DE69206803T2 - Zusammensetzungsvorrichtung - Google Patents

Zusammensetzungsvorrichtung

Info

Publication number
DE69206803T2
DE69206803T2 DE69206803T DE69206803T DE69206803T2 DE 69206803 T2 DE69206803 T2 DE 69206803T2 DE 69206803 T DE69206803 T DE 69206803T DE 69206803 T DE69206803 T DE 69206803T DE 69206803 T2 DE69206803 T2 DE 69206803T2
Authority
DE
Germany
Prior art keywords
preform
workpiece
housing
former
former housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69206803T
Other languages
German (de)
English (en)
Other versions
DE69206803D1 (de
Inventor
Won Park
James Rooney
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Publication of DE69206803D1 publication Critical patent/DE69206803D1/de
Application granted granted Critical
Publication of DE69206803T2 publication Critical patent/DE69206803T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W76/12
    • H10W90/756
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062Prior to assembly
    • Y10T156/107Punching and bonding pressure application by punch
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317Means feeding plural workpieces to be joined
    • Y10T156/1322Severing before bonding or assembling of parts
    • Y10T156/133Delivering cut part to indefinite or running length web
    • Y10T156/1335Cutter also delivers cut piece
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53313Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53374Means to interrelatedly feed plural work parts from plural sources without manual intervention including turret-type conveyor

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
DE69206803T 1991-07-01 1992-05-08 Zusammensetzungsvorrichtung Expired - Fee Related DE69206803T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/724,259 US5272800A (en) 1991-07-01 1991-07-01 Method and apparatus for forming and positioning a preform on a workpiece
PCT/US1992/003760 WO1993001013A1 (en) 1991-07-01 1992-05-08 Assembly apparatus

Publications (2)

Publication Number Publication Date
DE69206803D1 DE69206803D1 (de) 1996-01-25
DE69206803T2 true DE69206803T2 (de) 1996-08-29

Family

ID=24909697

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206803T Expired - Fee Related DE69206803T2 (de) 1991-07-01 1992-05-08 Zusammensetzungsvorrichtung

Country Status (10)

Country Link
US (1) US5272800A (enExample)
EP (1) EP0592463B1 (enExample)
JP (1) JP3255412B2 (enExample)
KR (1) KR100237720B1 (enExample)
AU (1) AU1908892A (enExample)
DE (1) DE69206803T2 (enExample)
HK (1) HK1007980A1 (enExample)
MX (1) MX9202489A (enExample)
TW (1) TW230835B (enExample)
WO (1) WO1993001013A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3072688B2 (ja) * 1993-03-24 2000-07-31 株式会社村田製作所 電子部品のカバーシート組立装置
DE69414483T2 (de) * 1993-07-28 1999-05-06 Toyo Seal Industries, Co. Ltd., Ikoma Lagerdichtungsplatte und ihr Herstellungsverfahren
US5558381A (en) * 1994-10-14 1996-09-24 Hughes Aircraft Co. Carrier opener system
US5590576A (en) * 1994-10-17 1997-01-07 Molex Incorporated Feed assembly for connector termination apparatus
US5851674A (en) * 1997-07-30 1998-12-22 Minnesota Mining And Manufacturing Company Antisoiling coatings for antireflective surfaces and methods of preparation
US6041502A (en) * 1998-01-08 2000-03-28 Xerox Corporation Method for removing fluid seals from a carrier
US6409859B1 (en) * 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
AUPR979202A0 (en) * 2002-01-02 2002-01-31 Ureflute Pty Ltd Improved composite sheeting material and method of manufacture
NL1025302C2 (nl) * 2004-01-22 2005-07-25 Fico Bv Omhulinrichting met verplaatsbare tafel en werkwijze voor omhullen.
US7154165B2 (en) * 2004-07-21 2006-12-26 Linear Technology Corporation Flashless lead frame with horizontal singulation
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices
EP2784882A1 (en) * 2013-03-26 2014-10-01 Tyco Electronics Nederland B.V. Workpiece carrier device
CN114589252B (zh) * 2022-03-15 2024-10-15 铜陵华锐科技有限公司 一种引线框架生产用剪切装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214944A (en) * 1978-05-23 1980-07-29 American Can Company Adhesive bonding of assembly parts
JPS6038825A (ja) * 1983-08-11 1985-02-28 Sumitomo Metal Mining Co Ltd テ−プ貼着装置
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages

Also Published As

Publication number Publication date
EP0592463A1 (en) 1994-04-20
KR100237720B1 (ko) 2000-01-15
AU1908892A (en) 1993-02-11
MX9202489A (es) 1993-01-01
JP3255412B2 (ja) 2002-02-12
TW230835B (enExample) 1994-09-21
WO1993001013A1 (en) 1993-01-21
JPH06508557A (ja) 1994-09-29
US5272800A (en) 1993-12-28
DE69206803D1 (de) 1996-01-25
EP0592463A4 (en) 1994-05-11
HK1007980A1 (en) 1999-04-30
EP0592463B1 (en) 1995-12-13

Similar Documents

Publication Publication Date Title
DE69206803T2 (de) Zusammensetzungsvorrichtung
DE60015141T2 (de) Herstellungsverfahren von festelektrolytkondensatoren
US5144709A (en) Formation of shapes in a metal workpiece
EP0650189A1 (de) Verfahren zum Herstellen eines Halbleiter-Modulaufbaus
DE69202625T2 (de) Elektronische Vorrichtung und Verfahren zu ihrer Herstellung.
DE2166598B2 (de) Verfahren und vorrichtung zur herstellung von lagerschalenhaelften
DE102017221223B4 (de) Anschlussverarbeitungsvorrichtung und halbleitervorrichtung, die mittels dieser hergestellt wird
DE102020128656B4 (de) Greifeinrichtung für eine Handlingsvorrichtung einer Bearbeitungsmaschine
DE4430584A1 (de) Formeinrichtung und Formverfahren
HK1007980B (en) Assembly apparatus
DE2842515C2 (de) Verfahren zum Herstellen von Kopfstücken mit einer Membrane für Verpackungsbehälter aus Laminat mit einer metallischen Sperrschicht und Vorrichtung zur Durchführung des Verfahrens
DE3446650A1 (de) Verpackungsmaschine
CH617897A5 (enExample)
DE4301200A1 (de) Bandstahlschnittwerkzeug zum Austrennen von tiefgezogenen Formteilen
EP0795891A2 (de) Auflöten von Halbleiterchips
DE60107205T2 (de) Crimpmatrize mit einem kraftbetätigten spannfutter
DE602004006331T2 (de) Vorrichtung zum Entgraten von Schmiedstücken
EP0520295B1 (de) Verfahren und Anordnung zur Ausformung der Aussenanschlüsse von oberflächenmontierbaren Bausteinen
DE102022213183B3 (de) Verfahren zum bilden eines leistungsmoduls
DE19535622C1 (de) Verfahren zum Aufbringen von kugelförmigen Lothöckern auf flächig verteilte Anschlußflächen eines Substrats
DE4422114A1 (de) Gehäusetopf für Elektronikmodule und Verfahren zur Herstellung desselben
DE19738922C2 (de) Vorrichtung und Verfahren zum Bestücken eines Leadframes mit integrierten Schaltungen
DE1813448A1 (de) Verfahren und Vorrichtung zum Verbinden von kleinen Bauteilen mit einer Grundplatte aus superplastischem Metall
DE4225055C2 (de) Verfahren zum Verpacken einer Halbleitervorrichtung und zum gleichzeitigen Biegen von Leitern der Halbleitervorrichtung
CN218746441U (zh) 螺母制标设备

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee