DE69207075T2 - Verfahren und Vorrichtung zum Abschrägen der Kerbe eines Plättchen - Google Patents

Verfahren und Vorrichtung zum Abschrägen der Kerbe eines Plättchen

Info

Publication number
DE69207075T2
DE69207075T2 DE69207075T DE69207075T DE69207075T2 DE 69207075 T2 DE69207075 T2 DE 69207075T2 DE 69207075 T DE69207075 T DE 69207075T DE 69207075 T DE69207075 T DE 69207075T DE 69207075 T2 DE69207075 T2 DE 69207075T2
Authority
DE
Germany
Prior art keywords
chamfering
notch
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69207075T
Other languages
English (en)
Other versions
DE69207075D1 (de
Inventor
Kaoru Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69207075D1 publication Critical patent/DE69207075D1/de
Application granted granted Critical
Publication of DE69207075T2 publication Critical patent/DE69207075T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
DE69207075T 1991-06-12 1992-06-10 Verfahren und Vorrichtung zum Abschrägen der Kerbe eines Plättchen Expired - Fee Related DE69207075T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16775291A JP2613504B2 (ja) 1991-06-12 1991-06-12 ウエーハのノッチ部面取り方法および装置

Publications (2)

Publication Number Publication Date
DE69207075D1 DE69207075D1 (de) 1996-02-08
DE69207075T2 true DE69207075T2 (de) 1996-09-05

Family

ID=15855446

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69207075T Expired - Fee Related DE69207075T2 (de) 1991-06-12 1992-06-10 Verfahren und Vorrichtung zum Abschrägen der Kerbe eines Plättchen
DE69229920T Expired - Lifetime DE69229920D1 (de) 1991-06-12 1992-06-10 Verfahren und Vorrichtung zum Abfasen eines Wafereinschnitts

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69229920T Expired - Lifetime DE69229920D1 (de) 1991-06-12 1992-06-10 Verfahren und Vorrichtung zum Abfasen eines Wafereinschnitts

Country Status (4)

Country Link
US (1) US5445554A (de)
EP (2) EP0518640B1 (de)
JP (1) JP2613504B2 (de)
DE (2) DE69207075T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07205001A (ja) * 1993-11-16 1995-08-08 Tokyo Seimitsu Co Ltd ウェーハ面取り機
TW308561B (de) * 1995-08-24 1997-06-21 Mutsubishi Gum Kk
US5928066A (en) * 1995-12-05 1999-07-27 Shin-Etsu Handotai Co., Ltd. Apparatus for polishing peripheral portion of wafer
US5713784A (en) * 1996-05-17 1998-02-03 Mark A. Miller Apparatus for grinding edges of a glass sheet
JPH10249689A (ja) * 1997-03-10 1998-09-22 Tokyo Seimitsu Co Ltd ウェーハ面取方法及び装置
US5920769A (en) * 1997-12-12 1999-07-06 Micron Technology, Inc. Method and apparatus for processing a planar structure
JP3197253B2 (ja) * 1998-04-13 2001-08-13 株式会社日平トヤマ ウエーハの面取り方法
US6448154B1 (en) * 1998-04-16 2002-09-10 Texas Instruments Incorporated Method for producing wafers with rounded corners in the notches used for alignment in the fabrication of semiconductor devices
JP3334609B2 (ja) * 1998-05-29 2002-10-15 信越半導体株式会社 薄板縁部の加工方法および加工機
JP2000254845A (ja) * 1999-03-10 2000-09-19 Nippei Toyama Corp ウエーハのノッチ溝の面取り方法及びウエーハ
MY127032A (en) 1999-12-28 2006-11-30 Hitachi Metals Ltd Work chamfering apparatus and work chamfering method
JP2001205549A (ja) * 2000-01-25 2001-07-31 Speedfam Co Ltd 基板エッジ部の片面研磨方法およびその装置
US6306016B1 (en) * 2000-08-03 2001-10-23 Tsk America, Inc. Wafer notch polishing machine and method of polishing an orientation notch in a wafer
JP2004087647A (ja) * 2002-08-26 2004-03-18 Nihon Micro Coating Co Ltd 研磨パッド及び方法
KR100674440B1 (ko) * 2005-08-12 2007-01-25 주식회사 파이컴 프로브 카드 제조 방법 및 장치
US20080293337A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for polishing a notch of a substrate by substrate vibration
CN101498940B (zh) * 2008-01-31 2011-01-19 中芯国际集成电路制造(上海)有限公司 一种保护等离子刻蚀设备中的下电极部件的方法及装置
JP5352331B2 (ja) * 2009-04-15 2013-11-27 ダイトエレクトロン株式会社 ウェーハの面取り加工方法
EP2537633B1 (de) * 2011-06-24 2014-05-07 Comadur S.A. Bearbeitungssystem einer Abschrägung
USD834075S1 (en) 2016-08-05 2018-11-20 Ebara Corporation Pressing member for substrate polishing apparatus
USD858591S1 (en) * 2018-06-22 2019-09-03 Biocut, Llc Press housing
JP7222636B2 (ja) * 2018-09-12 2023-02-15 株式会社ディスコ エッジトリミング装置
CN109926911A (zh) * 2019-03-04 2019-06-25 天通日进精密技术有限公司 晶圆凹口抛光装置及晶圆凹口抛光方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60155358A (ja) * 1984-01-23 1985-08-15 Disco Abrasive Sys Ltd 半導体ウエ−ハの表面を研削する方法及び装置
JP2571573B2 (ja) * 1987-03-30 1997-01-16 信越エンジニアリング 株式会社 半導体ウェ−ハにおけるノッチ部の面取り方法
JPH0637024B2 (ja) * 1987-08-23 1994-05-18 エムテック株式会社 オリエンテ−ションフラットの研削方法及び装置
JPH0637025B2 (ja) * 1987-09-14 1994-05-18 スピードファム株式会社 ウエハの鏡面加工装置
JP2541844B2 (ja) * 1988-09-26 1996-10-09 信越半導体株式会社 半導体ウエ―ハ、ノッチ面取り方法及びその装置
US4905425A (en) * 1988-09-30 1990-03-06 Shin-Etsu Handotai Company Limited Method for chamfering the notch of a notch-cut semiconductor wafer
US5036624A (en) * 1989-06-21 1991-08-06 Silicon Technology Corporation Notch grinder

Also Published As

Publication number Publication date
DE69207075D1 (de) 1996-02-08
US5445554A (en) 1995-08-29
EP0518640B1 (de) 1995-12-27
JPH04364727A (ja) 1992-12-17
DE69229920D1 (de) 1999-10-07
EP0518640A1 (de) 1992-12-16
EP0686460B1 (de) 1999-09-01
JP2613504B2 (ja) 1997-05-28
EP0686460A1 (de) 1995-12-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee