DE69308403T2 - Hitzebeständige, negativ-arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat und Verfahren zur Herstellung eines negativen Musters - Google Patents
Hitzebeständige, negativ-arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat und Verfahren zur Herstellung eines negativen MustersInfo
- Publication number
- DE69308403T2 DE69308403T2 DE1993608403 DE69308403T DE69308403T2 DE 69308403 T2 DE69308403 T2 DE 69308403T2 DE 1993608403 DE1993608403 DE 1993608403 DE 69308403 T DE69308403 T DE 69308403T DE 69308403 T2 DE69308403 T2 DE 69308403T2
- Authority
- DE
- Germany
- Prior art keywords
- group
- heat
- negative
- formula
- photoresist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title claims description 46
- 229920002120 photoresistant polymer Polymers 0.000 title claims description 41
- 239000000758 substrate Substances 0.000 title claims description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 23
- 125000004432 carbon atom Chemical group C* 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 238000004090 dissolution Methods 0.000 claims description 15
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 14
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 claims description 14
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 12
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 12
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 9
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 7
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 7
- 239000004305 biphenyl Substances 0.000 claims description 7
- 235000010290 biphenyl Nutrition 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- VCFRAMZVMJTSDM-UHFFFAOYSA-N (1,2,2,3,3,3-hexafluoro-1-phenylpropyl)benzene Chemical compound C=1C=CC=CC=1C(F)(C(F)(F)C(F)(F)F)C1=CC=CC=C1 VCFRAMZVMJTSDM-UHFFFAOYSA-N 0.000 claims description 6
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 claims description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 6
- 239000012965 benzophenone Substances 0.000 claims description 6
- 125000004663 dialkyl amino group Chemical group 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 125000001153 fluoro group Chemical group F* 0.000 claims description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 5
- AJUAJYUOPRGZPK-UHFFFAOYSA-N 1-[5-acetyl-2,6-dimethyl-4-(2-nitrophenyl)-1,4-dihydropyridin-3-yl]ethanone Chemical compound CC(=O)C1=C(C)NC(C)=C(C(C)=O)C1C1=CC=CC=C1[N+]([O-])=O AJUAJYUOPRGZPK-UHFFFAOYSA-N 0.000 claims description 4
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 4
- -1 aliphatic diamine Chemical class 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 4
- 125000000051 benzyloxy group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])O* 0.000 claims description 4
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims description 4
- NQEXCOSTVKCECS-UHFFFAOYSA-N 1-[5-acetyl-4-(2,4-dinitrophenyl)-2,6-dimethyl-1,4-dihydropyridin-3-yl]ethanone Chemical compound CC(=O)C1=C(C)NC(C)=C(C(C)=O)C1C1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O NQEXCOSTVKCECS-UHFFFAOYSA-N 0.000 claims description 3
- AYCFSNOSASPIJM-UHFFFAOYSA-N 2,6-dimethyl-4-(2-nitrophenyl)-1,4-dihydropyridine-3,5-dicarbonitrile Chemical compound N#CC1=C(C)NC(C)=C(C#N)C1C1=CC=CC=C1[N+]([O-])=O AYCFSNOSASPIJM-UHFFFAOYSA-N 0.000 claims description 3
- 239000001273 butane Substances 0.000 claims description 3
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims description 3
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 claims description 3
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 claims description 3
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 3
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 3
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 3
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 3
- VGTGFBRSPOIYFC-UHFFFAOYSA-N 2,4,6-trimethyl-1,4-dihydropyridine-3,5-dicarbonitrile Chemical group CC1C(C#N)=C(C)NC(C)=C1C#N VGTGFBRSPOIYFC-UHFFFAOYSA-N 0.000 claims description 2
- MAUZXJAHIVAEBF-UHFFFAOYSA-N 2,6-dimethyl-1,4-dihydropyridine-3,5-dicarbonitrile Chemical compound CC1=C(C#N)CC(C#N)=C(C)N1 MAUZXJAHIVAEBF-UHFFFAOYSA-N 0.000 claims description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 150000001338 aliphatic hydrocarbons Chemical group 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 description 21
- 239000004642 Polyimide Substances 0.000 description 17
- 239000002243 precursor Substances 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzenecarboxaldehyde Natural products O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 6
- 150000003949 imides Chemical class 0.000 description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 230000004304 visual acuity Effects 0.000 description 3
- YNGDWRXWKFWCJY-UHFFFAOYSA-N 1,4-Dihydropyridine Chemical class C1C=CNC=C1 YNGDWRXWKFWCJY-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 150000007514 bases Chemical class 0.000 description 2
- 150000003935 benzaldehydes Chemical class 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- JJHHIJFTHRNPIK-UHFFFAOYSA-N Diphenyl sulfoxide Chemical compound C=1C=CC=CC=1S(=O)C1=CC=CC=C1 JJHHIJFTHRNPIK-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical group [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical group OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229960000583 acetic acid Drugs 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003637 basic solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000012362 glacial acetic acid Substances 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 150000004992 toluidines Chemical group 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17968592 | 1992-07-07 | ||
