006-10-26 Fujitsu Limited ヒートシンク、回路基板、電子機器
CN101008405B (zh) * 2006-01-25 2010-08-11 建准电机工业股份有限公司 散热风扇
US7345884B2 (en) * 2006-03-14 2008-03-18 Sunonwealth Electic Machine Industry Co., Ltd. Heat-dissipating fan
JP2008140802A (ja) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co Ltd ヒートシンク
JP2008140803A (ja) * 2006-11-30 2008-06-19 Fuji Electric Fa Components & Systems Co Ltd ヒートシンク
US20090136839A1 (en) * 2007-11-28 2009-05-28 Front Edge Technology, Inc. Thin film battery comprising stacked battery cells and method
CN102986318B (zh) 2010-04-23 2015-04-15 纳派泰克股份公司 热控制组件
US8488320B2 (en) * 2010-05-26 2013-07-16 Amtek Semiconductors Co., Ltd. Semiconductor package having a cooling fan and method of fabricating the same
US8865340B2 (en) 2011-10-20 2014-10-21 Front Edge Technology Inc. Thin film battery packaging formed by localized heating
KR101918261B1 (ko) * 2011-11-28 2018-11-14 삼성전자주식회사 모바일 장치용 반도체 패키지
US9887429B2 (en) 2011-12-21 2018-02-06 Front Edge Technology Inc. Laminated lithium battery
US8864954B2 (en) 2011-12-23 2014-10-21 Front Edge Technology Inc. Sputtering lithium-containing material with multiple targets
US9077000B2 (en) 2012-03-29 2015-07-07 Front Edge Technology, Inc. Thin film battery and localized heat treatment
US9257695B2 (en) 2012-03-29 2016-02-09 Front Edge Technology, Inc. Localized heat treatment of battery component films
US9159964B2 (en) 2012-09-25 2015-10-13 Front Edge Technology, Inc. Solid state battery having mismatched battery cells
US8753724B2 (en) 2012-09-26 2014-06-17 Front Edge Technology Inc. Plasma deposition on a partially formed battery through a mesh screen
US9356320B2 (en) 2012-10-15 2016-05-31 Front Edge Technology Inc. Lithium battery having low leakage anode
US10008739B2 (en) 2015-02-23 2018-06-26 Front Edge Technology, Inc. Solid-state lithium battery with electrolyte
US20160255746A1 (en) * 2015-02-27 2016-09-01 Laird Technologies, Inc. Heat sinks including heat pipes and related methods
US10957886B2 (en) 2018-03-14 2021-03-23 Front Edge Technology, Inc. Battery having multilayer protective casing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2548124B2 (ja) * 1985-08-29 1996-10-30 松下電器産業株式会社 ヒ−トシンク装置
US4768581A (en) * 1987-04-06 1988-09-06 International Business Machines Corporation Cooling system for semiconductor modules
US4807441A (en) * 1987-07-17 1989-02-28 Allied-Signal Inc. Cooling system for a sealed enclosure
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
US5198889A (en) * 1990-06-30 1993-03-30 Kabushiki Kaisha Toshiba Cooling apparatus
JP2934493B2 (ja) * 1990-10-24 1999-08-16 株式会社日立製作所 電子機器の冷却装置
US5583316A (en) * 1992-08-06 1996-12-10 Pfu Limited Heat-generating element cooling device

Also Published As

Publication number Publication date
US5629560A (en) 1997-05-13
DE69322494T2 (de) 1999-04-29
EP0620592B1 (de) 1998-12-09
KR940022809A (ko) 1994-10-21
JPH06275750A (ja) 1994-09-30
EP0620592A1 (de) 1994-10-19
JP2938704B2 (ja) 1999-08-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee