DE69224694T2 - Polyhydrisches Phenol und damit hergestelltes Epoxydharz und Epoxydharzzusammensetzung - Google Patents
Polyhydrisches Phenol und damit hergestelltes Epoxydharz und EpoxydharzzusammensetzungInfo
- Publication number
- DE69224694T2 DE69224694T2 DE69224694T DE69224694T DE69224694T2 DE 69224694 T2 DE69224694 T2 DE 69224694T2 DE 69224694 T DE69224694 T DE 69224694T DE 69224694 T DE69224694 T DE 69224694T DE 69224694 T2 DE69224694 T2 DE 69224694T2
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resin
- phenol
- resin composition
- polyhydric phenol
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/20—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3261898A JPH0597948A (ja) | 1991-10-09 | 1991-10-09 | 多価フエノール、それから誘導されるエポキシ樹脂及びエポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69224694D1 DE69224694D1 (de) | 1998-04-16 |
| DE69224694T2 true DE69224694T2 (de) | 1998-07-23 |
Family
ID=17368292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69224694T Expired - Fee Related DE69224694T2 (de) | 1991-10-09 | 1992-10-08 | Polyhydrisches Phenol und damit hergestelltes Epoxydharz und Epoxydharzzusammensetzung |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US5395912A (enExample) |
| EP (1) | EP0536749B1 (enExample) |
| JP (1) | JPH0597948A (enExample) |
| KR (1) | KR100225165B1 (enExample) |
| CA (1) | CA2079991A1 (enExample) |
| DE (1) | DE69224694T2 (enExample) |
| MY (2) | MY107554A (enExample) |
| SG (1) | SG47416A1 (enExample) |
| TW (1) | TW206248B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3161022B2 (ja) * | 1992-04-30 | 2001-04-25 | 住友化学工業株式会社 | エポキシ樹脂組成物及び樹脂封止型半導体装置 |
| JP2002037859A (ja) * | 2000-07-19 | 2002-02-06 | Sumitomo Chem Co Ltd | 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置 |
| CN100378165C (zh) * | 2003-11-03 | 2008-04-02 | 长春人造树脂厂股份有限公司 | 光半导体封装用的环氧树脂组合物 |
| US20120296011A1 (en) * | 2010-01-29 | 2012-11-22 | Nipponkayaku Kabushikikaisha | Phenolic compound, epoxy resin, epoxy resin composition, prepreg, and cured product thereof |
| GB2533776B (en) * | 2014-12-23 | 2020-11-04 | Hexcel Composites Ltd | Resin Composition |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1873849A (en) * | 1928-11-26 | 1932-08-23 | Celanese Corp | Synthetic resin and process of making the same |
| US2844553A (en) * | 1953-04-24 | 1958-07-22 | Sherwin Williams Co | Polyhydric phenol-aldehyde-epihalo-hydrin resins |
| JPS511436B2 (enExample) * | 1971-10-30 | 1976-01-17 | ||
| US4550128A (en) * | 1984-04-16 | 1985-10-29 | International Business Machines Corporation | Epoxy composition |
| DE4031575A1 (de) * | 1990-06-13 | 1991-12-19 | Hoechst Ag | Phenolharz, verfahren zu seiner herstellung und verwendung |
-
1991
- 1991-10-09 JP JP3261898A patent/JPH0597948A/ja active Pending
-
1992
- 1992-10-01 MY MYPI92001774A patent/MY107554A/en unknown
- 1992-10-01 TW TW081107831A patent/TW206248B/zh active
- 1992-10-06 CA CA002079991A patent/CA2079991A1/en not_active Abandoned
- 1992-10-08 SG SG1996000986A patent/SG47416A1/en unknown
- 1992-10-08 EP EP92117201A patent/EP0536749B1/en not_active Expired - Lifetime
- 1992-10-08 KR KR1019920018513A patent/KR100225165B1/ko not_active Expired - Fee Related
- 1992-10-08 DE DE69224694T patent/DE69224694T2/de not_active Expired - Fee Related
-
1993
- 1993-11-22 US US08/155,181 patent/US5395912A/en not_active Expired - Lifetime
-
1994
- 1994-10-27 US US08/328,771 patent/US5462997A/en not_active Expired - Lifetime
-
1995
- 1995-06-02 MY MYPI95001446A patent/MY111999A/en unknown
- 1995-06-05 US US08/464,204 patent/US5560968A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69224694D1 (de) | 1998-04-16 |
| MY107554A (en) | 1996-04-08 |
| EP0536749B1 (en) | 1998-03-11 |
| SG47416A1 (en) | 1998-04-17 |
| MY111999A (en) | 2001-03-31 |
| EP0536749A1 (en) | 1993-04-14 |
| JPH0597948A (ja) | 1993-04-20 |
| US5395912A (en) | 1995-03-07 |
| US5462997A (en) | 1995-10-31 |
| TW206248B (enExample) | 1993-05-21 |
| CA2079991A1 (en) | 1993-04-10 |
| US5560968A (en) | 1996-10-01 |
| KR930007996A (ko) | 1993-05-20 |
| KR100225165B1 (ko) | 1999-10-15 |
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| JP2002128868A (ja) | 半導体封止用エポキシ樹脂組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: SUMITOMO CHEMICAL CO. LTD., TOKIO/TOKYO, JP |
|
| 8339 | Ceased/non-payment of the annual fee |