DE69227856D1 - Halbleitervorrichtung mit niedrigen thermischen Spannungen - Google Patents
Halbleitervorrichtung mit niedrigen thermischen SpannungenInfo
- Publication number
- DE69227856D1 DE69227856D1 DE69227856T DE69227856T DE69227856D1 DE 69227856 D1 DE69227856 D1 DE 69227856D1 DE 69227856 T DE69227856 T DE 69227856T DE 69227856 T DE69227856 T DE 69227856T DE 69227856 D1 DE69227856 D1 DE 69227856D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- thermal stress
- low thermal
- stress semiconductor
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 230000008646 thermal stress Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/681,608 US5173764A (en) | 1991-04-08 | 1991-04-08 | Semiconductor device having a particular lid means and encapsulant to reduce die stress |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69227856D1 true DE69227856D1 (de) | 1999-01-28 |
Family
ID=24736025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69227856T Expired - Lifetime DE69227856D1 (de) | 1991-04-08 | 1992-03-30 | Halbleitervorrichtung mit niedrigen thermischen Spannungen |
Country Status (5)
Country | Link |
---|---|
US (1) | US5173764A (de) |
EP (1) | EP0508266B1 (de) |
JP (1) | JP3171652B2 (de) |
KR (1) | KR920020653A (de) |
DE (1) | DE69227856D1 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5319242A (en) * | 1992-03-18 | 1994-06-07 | Motorola, Inc. | Semiconductor package having an exposed die surface |
US5249101A (en) * | 1992-07-06 | 1993-09-28 | International Business Machines Corporation | Chip carrier with protective coating for circuitized surface |
JP2670408B2 (ja) * | 1992-10-27 | 1997-10-29 | 株式会社東芝 | 樹脂封止型半導体装置及びその製造方法 |
US5339216A (en) * | 1993-03-02 | 1994-08-16 | National Semiconductor Corporation | Device and method for reducing thermal cycling in a semiconductor package |
US5834339A (en) | 1996-03-07 | 1998-11-10 | Tessera, Inc. | Methods for providing void-free layers for semiconductor assemblies |
JPH0831988A (ja) * | 1994-07-20 | 1996-02-02 | Nec Corp | テープキャリアパッケージの封止構造 |
US6002181A (en) * | 1994-11-08 | 1999-12-14 | Oki Electric Industry Co., Ltd. | Structure of resin molded type semiconductor device with embedded thermal dissipator |
US5866953A (en) | 1996-05-24 | 1999-02-02 | Micron Technology, Inc. | Packaged die on PCB with heat sink encapsulant |
US6252302B1 (en) * | 1996-09-19 | 2001-06-26 | Warren M. Farnworth | Heat transfer material for an improved die edge contacting socket |
EP1447849A3 (de) * | 1997-03-10 | 2005-07-20 | Seiko Epson Corporation | Halbleiterbauelement und mit demselben versehene Leiterplatte |
US7233056B1 (en) * | 1998-02-23 | 2007-06-19 | Micron Technology, Inc. | Chip scale package with heat spreader |
US6314639B1 (en) | 1998-02-23 | 2001-11-13 | Micron Technology, Inc. | Chip scale package with heat spreader and method of manufacture |
US6297960B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Heat sink with alignment and retaining features |
US6297548B1 (en) * | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
US6326687B1 (en) * | 1998-09-01 | 2001-12-04 | Micron Technology, Inc. | IC package with dual heat spreaders |
US6117797A (en) | 1998-09-03 | 2000-09-12 | Micron Technology, Inc. | Attachment method for heat sinks and devices involving removal of misplaced encapsulant |