| JP04287384A JP3093055B2 (ja) | 1992-07-07 | 1992-10-26 | 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69308403D1 DE69308403D1 (de) | 1997-04-10 |
| DE69308403T2 true DE69308403T2 (de) | 1997-06-12 |
Family
ID=26499462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1993608403 Expired - Lifetime DE69308403T2 (de) | 1992-07-07 | 1993-07-05 | Hitzebeständige, negativ-arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat und Verfahren zur Herstellung eines negativen Musters |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0578177B1 (OSRAM) |
| JP (1) | JP3093055B2 (OSRAM) |
| DE (1) | DE69308403T2 (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06318038A (ja) * | 1993-05-07 | 1994-11-15 | Nitto Denko Corp | 個体識別ラベル |
| JP3709997B2 (ja) * | 1994-03-29 | 2005-10-26 | 日東電工株式会社 | 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法 |
| JPH1039510A (ja) * | 1996-07-29 | 1998-02-13 | Nitto Denko Corp | ネガ型フォトレジスト組成物及びその利用 |
| JP2000112126A (ja) * | 1998-10-01 | 2000-04-21 | Nitto Denko Corp | ネガ型フォトレジスト組成物 |
| JP2002148804A (ja) | 2000-11-08 | 2002-05-22 | Nitto Denko Corp | 感光性樹脂組成物および回路基板 |
| JP4256806B2 (ja) | 2004-03-17 | 2009-04-22 | 日東電工株式会社 | 感光性樹脂組成物とその利用 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2242106A1 (de) * | 1972-08-26 | 1974-03-21 | Agfa Gevaert Ag | Lichtempfindliches photographisches material |
| DE3335309C1 (de) * | 1983-09-29 | 1984-08-16 | Du Pont de Nemours (Deutschland) GmbH, 4000 Düsseldorf | Photographisches Aufzeichnungsverfahren unter Verwendung lichthaertbarer Materialien |
| DE4007236A1 (de) * | 1989-03-20 | 1990-09-27 | Siemens Ag | Lichtempfindliches gemisch |
| DE69222203T2 (de) * | 1991-03-05 | 1998-01-15 | Nitto Denko Corp | Hitzebeständige, positiv arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat, und Verfahren zur Herstellung eines hitzebeständigen positiven Musters |
-
1992
- 1992-10-26 JP JP04287384A patent/JP3093055B2/ja not_active Expired - Lifetime
-
1993
- 1993-07-05 EP EP19930110730 patent/EP0578177B1/en not_active Expired - Lifetime
- 1993-07-05 DE DE1993608403 patent/DE69308403T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0675376A (ja) | 1994-03-18 |
| EP0578177A3 (OSRAM) | 1994-08-03 |
| EP0578177A2 (en) | 1994-01-12 |
| EP0578177B1 (en) | 1997-03-05 |
| JP3093055B2 (ja) | 2000-10-03 |
| DE69308403D1 (de) | 1997-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69704294T2 (de) | Positiv arbeitende, fotoempfindliche Harzzusammensetzung und Halbleiteranordnung mit dieser Zusammensetzung | |
| DE69320567T2 (de) | Polymere Farbstoffe für antireflektierende Schichten | |
| DE69730273T2 (de) | Lichtempfindlicher Polyimid-Vorläufer und seine Verwendung zur Herstellung eines Bildes | |
| EP0103225B1 (de) | Fotolacke zur Ausbildung von Reliefstrukturen aus hochwärmebeständigen Polymeren | |
| EP0138768B1 (de) | Strahlungsempfindliche Polykondensate, Verfahren zu deren Herstellung, beschichtetes Material und dessen Verwendung | |
| US4608333A (en) | Radiation sensitive polymer composition | |
| JP2931143B2 (ja) | 耐熱性ポジ型フォトレジスト組成物およびそれを用いた感光性基材ならびにパターン形成方法 | |
| EP0450189B1 (de) | Hochwärmebeständige Negativresists und Verfahren zur Herstellung hochwärmebeständiger Reliefstrukturen | |
| DE3150054A1 (de) | Licht- oder strahlungsempfindliche polymerzusammensetzungen und ihre verwendung | |
| DE4301446A1 (en) | New light-sensitive di:amino cpds. - for polyamic acid and ester resins used in light-sensitive compsns. | |
| DE2717778B2 (de) | Lichtempfindliches Gemisch | |
| DE69504115T2 (de) | Hitzebeständige, negativ-arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat und Verfahren zur Herstellung eines negativen Musters | |
| EP0182745B1 (de) | Polyimide, Verfahren zu deren Herstellung und deren Verwendung | |
| DE69222203T2 (de) | Hitzebeständige, positiv arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat, und Verfahren zur Herstellung eines hitzebeständigen positiven Musters | |
| DE69308403T2 (de) | Hitzebeständige, negativ-arbeitende Photoresistzusammensetzung, lichtempfindliches Substrat und Verfahren zur Herstellung eines negativen Musters | |
| DE3786628T2 (de) | Hoch molekulare, amphiphile, photoempfindliche Photopolymere und Herstellungsverfahren. | |
| EP0157931B1 (de) | Verfahren zur Herstellung von Polyimidazol- und Polyimidazopyrrolon-Vorstufen | |
| DE69028364T2 (de) | Strahlungsempfindliche Kunststoffzusammensetzung | |
| DE69712580T2 (de) | Photoempfindliche Harzzusammensetzung | |
| EP0143380B1 (de) | Fotoresist-Zusammensetzungen | |
| US5851736A (en) | Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern | |
| DE2143430A1 (de) | Photosensitive Zusammensetzungen und Materialien | |
| EP0113314B1 (de) | In Gegenwart von Sensibilisatoren unter Lichteinwirkung vernetzbare Stoffgemische | |
| EP0274354B1 (de) | Photostrukturierbare Polyimidmischungen, Polyimide auf Basis von Benzhydroltetracarbonsäure und deren Herstellung | |
| DE69715020T2 (de) | Einen arylhydrazofarbstoff enthaltende lichtempfindliche zusammensetzung |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition |