DE69308755D1 - Verfahren zur Herstellung eines Musters durch Silylierung - Google Patents

Verfahren zur Herstellung eines Musters durch Silylierung

Info

Publication number
DE69308755D1
DE69308755D1 DE69308755T DE69308755T DE69308755D1 DE 69308755 D1 DE69308755 D1 DE 69308755D1 DE 69308755 T DE69308755 T DE 69308755T DE 69308755 T DE69308755 T DE 69308755T DE 69308755 D1 DE69308755 D1 DE 69308755D1
Authority
DE
Germany
Prior art keywords
silylation
pattern
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69308755T
Other languages
English (en)
Other versions
DE69308755T2 (de
Inventor
Cheol-Hong Kim
Woo-Sung Han
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE69308755D1 publication Critical patent/DE69308755D1/de
Application granted granted Critical
Publication of DE69308755T2 publication Critical patent/DE69308755T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
DE69308755T 1992-11-18 1993-11-17 Verfahren zur Herstellung eines Musters durch Silylierung Expired - Fee Related DE69308755T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920021641A KR0170253B1 (ko) 1992-11-18 1992-11-18 실리레이션을 이용한 사진식각방법

Publications (2)

Publication Number Publication Date
DE69308755D1 true DE69308755D1 (de) 1997-04-17
DE69308755T2 DE69308755T2 (de) 1997-06-26

Family

ID=19343325

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69308755T Expired - Fee Related DE69308755T2 (de) 1992-11-18 1993-11-17 Verfahren zur Herstellung eines Musters durch Silylierung

Country Status (6)

Country Link
US (1) US5427649A (de)
EP (1) EP0599539B1 (de)
JP (1) JPH0777809A (de)
KR (1) KR0170253B1 (de)
CN (1) CN1068442C (de)
DE (1) DE69308755T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970002427B1 (en) * 1994-01-14 1997-03-05 Lg Semicon Co Ltd Fine patterning method of photoresist film
WO1996007954A1 (en) * 1994-09-09 1996-03-14 Board Of Supervisors Of Louisiana State University And Agricultural And Mechanical College Microstructures and methods for manufacturing microstructures
US5925494A (en) * 1996-02-16 1999-07-20 Massachusetts Institute Of Technology Vapor deposition of polymer films for photolithography
KR980003848A (ko) * 1996-06-29 1998-03-30 김주용 반도체 장치의 미세패턴 형성방법
US5922516A (en) * 1997-06-04 1999-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Bi-layer silylation process
US5935762A (en) * 1997-10-14 1999-08-10 Industrial Technology Research Institute Two-layered TSI process for dual damascene patterning
US5877076A (en) * 1997-10-14 1999-03-02 Industrial Technology Research Institute Opposed two-layered photoresist process for dual damascene patterning
US5877075A (en) * 1997-10-14 1999-03-02 Industrial Technology Research Institute Dual damascene process using single photoresist process
KR100474544B1 (ko) * 1999-11-12 2005-03-08 주식회사 하이닉스반도체 Ｔｉｐｓ 공정용 포토레지스트 조성물
US6451512B1 (en) 2000-05-01 2002-09-17 Advanced Micro Devices, Inc. UV-enhanced silylation process to increase etch resistance of ultra thin resists
KR100412139B1 (ko) * 2001-12-28 2003-12-31 주식회사 하이닉스반도체 반도체소자의 마스크패턴 형성방법
KR100866122B1 (ko) * 2002-06-29 2008-10-31 주식회사 하이닉스반도체 듀얼 다마신 공정을 이용한 금속배선 형성방법
US20040018450A1 (en) * 2002-07-25 2004-01-29 United Microlectronics Corp. Method for transferring patterns
US6780782B1 (en) * 2003-02-04 2004-08-24 Taiwan Semiconductor Manufacturing Company, Ltd. Bi-level resist structure and fabrication method for contact holes on semiconductor substrates
US7468227B2 (en) * 2004-11-16 2008-12-23 Applied Materials, Inc. Method of reducing the average process bias during production of a reticle
US7309659B1 (en) 2005-04-01 2007-12-18 Advanced Micro Devices, Inc. Silicon-containing resist to pattern organic low k-dielectrics
CN100570485C (zh) * 2006-07-07 2009-12-16 中国科学院半导体研究所 二维纳米结构深刻蚀方法
US8003537B2 (en) * 2006-07-18 2011-08-23 Imec Method for the production of planar structures
CN101452225B (zh) * 2007-12-07 2011-12-07 中芯国际集成电路制造(上海)有限公司 光刻胶掩模图形的显影方法
US8822347B2 (en) * 2009-04-27 2014-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. Wet soluble lithography
US8304179B2 (en) 2009-05-11 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Method for manufacturing a semiconductor device using a modified photosensitive layer
US8647796B2 (en) * 2011-07-27 2014-02-11 Taiwan Semiconductor Manufacturing Company, Ltd. Photoactive compound gradient photoresist
CN103035512B (zh) * 2012-11-02 2015-08-19 上海华虹宏力半导体制造有限公司 一种非感光性聚酰亚胺钝化层的制作方法
CN103839770B (zh) * 2012-11-21 2016-08-17 上海华虹宏力半导体制造有限公司 一种同时在深沟槽底部和顶部形成图形的工艺方法
KR101295251B1 (ko) * 2012-12-04 2013-08-09 주식회사 라온이노텍 투명 디스플레이부 이미지 멀티 증착 방법
CN103871847A (zh) * 2014-03-19 2014-06-18 武汉新芯集成电路制造有限公司 一种干法刻蚀方法
US9741586B2 (en) 2015-06-30 2017-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating package structures
CN115132591B (zh) * 2022-09-02 2022-11-29 盛合晶微半导体(江阴)有限公司 聚酰亚胺过孔及晶圆级半导体封装结构的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262150A (ja) * 1984-06-11 1985-12-25 Nippon Telegr & Teleph Corp <Ntt> 三層レジスト用中間層材料及びそれを用いた三層レジストパタン形成方法
US4782008A (en) * 1985-03-19 1988-11-01 International Business Machines Corporation Plasma-resistant polymeric material, preparation thereof, and use thereof
JPS61231549A (ja) * 1985-04-06 1986-10-15 Oki Electric Ind Co Ltd レジストパタ−ン形成方法
US4751170A (en) * 1985-07-26 1988-06-14 Nippon Telegraph And Telephone Corporation Silylation method onto surface of polymer membrane and pattern formation process by the utilization of silylation method
US4816112A (en) * 1986-10-27 1989-03-28 International Business Machines Corporation Planarization process through silylation
JPH02304922A (ja) * 1989-05-19 1990-12-18 Nec Corp 微細パターンの形成方法
JPH04176123A (ja) * 1990-11-08 1992-06-23 Nec Corp 半導体装置の製造方法
US5286607A (en) * 1991-12-09 1994-02-15 Chartered Semiconductor Manufacturing Pte Ltd. Bi-layer resist process for semiconductor processing
US5270151A (en) * 1992-03-17 1993-12-14 International Business Machines Corporation Spin on oxygen reactive ion etch barrier

Also Published As

Publication number Publication date
US5427649A (en) 1995-06-27
EP0599539B1 (de) 1997-03-12
CN1089369A (zh) 1994-07-13
EP0599539A3 (de) 1995-03-29
DE69308755T2 (de) 1997-06-26
EP0599539A2 (de) 1994-06-01
KR0170253B1 (ko) 1999-03-20
CN1068442C (zh) 2001-07-11
KR940012054A (ko) 1994-06-22
JPH0777809A (ja) 1995-03-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee