DE69217033T2 - Dielektrisches material für hochfrequenz und daraus hergestellter resonator und dessen herstellung - Google Patents
Dielektrisches material für hochfrequenz und daraus hergestellter resonator und dessen herstellungInfo
- Publication number
- DE69217033T2 DE69217033T2 DE69217033T DE69217033T DE69217033T2 DE 69217033 T2 DE69217033 T2 DE 69217033T2 DE 69217033 T DE69217033 T DE 69217033T DE 69217033 T DE69217033 T DE 69217033T DE 69217033 T2 DE69217033 T2 DE 69217033T2
- Authority
- DE
- Germany
- Prior art keywords
- production
- high frequency
- dielectric material
- resonator made
- resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/16—Compositions for glass with special properties for dielectric glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
- C03C8/20—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing titanium compounds; containing zirconium compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/085—Particles bound with glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Insulating Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Glass Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22497991 | 1991-08-09 | ||
PCT/JP1992/001015 WO1993002979A1 (en) | 1991-08-09 | 1992-08-07 | Dielectric material for high frequency and resonator made thereof, and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69217033D1 DE69217033D1 (de) | 1997-03-06 |
DE69217033T2 true DE69217033T2 (de) | 1997-08-14 |
Family
ID=16822202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69217033T Expired - Fee Related DE69217033T2 (de) | 1991-08-09 | 1992-08-07 | Dielektrisches material für hochfrequenz und daraus hergestellter resonator und dessen herstellung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5431955A (de) |
EP (1) | EP0552377B1 (de) |
KR (1) | KR960006230B1 (de) |
DE (1) | DE69217033T2 (de) |
WO (1) | WO1993002979A1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5821181A (en) * | 1996-04-08 | 1998-10-13 | Motorola Inc. | Ceramic composition |
US5739193A (en) * | 1996-05-07 | 1998-04-14 | Hoechst Celanese Corp. | Polymeric compositions having a temperature-stable dielectric constant |
JP3761289B2 (ja) * | 1996-09-26 | 2006-03-29 | 日本特殊陶業株式会社 | 誘電体材料及びその製造方法並びにそれを用いた回路基板及び多層回路基板 |
US6641939B1 (en) | 1998-07-01 | 2003-11-04 | The Morgan Crucible Company Plc | Transition metal oxide doped alumina and methods of making and using |
US7098360B2 (en) * | 2002-07-16 | 2006-08-29 | Kreido Laboratories | Processes employing multiple successive chemical reaction process steps and apparatus therefore |
US20040014588A1 (en) * | 2002-07-19 | 2004-01-22 | Van Iersel Godefridus J.F.A. | Npo dielectric compositions |
DE10245234B4 (de) | 2002-09-27 | 2011-11-10 | Schott Ag | Kristallisierbares Glas, seine Verwendung zur Herstellung einer hochsteifen, bruchfesten Glaskeramik mit gut polierbarer Oberfläche sowie Verwendung der Glaskeramik |
DE10245233B3 (de) * | 2002-09-27 | 2004-02-12 | Schott Glas | Kristallisierbares Glas und seine Verwendung zur Herstellung einer hochsteifen, bruchfesten Glaskeramik |
KR100930852B1 (ko) * | 2004-06-28 | 2009-12-10 | 티디케이가부시기가이샤 | 저온 소성 기판 재료 및 그것을 사용한 다층 배선 기판 |
JP4295682B2 (ja) * | 2004-06-28 | 2009-07-15 | Tdk株式会社 | 多層配線基板 |
US20090054553A1 (en) * | 2007-08-20 | 2009-02-26 | General Electric Company | High dielectric constant thermoplastic composition, methods of manufacture thereof and articles comprising the same |
DE102014219088A1 (de) * | 2014-09-22 | 2016-03-24 | Siemens Aktiengesellschaft | Anordnung sowie ein Verfahren zum Schalten einer Schaltstrecke mittels eines Schaltgerätes |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6051762B2 (ja) * | 1977-10-07 | 1985-11-15 | 東芝セラミツクス株式会社 | 磁器誘電体 |
US4335216A (en) * | 1981-05-01 | 1982-06-15 | Tam Ceramics, Inc. | Low temperature fired dielectric ceramic composition and method of making same |
JPS603801A (ja) * | 1983-06-22 | 1985-01-10 | 松下電器産業株式会社 | 誘電体磁器組成物 |
JPS61173408A (ja) * | 1985-01-28 | 1986-08-05 | 沖電気工業株式会社 | マイクロ波用誘電体磁器組成物 |
JPS6224503A (ja) * | 1985-07-24 | 1987-02-02 | 宇部興産株式会社 | 誘電体磁器組成物 |
JP2507418B2 (ja) * | 1986-05-02 | 1996-06-12 | 旭硝子株式会社 | 回路基板用組成物 |
JPS632204A (ja) * | 1986-06-20 | 1988-01-07 | アルプス電気株式会社 | 誘電体磁器組成物 |
EP0396155B1 (de) * | 1986-07-15 | 1993-12-08 | E.I. Du Pont De Nemours And Company | Glaskeramische dielektrische Zusammensetzungen |
JPS63291307A (ja) * | 1987-05-22 | 1988-11-29 | Murata Mfg Co Ltd | 高周波用誘電体材料 |
JPS6445743A (en) * | 1987-08-13 | 1989-02-20 | Asahi Glass Co Ltd | Glass ceramic composition |
JP2800176B2 (ja) * | 1987-08-18 | 1998-09-21 | 旭硝子株式会社 | ガラスセラミックス組成物 |
JP2765885B2 (ja) * | 1988-11-14 | 1998-06-18 | 新光電気工業株式会社 | 窒化アルミニウム回路基板及びその製造方法 |
JP2729514B2 (ja) * | 1989-07-11 | 1998-03-18 | 日本セメント株式会社 | セラミック回路基板用誘電体組成物 |
JPH03112863A (ja) * | 1989-09-28 | 1991-05-14 | Mitsubishi Materials Corp | 焦電性セラミックス焼結組成物 |
JP2763664B2 (ja) * | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | 分布定数回路用配線基板 |
US5137848A (en) * | 1990-12-13 | 1992-08-11 | E. I. Du Pont De Nemours And Company | Dielectric composition containing kerf additive |
US5242867A (en) * | 1992-03-04 | 1993-09-07 | Industrial Technology Research Institute | Composition for making multilayer ceramic substrates and dielectric materials with low firing temperature |
-
1992
- 1992-08-07 DE DE69217033T patent/DE69217033T2/de not_active Expired - Fee Related
- 1992-08-07 WO PCT/JP1992/001015 patent/WO1993002979A1/ja active IP Right Grant
- 1992-08-07 KR KR1019930700494A patent/KR960006230B1/ko not_active IP Right Cessation
- 1992-08-07 EP EP92916809A patent/EP0552377B1/de not_active Expired - Lifetime
-
1994
- 1994-07-01 US US08/269,785 patent/US5431955A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR960006230B1 (ko) | 1996-05-11 |
KR930701841A (ko) | 1993-06-12 |
US5431955A (en) | 1995-07-11 |
EP0552377A1 (de) | 1993-07-28 |
EP0552377A4 (en) | 1994-06-22 |
DE69217033D1 (de) | 1997-03-06 |
EP0552377B1 (de) | 1997-01-22 |
WO1993002979A1 (en) | 1993-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |