DE69229455D1 - System zur Bearbeitung lithographischer Informationen - Google Patents
System zur Bearbeitung lithographischer InformationenInfo
- Publication number
- DE69229455D1 DE69229455D1 DE69229455T DE69229455T DE69229455D1 DE 69229455 D1 DE69229455 D1 DE 69229455D1 DE 69229455 T DE69229455 T DE 69229455T DE 69229455 T DE69229455 T DE 69229455T DE 69229455 D1 DE69229455 D1 DE 69229455D1
- Authority
- DE
- Germany
- Prior art keywords
- processing lithographic
- information
- lithographic information
- processing
- lithographic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Control By Computers (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06980091A JP3336436B2 (ja) | 1991-04-02 | 1991-04-02 | リソグラフィシステム、情報収集装置、露光装置、及び半導体デバイス製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69229455D1 true DE69229455D1 (de) | 1999-07-29 |
DE69229455T2 DE69229455T2 (de) | 2000-03-23 |
Family
ID=13413182
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69229455T Expired - Lifetime DE69229455T2 (de) | 1991-04-02 | 1992-04-02 | System zur Bearbeitung lithographischer Informationen |
DE69233098T Expired - Lifetime DE69233098T2 (de) | 1991-04-02 | 1992-04-02 | System zur Bearbeitung lithographischer Informationen |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69233098T Expired - Lifetime DE69233098T2 (de) | 1991-04-02 | 1992-04-02 | System zur Bearbeitung lithographischer Informationen |
Country Status (4)
Country | Link |
---|---|
US (1) | US5243377A (de) |
EP (4) | EP0883030B1 (de) |
JP (1) | JP3336436B2 (de) |
DE (2) | DE69229455T2 (de) |
Families Citing this family (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5393624A (en) * | 1988-07-29 | 1995-02-28 | Tokyo Electron Limited | Method and apparatus for manufacturing a semiconductor device |
SE502083C2 (sv) * | 1991-05-28 | 1995-08-07 | Misomex Ab | Förfarande och anordning för automatiserad exponering av ljuskänsligt material medelst laserljus |
US6078380A (en) * | 1991-10-08 | 2000-06-20 | Nikon Corporation | Projection exposure apparatus and method involving variation and correction of light intensity distributions, detection and control of imaging characteristics, and control of exposure |
US6078381A (en) * | 1993-02-01 | 2000-06-20 | Nikon Corporation | Exposure method and apparatus |
US5471313A (en) * | 1993-02-24 | 1995-11-28 | Xerox Corporation | Method and control system architecture for controlling tone reproduction in a printing device |
JP3456597B2 (ja) * | 1994-04-14 | 2003-10-14 | 株式会社ニコン | 露光装置 |
KR950034648A (ko) * | 1994-05-25 | 1995-12-28 | 김광호 | 반도체장치의 제조방법 |
US5586059A (en) * | 1995-06-07 | 1996-12-17 | Advanced Micro Devices, Inc. | Automated data management system for analysis and control of photolithography stepper performance |
US6215896B1 (en) * | 1995-09-29 | 2001-04-10 | Advanced Micro Devices | System for enabling the real-time detection of focus-related defects |
JP3728015B2 (ja) * | 1996-06-12 | 2005-12-21 | キヤノン株式会社 | 電子ビーム露光システム及びそれを用いたデバイス製造方法 |
TWI249760B (en) * | 1996-07-31 | 2006-02-21 | Canon Kk | Remote maintenance system |
JPH10199784A (ja) * | 1997-01-06 | 1998-07-31 | Mitsubishi Electric Corp | アライメント補正方法及び半導体装置 |
TW376542B (en) * | 1997-03-04 | 1999-12-11 | Canon Kk | Exposure unit, exposure system and device manufacturing method |
