DE69229624D1 - Oberflächenmontierte Induktivität hoher Genauigkeit - Google Patents

Oberflächenmontierte Induktivität hoher Genauigkeit

Info

Publication number
DE69229624D1
DE69229624D1 DE69229624T DE69229624T DE69229624D1 DE 69229624 D1 DE69229624 D1 DE 69229624D1 DE 69229624 T DE69229624 T DE 69229624T DE 69229624 T DE69229624 T DE 69229624T DE 69229624 D1 DE69229624 D1 DE 69229624D1
Authority
DE
Germany
Prior art keywords
inductor
high accuracy
surface mounted
mounted high
accuracy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69229624T
Other languages
English (en)
Other versions
DE69229624T2 (de
Inventor
Barry N Breen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Avx Components Corp
Original Assignee
AVX Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVX Corp filed Critical AVX Corp
Publication of DE69229624D1 publication Critical patent/DE69229624D1/de
Application granted granted Critical
Publication of DE69229624T2 publication Critical patent/DE69229624T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
DE69229624T 1991-12-27 1992-12-08 Oberflächenmontierte Induktivität hoher Genauigkeit Expired - Lifetime DE69229624T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/813,789 US5363080A (en) 1991-12-27 1991-12-27 High accuracy surface mount inductor

Publications (2)

Publication Number Publication Date
DE69229624D1 true DE69229624D1 (de) 1999-08-26
DE69229624T2 DE69229624T2 (de) 2000-03-09

Family

ID=25213400

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69229624T Expired - Lifetime DE69229624T2 (de) 1991-12-27 1992-12-08 Oberflächenmontierte Induktivität hoher Genauigkeit

Country Status (5)

Country Link
US (2) US5363080A (de)
EP (1) EP0551735B1 (de)
JP (1) JPH06290951A (de)
DE (1) DE69229624T2 (de)
DK (1) DK0551735T3 (de)

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US6486530B1 (en) 2000-10-16 2002-11-26 Intarsia Corporation Integration of anodized metal capacitors and high temperature deposition capacitors
US20030042044A1 (en) * 2001-08-30 2003-03-06 Micron Technology, Inc. Circuit board plane interleave apparatus and method
FR2830670A1 (fr) * 2001-10-10 2003-04-11 St Microelectronics Sa Inductance et son procede de fabrication
FR2830683A1 (fr) * 2001-10-10 2003-04-11 St Microelectronics Sa Realisation d'inductance et de via dans un circuit monolithique
FR2839582B1 (fr) * 2002-05-13 2005-03-04 St Microelectronics Sa Inductance a point milieu
JP2005150329A (ja) * 2003-11-14 2005-06-09 Canon Inc 配線構造及びその作製方法
JP2005191408A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd コイル導電体とその製造方法およびこれを用いた電子部品
US7068138B2 (en) * 2004-01-29 2006-06-27 International Business Machines Corporation High Q factor integrated circuit inductor
US7253522B2 (en) * 2004-06-02 2007-08-07 Avx Israel, Ltd. Integrated capacitor for RF applications with Ta adhesion layer
US7262139B2 (en) * 2004-06-02 2007-08-28 Avx Israel, Ltd. Method suitable for batch ion etching of copper
JP2007109934A (ja) * 2005-10-14 2007-04-26 Matsushita Electric Ind Co Ltd 電子部品及びその製造方法
KR100731108B1 (ko) * 2005-12-29 2007-06-22 동부일렉트로닉스 주식회사 반도체 소자의 인덕터 구조 및 그 제조 방법
US20080036566A1 (en) 2006-08-09 2008-02-14 Andrzej Klesyk Electronic Component And Methods Relating To Same
TWM406265U (en) * 2010-10-02 2011-06-21 Domintech Co Ltd Inductance IC chip packaging multi-layer substrate
US8717136B2 (en) 2012-01-10 2014-05-06 International Business Machines Corporation Inductor with laminated yoke
DE102012201847A1 (de) * 2012-02-08 2013-08-08 Würth Elektronik eiSos Gmbh & Co. KG Elektronisches Bauelement
US9064628B2 (en) 2012-05-22 2015-06-23 International Business Machines Corporation Inductor with stacked conductors
KR20140023141A (ko) * 2012-08-17 2014-02-26 삼성전기주식회사 인덕터 및 인덕터 제조방법
SG11201601118WA (en) 2013-09-13 2016-03-30 Resonant Systems Inc Printed-circuit board motor
JP6284797B2 (ja) * 2014-03-20 2018-02-28 新光電気工業株式会社 インダクタ、コイル基板及びコイル基板の製造方法
KR101892689B1 (ko) 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
CN105023736A (zh) * 2015-04-29 2015-11-04 苏州固基电子科技有限公司 一种大功率电感线圈
US10211663B2 (en) * 2015-08-21 2019-02-19 Apple Inc. 3D shaped inductive charging coil and method of making the same
US11749455B2 (en) 2022-01-10 2023-09-05 Bh Electronics, Inc. Methods of fabricating ultra-miniature laminated magnetic cores and devices

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FR2435789A1 (fr) * 1978-09-08 1980-04-04 Frances Andre Inductance imprimee spiralee
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JPS5646510A (en) * 1979-09-25 1981-04-27 Tdk Corp Inductor, inductor assembly, and method of manufacture thereof
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US4626816A (en) * 1986-03-05 1986-12-02 American Technical Ceramics Corp. Multilayer series-connected coil assembly on a wafer and method of manufacture
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JPS6411310A (en) * 1987-07-04 1989-01-13 Toyoda Automatic Loom Works Printed lamination spiral coil
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JP3000579B2 (ja) * 1988-11-07 2000-01-17 株式会社村田製作所 チップコイルの製造方法
JPH02128409A (ja) * 1988-11-08 1990-05-16 Murata Mfg Co Ltd 積層セラミック基板を用いた電磁結合装置
JPH0693589B2 (ja) * 1989-03-23 1994-11-16 株式会社村田製作所 Lcフィルター
US4926292A (en) * 1989-08-09 1990-05-15 Avantek, Inc. Broadband printed spiral

Also Published As

Publication number Publication date
EP0551735B1 (de) 1999-07-21
US5398400A (en) 1995-03-21
JPH06290951A (ja) 1994-10-18
DK0551735T3 (da) 2000-02-21
US5363080A (en) 1994-11-08
EP0551735A1 (de) 1993-07-21
DE69229624T2 (de) 2000-03-09

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