FR2788882A1 (fr) * | 1999-01-27 | 2000-07-28 | Schlumberger Systems & Service | Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif |
US6570245B1 (en) | 2000-03-09 | 2003-05-27 | Intel Corporation | Stress shield for microelectronic dice |
JP3727587B2 (ja) * | 2001-12-28 | 2005-12-14 | シャープ株式会社 | 半導体装置の実装方法 |
US8067823B2 (en) * | 2004-11-15 | 2011-11-29 | Stats Chippac, Ltd. | Chip scale package having flip chip interconnect on die paddle |
JP4548264B2 (ja) * | 2005-08-01 | 2010-09-22 | 株式会社デンソー | 車両用交流発電機 |
US8502371B2 (en) * | 2007-12-27 | 2013-08-06 | Stats Chippac Ltd. | Integrated circuit package system with extended corner leads |
SG142321A1 (en) * | 2008-04-24 | 2009-11-26 | Micron Technology Inc | Pre-encapsulated cavity interposer |
US8072047B2 (en) * | 2008-05-21 | 2011-12-06 | Stats Chippac Ltd. | Integrated circuit package system with shield and tie bar |
US20100110656A1 (en) | 2008-10-31 | 2010-05-06 | Advanced Semiconductor Engineering, Inc. | Chip package and manufacturing method thereof |
TWI540698B (zh) | 2010-08-02 | 2016-07-01 | 日月光半導體製造股份有限公司 | 半導體封裝件與其製造方法 |
US8704341B2 (en) | 2012-05-15 | 2014-04-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor packages with thermal dissipation structures and EMI shielding |
US8653634B2 (en) | 2012-06-11 | 2014-02-18 | Advanced Semiconductor Engineering, Inc. | EMI-shielded semiconductor devices and methods of making |
US8815725B2 (en) | 2013-01-18 | 2014-08-26 | International Business Machines Corporation | Low alpha particle emission electrically-conductive coating |
US9824995B2 (en) | 2014-09-29 | 2017-11-21 | Nxp Usa, Inc. | Flexible circuit leads in packaging for radio frequency devices |
JP7264391B2 (ja) * | 2018-07-11 | 2023-04-25 | 北川工業株式会社 | 熱伝導組成物 |
US10643957B2 (en) | 2018-08-27 | 2020-05-05 | Nxp B.V. | Conformal dummy die |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4177480A (en) * | 1975-10-02 | 1979-12-04 | Licentia Patent-Verwaltungs-G.M.B.H. | Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads |
JPS5588356A (en) * | 1978-12-27 | 1980-07-04 | Hitachi Ltd | Semiconductor device |
US4712129A (en) * | 1983-12-12 | 1987-12-08 | Texas Instruments Incorporated | Integrated circuit device with textured bar cover |
JPS61248541A (ja) * | 1985-04-26 | 1986-11-05 | Matsushita Electronics Corp | 半導体装置 |
JPS63302542A (ja) * | 1987-06-02 | 1988-12-09 | Seiko Epson Corp | 半導体装置 |
JPS63302543A (ja) * | 1987-06-02 | 1988-12-09 | Seiko Epson Corp | 半導体装置 |
JPH0740031B2 (ja) * | 1987-09-11 | 1995-05-01 | 株式会社シノテスト | 免疫学的測定方法 |
-
1991
- 1991-04-08 US US07/681,608 patent/US5173764A/en not_active Expired - Lifetime
-
1992
- 1992-03-30 DE DE69227856T patent/DE69227856D1/de not_active Expired - Lifetime
- 1992-03-30 EP EP92105454A patent/EP0508266B1/de not_active Expired - Lifetime
- 1992-04-07 JP JP11319292A patent/JP3171652B2/ja not_active Expired - Fee Related
- 1992-04-08 KR KR1019920005805A patent/KR920020653A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US5173764A (en) | 1992-12-22 |
JP3171652B2 (ja) | 2001-05-28 |
EP0508266A1 (de) | 1992-10-14 |
KR920020653A (ko) | 1992-11-21 |
EP0508266B1 (de) | 1998-12-16 |
JPH05129456A (ja) | 1993-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |