DE69228014D1 - Einheit zum luftdichten Aufbewahren von Halbleiterscheiben - Google Patents

Einheit zum luftdichten Aufbewahren von Halbleiterscheiben

Info

Publication number
DE69228014D1
DE69228014D1 DE69228014T DE69228014T DE69228014D1 DE 69228014 D1 DE69228014 D1 DE 69228014D1 DE 69228014 T DE69228014 T DE 69228014T DE 69228014 T DE69228014 T DE 69228014T DE 69228014 D1 DE69228014 D1 DE 69228014D1
Authority
DE
Germany
Prior art keywords
unit
semiconductor wafers
airtight storage
airtight
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69228014T
Other languages
English (en)
Other versions
DE69228014T2 (de
Inventor
Teppei Yamashita
Masanao Murata
Tsuyoshi Tanaka
Teruya Morita
Hitoshi Kawano
Atsushi Okuno
Masanori Tsuda
Mitsuhiro Hayashi
Hiromi Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asyst Shinko Inc
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP940191A external-priority patent/JPH07106406A/ja
Priority claimed from JP940491A external-priority patent/JP2969976B2/ja
Priority claimed from JP3269781A external-priority patent/JP3067325B2/ja
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of DE69228014D1 publication Critical patent/DE69228014D1/de
Application granted granted Critical
Publication of DE69228014T2 publication Critical patent/DE69228014T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69228014T 1991-01-29 1992-01-28 Einheit zum luftdichten Aufbewahren von Halbleiterscheiben Expired - Fee Related DE69228014T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP940191A JPH07106406A (ja) 1991-01-29 1991-01-29 ウエハ保管設備
JP940491A JP2969976B2 (ja) 1991-01-29 1991-01-29 ウエハ保管棚
JP3269781A JP3067325B2 (ja) 1991-10-17 1991-10-17 クリーンルーム用気密ストッカー

Publications (2)

Publication Number Publication Date
DE69228014D1 true DE69228014D1 (de) 1999-02-11
DE69228014T2 DE69228014T2 (de) 1999-05-27

Family

ID=27278468

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69228014T Expired - Fee Related DE69228014T2 (de) 1991-01-29 1992-01-28 Einheit zum luftdichten Aufbewahren von Halbleiterscheiben

Country Status (3)