US6882403B1 (en) * | 1997-04-07 | 2005-04-19 | Nikon Corporation | Lithography system and method |
US5969972A (en) * | 1997-07-02 | 1999-10-19 | Motorola, Inc. | Method for manufacturing a semiconductor component and automatic machine program generator therefor |
US6407814B1 (en) | 1997-09-26 | 2002-06-18 | Mitsubishi Denki Kabushiki Kaisha | Method for correcting alignment, method for manufacturing a semiconductor device and a semiconductor device |
JPH11102851A (ja) | 1997-09-26 | 1999-04-13 | Mitsubishi Electric Corp | アライメント補正方法及び半導体装置の製造方法 |
JP3193678B2 (ja) * | 1997-10-20 | 2001-07-30 | 株式会社アドバンテスト | 半導体ウエハリペア装置及び方法 |
AU1890699A (en) * | 1998-01-16 | 1999-08-02 | Nikon Corporation | Exposure method and lithography system, exposure apparatus and method of producing the apparatus, and method of producing device |
US6878895B1 (en) * | 1998-06-30 | 2005-04-12 | Advance Micro Devices, Inc. | Reticle sorter |
JP2000049088A (ja) * | 1998-07-29 | 2000-02-18 | Canon Inc | 露光装置およびデバイス製造方法 |
US6466314B1 (en) * | 1998-09-17 | 2002-10-15 | Applied Materials, Inc. | Reticle design inspection system |
JP2000124122A (ja) * | 1998-10-19 | 2000-04-28 | Canon Inc | 半導体露光装置および同装置を用いるデバイス製造方法 |
JP2000173897A (ja) * | 1998-12-08 | 2000-06-23 | Mitsubishi Electric Corp | 露光精度制御方法、装置および記録媒体 |
CN1168024C (zh) * | 2000-02-16 | 2004-09-22 | 西默股份有限公司 | 光刻制版激光器的处理监视系统 |
JP3870002B2 (ja) * | 2000-04-07 | 2007-01-17 | キヤノン株式会社 | 露光装置 |
US6697695B1 (en) * | 2000-04-25 | 2004-02-24 | Komatsu Ltd. | Laser device management system |
JP3728180B2 (ja) * | 2000-06-01 | 2005-12-21 | キヤノン株式会社 | 干渉計搭載ステージ |
JP4759119B2 (ja) * | 2000-08-08 | 2011-08-31 | キヤノン株式会社 | スキャン露光装置およびデバイス製造方法 |
US6673637B2 (en) | 2000-09-20 | 2004-01-06 | Kla-Tencor Technologies | Methods and systems for determining a presence of macro defects and overlay of a specimen |
US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
US7349090B2 (en) | 2000-09-20 | 2008-03-25 | Kla-Tencor Technologies Corp. | Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography |
US6917433B2 (en) | 2000-09-20 | 2005-07-12 | Kla-Tencor Technologies Corp. | Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process |
US7106425B1 (en) | 2000-09-20 | 2006-09-12 | Kla-Tencor Technologies Corp. | Methods and systems for determining a presence of defects and a thin film characteristic of a specimen |
US6782337B2 (en) | 2000-09-20 | 2004-08-24 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension an a presence of defects on a specimen |
JP2002134389A (ja) * | 2000-10-23 | 2002-05-10 | Canon Inc | 露光装置 |
JP2002217095A (ja) * | 2000-11-14 | 2002-08-02 | Canon Inc | 露光装置、半導体デバイス製造方法、半導体製造工場及び露光装置の保守方法並びに位置検出装置 |
JP2002151400A (ja) * | 2000-11-15 | 2002-05-24 | Canon Inc | 露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法及び半導体製造工場 |
JP2002158155A (ja) * | 2000-11-17 | 2002-05-31 | Canon Inc | 露光装置および露光方法 |
JP4574022B2 (ja) * | 2001-01-17 | 2010-11-04 | キヤノン株式会社 | 撮像装置及びシェーディング補正方法 |
JP3559766B2 (ja) * | 2001-02-21 | 2004-09-02 | キヤノン株式会社 | 走査露光装置及び走査露光方法並びにデバイスの製造方法 |
DE10120701A1 (de) | 2001-04-27 | 2002-10-31 | Infineon Technologies Ag | Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern |
EP1256848A3 (de) * | 2001-05-08 | 2003-01-02 | ASML Netherlands B.V. | Optisches Belichtungsverfahren und lithographischer Projektionsapparat |
