KR100237720B1 - 예비성형품을 성형하고 금속 작업물에 위치시키기 위한 장치 및 방법 - Google Patents

예비성형품을 성형하고 금속 작업물에 위치시키기 위한 장치 및 방법 Download PDF

Info

Publication number
KR100237720B1
KR100237720B1 KR1019930704128A KR930704128A KR100237720B1 KR 100237720 B1 KR100237720 B1 KR 100237720B1 KR 1019930704128 A KR1019930704128 A KR 1019930704128A KR 930704128 A KR930704128 A KR 930704128A KR 100237720 B1 KR100237720 B1 KR 100237720B1
Authority
KR
South Korea
Prior art keywords
preform
workpiece
die
die housing
housings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019930704128A
Other languages
English (en)
Korean (ko)
Inventor
에프. 로니 제임스
파크 원지.
Original Assignee
휴버트 마이어
어드밴스드 테크놀로지스 인터커넥트 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 휴버트 마이어, 어드밴스드 테크놀로지스 인터커넥트 인코포레이티드 filed Critical 휴버트 마이어
Application granted granted Critical
Publication of KR100237720B1 publication Critical patent/KR100237720B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W76/12—
    • H10W90/756—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
    • Y10T156/1317—Means feeding plural workpieces to be joined
    • Y10T156/1322—Severing before bonding or assembling of parts
    • Y10T156/133—Delivering cut part to indefinite or running length web
    • Y10T156/1335—Cutter also delivers cut piece
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53374—Means to interrelatedly feed plural work parts from plural sources without manual intervention including turret-type conveyor

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1019930704128A 1991-07-01 1992-05-08 예비성형품을 성형하고 금속 작업물에 위치시키기 위한 장치 및 방법 Expired - Fee Related KR100237720B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US724,259 1991-07-01
US07/724,259 US5272800A (en) 1991-07-01 1991-07-01 Method and apparatus for forming and positioning a preform on a workpiece
PCT/US1992/003760 WO1993001013A1 (en) 1991-07-01 1992-05-08 Assembly apparatus

Publications (1)

Publication Number Publication Date
KR100237720B1 true KR100237720B1 (ko) 2000-01-15

Family

ID=24909697

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930704128A Expired - Fee Related KR100237720B1 (ko) 1991-07-01 1992-05-08 예비성형품을 성형하고 금속 작업물에 위치시키기 위한 장치 및 방법

Country Status (10)

Country Link
US (1) US5272800A (enExample)
EP (1) EP0592463B1 (enExample)
JP (1) JP3255412B2 (enExample)
KR (1) KR100237720B1 (enExample)
AU (1) AU1908892A (enExample)
DE (1) DE69206803T2 (enExample)
HK (1) HK1007980A1 (enExample)
MX (1) MX9202489A (enExample)
TW (1) TW230835B (enExample)
WO (1) WO1993001013A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3072688B2 (ja) * 1993-03-24 2000-07-31 株式会社村田製作所 電子部品のカバーシート組立装置
DE69414483T2 (de) * 1993-07-28 1999-05-06 Toyo Seal Industries, Co. Ltd., Ikoma Lagerdichtungsplatte und ihr Herstellungsverfahren
US5558381A (en) * 1994-10-14 1996-09-24 Hughes Aircraft Co. Carrier opener system
US5590576A (en) * 1994-10-17 1997-01-07 Molex Incorporated Feed assembly for connector termination apparatus
US5851674A (en) * 1997-07-30 1998-12-22 Minnesota Mining And Manufacturing Company Antisoiling coatings for antireflective surfaces and methods of preparation
US6041502A (en) * 1998-01-08 2000-03-28 Xerox Corporation Method for removing fluid seals from a carrier
US6409859B1 (en) * 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
AUPR979202A0 (en) * 2002-01-02 2002-01-31 Ureflute Pty Ltd Improved composite sheeting material and method of manufacture
NL1025302C2 (nl) * 2004-01-22 2005-07-25 Fico Bv Omhulinrichting met verplaatsbare tafel en werkwijze voor omhullen.
US7154165B2 (en) * 2004-07-21 2006-12-26 Linear Technology Corporation Flashless lead frame with horizontal singulation
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices
EP2784882A1 (en) * 2013-03-26 2014-10-01 Tyco Electronics Nederland B.V. Workpiece carrier device
CN114589252B (zh) * 2022-03-15 2024-10-15 铜陵华锐科技有限公司 一种引线框架生产用剪切装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4214944A (en) * 1978-05-23 1980-07-29 American Can Company Adhesive bonding of assembly parts
JPS6038825A (ja) * 1983-08-11 1985-02-28 Sumitomo Metal Mining Co Ltd テ−プ貼着装置
US4897508A (en) * 1988-02-10 1990-01-30 Olin Corporation Metal electronic package
US4939316A (en) * 1988-10-05 1990-07-03 Olin Corporation Aluminum alloy semiconductor packages

Also Published As

Publication number Publication date
EP0592463A1 (en) 1994-04-20
AU1908892A (en) 1993-02-11
MX9202489A (es) 1993-01-01
JP3255412B2 (ja) 2002-02-12
TW230835B (enExample) 1994-09-21
WO1993001013A1 (en) 1993-01-21
JPH06508557A (ja) 1994-09-29
US5272800A (en) 1993-12-28
DE69206803D1 (de) 1996-01-25
EP0592463A4 (en) 1994-05-11
HK1007980A1 (en) 1999-04-30
EP0592463B1 (en) 1995-12-13
DE69206803T2 (de) 1996-08-29

Similar Documents

Publication Publication Date Title
KR100237720B1 (ko) 예비성형품을 성형하고 금속 작업물에 위치시키기 위한 장치 및 방법
US5144709A (en) Formation of shapes in a metal workpiece
KR102518207B1 (ko) 몰딩된 공기 공동 패키지 및 그 제조 방법
HK1007980B (en) Assembly apparatus
US4103718A (en) Apparatus for cutting and forming flexible beam leads of an integrated circuit chip
US4137546A (en) Stamped lead frame for semiconductor packages
US6504238B2 (en) Leadframe with elevated small mount pads
JP3164275B2 (ja) 真空成形同時巻込トリミング装置
US4064917A (en) Apparatus for cutting and forming flexible beam leads of an integrated circuit chip
JP2002036270A (ja) 樹脂封止方法及び樹脂封止装置
US6395584B2 (en) Method for improving the liquid dispensing of IC packages
US3893325A (en) Process for manufacturing a base for a semiconductor device
JP2006156437A (ja) リードフレーム及び半導体装置
CN216461182U (zh) 精密微型冲壳模具
JP3025093B2 (ja) 半導体装置およびその実装構造体
US4192063A (en) Method for manufacturing a base of a semi-conductor device
US4109373A (en) Method for manufacturing semiconductor devices
US4124935A (en) Method for manufacturing a base of a pressure mount type semiconductor device
JPH02203544A (ja) 成形装置
CN112605288A (zh) 一种t型螺栓冲压模具
CN221551617U (zh) 一种合金电阻封装模具
CN222403041U (zh) 一种汽车零部件用冲孔设备
CN111326429B (zh) 一种双基岛散热芯片封装工序
JP3930869B2 (ja) 半導体パッケージ用アイレットの製造方法及びその製造用プレス金型
JPH01212453A (ja) 半導体装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20021012

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20021012