Country Link
US (1) US5303482A (de)
EP (1) EP0497281B1 (de)
DE (1) DE69228014T2 (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
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KR100304127B1 (ko) * 1992-07-29 2001-11-30 이노마다 시게오 가반식 밀폐 컨테이너를 사용한 전자기판 처리시스템과 그의 장치
US5551165A (en) * 1995-04-13 1996-09-03 Texas Instruments Incorporated Enhanced cleansing process for wafer handling implements
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
JPH09153533A (ja) * 1995-12-01 1997-06-10 Mitsubishi Electric Corp 半導体ウエハ保管システムおよびそのシステムを使用した半導体装置の製造方式
US5628121A (en) * 1995-12-01 1997-05-13 Convey, Inc. Method and apparatus for maintaining sensitive articles in a contaminant-free environment
EP0797241A3 (de) 1996-03-08 2002-05-15 Kokusai Electric Co., Ltd. Vorrichtung zur Bearbeitung von Substraten
US6098304A (en) * 1996-07-26 2000-08-08 Advanced Micro Devices, Inc. Apparatus for reducing delamination within a polycide structure
US6096100A (en) * 1997-12-12 2000-08-01 Texas Instruments Incorporated Method for processing wafers and cleaning wafer-handling implements
JP2968742B2 (ja) 1997-01-24 1999-11-02 山形日本電気株式会社 自動保管棚及び自動保管方法
KR100574140B1 (ko) * 1999-07-02 2006-04-25 동경 엘렉트론 주식회사 반도체 제조 설비, 반도체 제조 장치 및 반도체 제조 방법
US6662225B1 (en) * 1999-11-16 2003-12-09 Ricoh Company, Ltd. Remote system usage monitoring with flexible packaging of data
US7032614B2 (en) 2000-11-03 2006-04-25 Applied Materials, Inc. Facilities connection box for pre-facilitation of wafer fabrication equipment
US7184855B2 (en) 2002-03-13 2007-02-27 Stingel Iii Frederick J Automated container storage and delivery system
US6729836B2 (en) * 2002-03-13 2004-05-04 Stingel, Iii Frederick J. Automated container storage and delivery system
US6871116B2 (en) * 2002-10-17 2005-03-22 Vertique, Inc. Determining pallet case configurations for placement by a robot
KR100486690B1 (ko) * 2002-11-29 2005-05-03 삼성전자주식회사 기판 이송 모듈의 오염을 제어할 수 있는 기판 처리 장치및 방법
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
DE102006028057B4 (de) * 2005-10-17 2017-07-20 Dynamic Microsystems Semiconductor Equipment Gmbh Vorrichtung zum Lagern von kontaminationsempfindlichen, plattenförmigen Gegenständen, insbesondere zum Lagern von Halbleiterwafern
US8322299B2 (en) * 2006-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Co., Ltd. Cluster processing apparatus for metallization processing in semiconductor manufacturing
WO2007149513A2 (en) * 2006-06-19 2007-12-27 Entegris, Inc. System for purging reticle storage
JP4904995B2 (ja) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 ロードポート装置
KR101494024B1 (ko) * 2007-02-28 2015-02-16 엔테그리스, 아이엔씨. 기판 컨테이너를 위한 퍼지 시스템
US9177843B2 (en) 2007-06-06 2015-11-03 Taiwan Semiconductor Manufacturing Company, Ltd. Preventing contamination in integrated circuit manufacturing lines
CH699754B1 (de) * 2008-10-20 2020-11-13 Tec Sem Ag Speichervorrichtung für eine Zwischenlagerung von Objekten für die Produktion von Halbleiterbauelementen
JP5398595B2 (ja) * 2010-03-04 2014-01-29 東京エレクトロン株式会社 基板収納装置
RU2576737C2 (ru) * 2011-11-10 2016-03-10 Халлибертон Энерджи Сервисез, Инк. Создающая вращательное движение система регулируемого сопротивления потоку, содержащая боковой выпуск для текучей среды, а также способ использования такой системы в подземных формациях
JP5720954B2 (ja) * 2012-03-06 2015-05-20 株式会社ダイフク 天井搬送車の清掃装置
JP6044467B2 (ja) * 2013-06-26 2016-12-14 株式会社ダイフク 保管システム
TWI749397B (zh) * 2013-12-13 2021-12-11 日商昕芙旎雅股份有限公司 設備前端模組（ｅｆｅｍ）及半導體製造裝置
JP6511858B2 (ja) * 2015-02-27 2019-05-15 シンフォニアテクノロジー株式会社 搬送室
KR20170133694A (ko) * 2016-05-26 2017-12-06 세메스 주식회사 유체 공급 유닛, 이를 가지는 기판 처리 장치 및 방법
IT201600078030A1 (it) * 2016-07-26 2018-01-26 I M A Industria Macch Automatiche S P A In Sigla Ima S P A Gruppo di ventilazione per camere a contaminazione controllata
CN106081458B (zh) * 2016-08-05 2018-09-25 刘壮志 Dna血样存储管理系统
CN106871316B (zh) * 2017-01-22 2019-05-07 中联西北工程设计研究院有限公司 一种高大洁净空间的送风系统
CN108459423B (zh) * 2017-02-21 2020-05-12 合肥鑫晟光电科技有限公司 缓存装置和液晶屏生产线
CN107062848A (zh) * 2017-06-08 2017-08-18 福建省将乐县长兴电子有限公司 一种用于晶振生产的烘干装置
US10566216B2 (en) * 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
JP2019047042A (ja) * 2017-09-05 2019-03-22 東芝メモリ株式会社 半導体製造装置
KR102139249B1 (ko) * 2018-04-03 2020-07-29 우범제 이에프이엠
CN111174283B (zh) * 2018-10-24 2022-01-21 青岛海尔空调器有限总公司 一种可移动的空调、空调集群及智能家居系统
US11189511B2 (en) * 2018-10-26 2021-11-30 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating EFEMs
CN112345785B (zh) * 2020-10-23 2022-08-02 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶圆转速检测装置
CN115962630B (zh) * 2022-12-28 2023-12-01 无锡亚电智能装备有限公司 一种石墨舟沥干槽

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5939019A (ja) * 1982-08-27 1984-03-03 Hitachi Ltd クリ−ン保管箱
JPS6044404A (ja) * 1983-08-17 1985-03-09 Daifuku Co Ltd クリ−ンル−ム内の荷保管設備
JPH067566B2 (ja) * 1983-09-28 1994-01-26 ヒューレット・パッカード・カンパニー 集積回路処理装置
US4986715A (en) * 1988-07-13 1991-01-22 Tokyo Electron Limited Stock unit for storing carriers

Also Published As

Publication number Publication date
US5303482A (en) 1994-04-19
EP0497281B1 (de) 1998-12-30
EP0497281A3 (en) 1994-07-27
EP0497281A2 (de) 1992-08-05
DE69228014T2 (de) 1999-05-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ASYST SHINKO, INC., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee