DE69229456T2 - Wärmehärtende Harzzusammensetzungen und ihre Herstellung - Google Patents
Wärmehärtende Harzzusammensetzungen und ihre HerstellungInfo
- Publication number
- DE69229456T2 DE69229456T2 DE69229456T DE69229456T DE69229456T2 DE 69229456 T2 DE69229456 T2 DE 69229456T2 DE 69229456 T DE69229456 T DE 69229456T DE 69229456 T DE69229456 T DE 69229456T DE 69229456 T2 DE69229456 T2 DE 69229456T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- thermosetting resin
- resin compositions
- compositions
- thermosetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9955491 | 1991-04-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69229456D1 DE69229456D1 (de) | 1999-07-29 |
DE69229456T2 true DE69229456T2 (de) | 1999-11-18 |
Family
ID=14250386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69229456T Expired - Lifetime DE69229456T2 (de) | 1991-04-04 | 1992-04-03 | Wärmehärtende Harzzusammensetzungen und ihre Herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5300588A (de) |
EP (1) | EP0507603B1 (de) |
KR (1) | KR100204629B1 (de) |
DE (1) | DE69229456T2 (de) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2669247B2 (ja) * | 1992-02-13 | 1997-10-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
US6143423A (en) * | 1997-04-07 | 2000-11-07 | Shin-Etsu Chemical Co., Ltd. | Flame retardant epoxy resin compositions |
US6057381A (en) * | 1998-07-02 | 2000-05-02 | National Starch And Chemical Investment Holding Corporation | Method of making an electronic component using reworkable underfill encapsulants |
US6063828A (en) * | 1998-07-02 | 2000-05-16 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant compositions for use in electronic devices |
SG82001A1 (en) * | 1998-07-02 | 2001-07-24 | Nat Starch Chem Invest | Method of making an electronic component using reworkable underfill encapsulants |
US6316566B1 (en) * | 1998-07-02 | 2001-11-13 | National Starch And Chemical Investment Holding Corporation | Package encapsulant compositions for use in electronic devices |
US6281314B1 (en) * | 1998-07-02 | 2001-08-28 | National Starch And Chemical Investment Holding Corporation | Compositions for use in the fabrication of circuit components and printed wire boards |
US6376923B1 (en) * | 1999-06-08 | 2002-04-23 | Shin-Etsu Chemical Co., Ltd. | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device |
TWI274771B (en) * | 2003-11-05 | 2007-03-01 | Mitsui Chemicals Inc | Resin composition, prepreg and laminate using the same |
EP1911579A1 (de) * | 2006-10-04 | 2008-04-16 | Shin-Etsu Chemical Co., Ltd. | Epoxidharzzusammensetzung zur Einkapselung einer Halbleitervorrichtung und dünne Halbleitervorrichtung |
JP5685533B2 (ja) * | 2008-08-08 | 2015-03-18 | ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング | 低温硬化組成物 |
KR101252063B1 (ko) | 2011-08-25 | 2013-04-12 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물과 경화물 및 이의 용도 |
CN103906753B (zh) | 2011-11-01 | 2017-02-15 | 韩国生产技术研究院 | 含烷氧基甲硅烷基的异氰脲酸酯环氧化合物、它的制备方法、包括它的组合物、组合物的固化产物和组合物的应用 |
US9902803B2 (en) | 2012-03-14 | 2018-02-27 | Korea Institute Of Industrial Technology | Epoxy compound having alkoxy silyl group, composition comprising same, cured product, use thereof and method for preparing epoxy compound having alkoxy silyl group |
US10689482B2 (en) | 2012-04-02 | 2020-06-23 | Korea Institute Of Industrial Technology | Epoxy compound having alkoxysilyl group, composition and hardened material comprising same, use for same, and production method for epoxy compound having alkoxysilyl group |
KR101863111B1 (ko) | 2012-07-06 | 2018-06-01 | 한국생산기술연구원 | 노볼락계 에폭시 화합물, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도 |
EP2933257B1 (de) * | 2012-09-17 | 2017-07-26 | Korea Institute Of Industrial Technology | Epoxidverbindung mit einer alkoxysilylgruppe, verfahren zur herstellung davon, zusammensetzung damit, gehärtetes produkt daraus und verwendung davon |
WO2017006887A1 (ja) * | 2015-07-06 | 2017-01-12 | 三菱瓦斯化学株式会社 | 樹脂組成物、該樹脂組成物を用いたプリプレグ又はレジンシート並びにそれらを用いた積層板及びプリント配線板 |
CN107735409B (zh) * | 2015-07-06 | 2020-08-11 | 三菱瓦斯化学株式会社 | 树脂组合物、使用该树脂组合物的预浸料或树脂片以及使用它们的层叠板和印刷电路板 |
CN106916267B (zh) * | 2015-12-25 | 2019-06-14 | 广东生益科技股份有限公司 | 一种有机硅改性的酚醛树脂、制备方法及用途 |
KR102232340B1 (ko) | 2019-11-15 | 2021-03-26 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체 |
KR102499841B1 (ko) * | 2020-12-09 | 2023-02-14 | 국도화학 주식회사 | 열경화성 수지 조성물 및 이의 경화물 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH621811A5 (de) * | 1976-06-17 | 1981-02-27 | Ciba Geigy Ag | |
JPS6033720B2 (ja) * | 1979-09-28 | 1985-08-05 | 石川島播磨重工業株式会社 | 航空機主翼部整備用足場装置 |
US4816531A (en) * | 1987-02-05 | 1989-03-28 | Shell Oil Company | Bismaleimide resin composition containing epoxy resin and a phenolic curing agent therefor |
US4962161A (en) * | 1987-08-17 | 1990-10-09 | Hercules Incorporated | Thermosettable resin compositions |
US4902778A (en) * | 1988-02-18 | 1990-02-20 | Basf Aktiengesellschaft | Propenylphenoxy-terminated oligomeric tougheners and their use in toughening thermosetting bismaleimide resin compositions |
JPH0627180B2 (ja) * | 1988-07-05 | 1994-04-13 | 信越化学工業株式会社 | エポキシ樹脂組成物及び半導体装置 |
JPH02189326A (ja) * | 1989-01-18 | 1990-07-25 | Mitsubishi Petrochem Co Ltd | 電子部品封止用エポキシ樹脂組成物 |
KR940010010B1 (ko) * | 1989-06-20 | 1994-10-20 | 닛뽕 가야꾸 가부시기가이샤 | 페놀류 노볼락형 수지, 그 경화물 및 그 제조방법 |
KR950005314B1 (ko) * | 1989-09-11 | 1995-05-23 | 신에쓰 가가꾸 고오교 가부시끼가이샤 | 열경화성 수지 조성물 |
-
1992
- 1992-04-03 US US07/863,271 patent/US5300588A/en not_active Expired - Lifetime
- 1992-04-03 DE DE69229456T patent/DE69229456T2/de not_active Expired - Lifetime
- 1992-04-03 KR KR1019920005566A patent/KR100204629B1/ko not_active IP Right Cessation
- 1992-04-03 EP EP92302949A patent/EP0507603B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5300588A (en) | 1994-04-05 |
EP0507603B1 (de) | 1999-06-23 |
DE69229456D1 (de) | 1999-07-29 |
KR100204629B1 (ko) | 1999-06-15 |
KR920019866A (ko) | 1992-11-20 |
EP0507603A1 (de) | 1992-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |