DE69225674D1 - Mit Säuberungskanälen versehene Wannen zum Einfügen von Chipkondensatoren auf Halbleiterpackungen - Google Patents

Mit Säuberungskanälen versehene Wannen zum Einfügen von Chipkondensatoren auf Halbleiterpackungen

Info

Publication number
DE69225674D1
DE69225674D1 DE69225674T DE69225674T DE69225674D1 DE 69225674 D1 DE69225674 D1 DE 69225674D1 DE 69225674 T DE69225674 T DE 69225674T DE 69225674 T DE69225674 T DE 69225674T DE 69225674 D1 DE69225674 D1 DE 69225674D1
Authority
DE
Germany
Prior art keywords
semiconductor packages
chip capacitors
cleaning channels
troughs provided
inserting chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69225674T
Other languages
English (en)
Inventor
Tom Ley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LSI Corp
Original Assignee
LSI Logic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LSI Logic Corp filed Critical LSI Logic Corp
Application granted granted Critical
Publication of DE69225674D1 publication Critical patent/DE69225674D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
DE69225674T 1991-08-22 1992-08-21 Mit Säuberungskanälen versehene Wannen zum Einfügen von Chipkondensatoren auf Halbleiterpackungen Expired - Lifetime DE69225674D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/749,128 US5210683A (en) 1991-08-22 1991-08-22 Recessed chip capacitor wells with cleaning channels on integrated circuit packages

Publications (1)

Publication Number Publication Date
DE69225674D1 true DE69225674D1 (de) 1998-07-02

Family

ID=25012381

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69225674T Expired - Lifetime DE69225674D1 (de) 1991-08-22 1992-08-21 Mit Säuberungskanälen versehene Wannen zum Einfügen von Chipkondensatoren auf Halbleiterpackungen

Country Status (4)

Country Link
US (1) US5210683A (de)
EP (1) EP0541914B1 (de)
JP (1) JPH06204354A (de)
DE (1) DE69225674D1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5375035A (en) * 1993-03-22 1994-12-20 Compaq Computer Corporation Capacitor mounting structure for printed circuit boards
JP2943048B2 (ja) * 1994-08-06 1999-08-30 日本山村硝子株式会社 合成樹脂製ピルファープルーフキャップ
US5608261A (en) * 1994-12-28 1997-03-04 Intel Corporation High performance and high capacitance package with improved thermal dissipation
US5831810A (en) * 1996-08-21 1998-11-03 International Business Machines Corporation Electronic component package with decoupling capacitors completely within die receiving cavity of substrate
US6228682B1 (en) 1999-12-21 2001-05-08 International Business Machines Corporation Multi-cavity substrate structure for discrete devices
US20070164378A1 (en) * 2006-01-13 2007-07-19 Honeywell International Inc. Integrated mems package
US7452750B2 (en) * 2006-02-28 2008-11-18 Freescale Semiconductor, Inc Capacitor attachment method
US9902006B2 (en) 2014-07-25 2018-02-27 Raytheon Company Apparatus for cleaning an electronic circuit board
US20170086298A1 (en) * 2015-09-23 2017-03-23 Tin Poay Chuah Substrate including structures to couple a capacitor to a packaged device and method of making same
US9972553B1 (en) * 2016-01-06 2018-05-15 National Technology & Engineering Solutions Of Sandia, Llc Packaging system with cleaning channel and method of making the same
CN106376178A (zh) * 2016-09-09 2017-02-01 青岛海信电器股份有限公司 终端设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2536957C2 (de) * 1975-08-20 1983-05-11 Philips Patentverwaltung Gmbh, 2000 Hamburg Elektronisches Bauelement
US4705917A (en) * 1985-08-27 1987-11-10 Hughes Aircraft Company Microelectronic package
FR2616963B1 (fr) * 1987-06-19 1991-02-08 Thomson Composants Militaires Boitier ceramique multicouches
JPS6457789A (en) * 1987-08-28 1989-03-06 Mitsubishi Electric Corp Electronic component mounting structure
US4972253A (en) * 1988-06-27 1990-11-20 Digital Equipment Corporation Programmable ceramic high performance custom package
US4965702A (en) * 1989-06-19 1990-10-23 E. I. Du Pont De Nemours And Company Chip carrier package and method of manufacture
US5031069A (en) * 1989-12-28 1991-07-09 Sundstrand Corporation Integration of ceramic capacitor

Also Published As

Publication number Publication date
EP0541914A1 (de) 1993-05-19
US5210683A (en) 1993-05-11
EP0541914B1 (de) 1998-05-27
JPH06204354A (ja) 1994-07-22

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Legal Events

Date Code Title Description
8332 No legal effect for de