TWI263120B (en) * | 2001-05-08 | 2006-10-01 | Asml Netherlands Bv | Optical exposure method, device manufacturing method and lithographic projection apparatus |
JP2002334826A (ja) * | 2001-05-09 | 2002-11-22 | Canon Inc | 露光方法、面位置合わせ方法、露光装置及びデバイス製造方法 |
JP2002373839A (ja) * | 2001-06-13 | 2002-12-26 | Canon Inc | 照明装置、露光装置及び露光方法 |
DE10134756A1 (de) | 2001-07-17 | 2003-04-03 | Advanced Micro Devices Inc | Ein System und Verfahren zur gesteuerten Strukturierung auf Waferbasis von Strukturelementen mit kritischen Dimensionen |
DE10145187B4 (de) * | 2001-09-13 | 2011-01-05 | Infineon Technologies Ag | Verfahren zur Bewertung der Güte und Eignung von Waferspannvorrichtungen |
DE10145186A1 (de) * | 2001-09-13 | 2003-04-10 | Infineon Technologies Ag | Verfahren zur Überwachung von Manipulationen von Operatoren an Belichtungsanlagen in der Fotolithografie der Halbleiterfertigung |
JP2003100599A (ja) * | 2001-09-25 | 2003-04-04 | Nikon Corp | 露光装置の調整方法及び露光システム |
TWI225665B (en) * | 2001-10-17 | 2004-12-21 | Canon Kk | Apparatus control system, apparatus control method, semiconductor exposure apparatus, semiconductor exposure apparatus control method and semiconductor device manufacturing method |
JP3886820B2 (ja) * | 2002-02-14 | 2007-02-28 | 株式会社東芝 | 露光装置の事前引当システム、露光装置の事前引当方法、及び露光装置の事前引当プログラム |
JP4261810B2 (ja) * | 2002-03-18 | 2009-04-30 | キヤノン株式会社 | 露光装置、デバイス製造方法 |
JP2003288496A (ja) * | 2002-03-27 | 2003-10-10 | Toshiba Corp | 描画支援システム、描画支援方法、マスク製造支援システム、及びマスク製造支援方法 |
JP4018438B2 (ja) | 2002-04-30 | 2007-12-05 | キヤノン株式会社 | 半導体露光装置を管理する管理システム |
US7069104B2 (en) * | 2002-04-30 | 2006-06-27 | Canon Kabushiki Kaisha | Management system, management apparatus, management method, and device manufacturing method |
JP4353498B2 (ja) | 2002-04-30 | 2009-10-28 | キヤノン株式会社 | 管理装置及び方法、デバイス製造方法、並びにコンピュータプログラム |
JP2003324055A (ja) * | 2002-04-30 | 2003-11-14 | Canon Inc | 管理システム及び装置及び方法並びに露光装置及びその制御方法 |
KR100545297B1 (ko) * | 2002-06-12 | 2006-01-24 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피장치 및 디바이스 제조방법 |
JP2004071978A (ja) | 2002-08-08 | 2004-03-04 | Toshiba Corp | 露光装置の管理方法、マスクの管理方法、露光方法、および半導体装置の製造方法 |
DE10307454B4 (de) * | 2003-02-21 | 2010-10-28 | Vistec Semiconductor Systems Gmbh | Verfahren zur optischen Inspektion eines Halbleitersubstrats |
JP2005057294A (ja) | 2003-08-07 | 2005-03-03 | Asml Netherlands Bv | インタフェースユニット、該インタフェースユニットを含むリソグラフィ投影装置、及びデバイス製造方法 |
US6898471B1 (en) | 2003-12-31 | 2005-05-24 | Taiwan Semiconductor Manufacturing Company | Multivariate RBR tool aging adjuster |
CN1969370A (zh) | 2004-04-28 | 2007-05-23 | 尼康股份有限公司 | 解析方法、曝光装置及曝光装置系统 |
US7042552B1 (en) * | 2004-11-17 | 2006-05-09 | Asml Netherlands B.V. | Alignment strategy optimization method |
US7283198B2 (en) * | 2004-11-30 | 2007-10-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle thermal detector |
US20070219664A1 (en) * | 2004-11-30 | 2007-09-20 | Nikon Corporation | Device Processing System, Information Display Method, Program, and Recording Medium |
US7126669B2 (en) * | 2004-12-27 | 2006-10-24 | Asml Netherlands B.V. | Method and system for automated process correction using model parameters, and lithographic apparatus using such method and system |
EP1879217A4 (de) | 2005-03-18 | 2010-06-09 | Nikon Corp | Belichtungsverfahren, belichtungsvorrichtung, bauelementeherstellungsverfahren und belichtungsvorrichtungs-evaluierungsverfahren |
JP2007103752A (ja) * | 2005-10-06 | 2007-04-19 | Nikon Corp | オブジェクトデータのデータ構造、情報処理方法、基板処理方法及び装置、表示方法、並びにプログラム |
US7460922B1 (en) * | 2005-12-07 | 2008-12-02 | Advanced Micro Devices, Inc. | Scanner optimization for reduced across-chip performance variation through non-contact electrical metrology |
EP1804121A1 (de) * | 2005-12-29 | 2007-07-04 | Interuniversitair Microelektronica Centrum | Verfahren und Systeme zur Optimierung eines lithographischen Immersionsverfahrens |
WO2007086511A1 (ja) * | 2006-01-30 | 2007-08-02 | Nikon Corporation | 処理条件決定方法及び装置、表示方法及び装置、処理装置、測定装置及び露光装置、基板処理システム、並びにプログラム及び情報記録媒体 |
US7541714B2 (en) * | 2006-04-05 | 2009-06-02 | General Electric Company | Streamlined body wedge blocks and method for enhanced cooling of generator rotor |
EP1921502B1 (de) * | 2006-11-08 | 2011-02-02 | Integrated Dynamics Engineering GmbH | Kombiniertes Motion-Control-System |
KR100856579B1 (ko) * | 2007-01-18 | 2008-09-04 | 홍운식 | 웨이퍼의 노광 에너지 정보를 축적하는 시스템에 의해 누적된 웨이퍼의 노광 에너지 정보를 이용한 노광용 마스크의 관리방법 |
IL210832A (en) * | 2010-02-19 | 2016-11-30 | Asml Netherlands Bv | Lithographic facility and method of manufacturing facility |
EP2700081B1 (de) | 2011-04-22 | 2022-11-02 | ASML Netherlands B.V. | Netzwerkarchitektur und protokoll für einen cluster von lithografiegeräten |
CN103186052B (zh) * | 2011-12-28 | 2015-04-22 | 无锡华润上华科技有限公司 | 一种光刻参数优化方法 |
JP2014041211A (ja) * | 2012-08-21 | 2014-03-06 | Canon Inc | 露光システム、露光装置、それを用いたデバイスの製造方法 |
KR101465499B1 (ko) * | 2013-08-13 | 2014-11-26 | (주)시스윈일렉트로닉스 | 반도체 센서 모듈 및 데이지 체인 연결에 의한 패킷 전송 장치 |
JP6337757B2 (ja) | 2014-01-20 | 2018-06-06 | 東京エレクトロン株式会社 | 露光装置、レジストパターン形成方法及び記憶媒体 |
US10707107B2 (en) | 2015-12-16 | 2020-07-07 | Kla-Tencor Corporation | Adaptive alignment methods and systems |
US11106145B2 (en) * | 2016-10-17 | 2021-08-31 | Nikon Corporation | Exposure system and lithography system |
CN112384859B (zh) * | 2018-08-08 | 2023-11-21 | 极光先进雷射株式会社 | 光刻系统的维护管理方法、维护管理装置和计算机可读介质 |
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1991
- 1991-04-02 JP JP06980091A patent/JP3336436B2/ja not_active Expired - Lifetime
-
1992
- 1992-03-31 US US07/861,034 patent/US5243377A/en not_active Expired - Lifetime
- 1992-04-02 EP EP98111430A patent/EP0883030B1/de not_active Expired - Lifetime
- 1992-04-02 DE DE69229455T patent/DE69229455T2/de not_active Expired - Lifetime
- 1992-04-02 EP EP02018326A patent/EP1262833A1/de not_active Withdrawn
- 1992-04-02 EP EP02018327A patent/EP1262834A1/de not_active Withdrawn
- 1992-04-02 DE DE69233098T patent/DE69233098T2/de not_active Expired - Lifetime
- 1992-04-02 EP EP92302922A patent/EP0507589B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5243377A (en) | 1993-09-07 |
JPH04305913A (ja) | 1992-10-28 |
DE69233098T2 (de) | 2003-12-04 |
EP0507589A2 (de) | 1992-10-07 |
DE69233098D1 (de) | 2003-07-17 |
EP0883030A3 (de) | 1998-12-16 |
EP0507589A3 (de) | 1992-12-02 |
JP3336436B2 (ja) | 2002-10-21 |
EP1262834A1 (de) | 2002-12-04 |
EP1262833A1 (de) | 2002-12-04 |
EP0883030B1 (de) | 2003-06-11 |
DE69229455T2 (de) | 2000-03-23 |
EP0507589B1 (de) | 1999-06-23 |
EP0883030A2 (de) | 1998-12-09 |
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