DE69206331D1 - Klebeband zum Befestigen von Halbleiterplättchen. - Google Patents

Klebeband zum Befestigen von Halbleiterplättchen.

Info

Publication number
DE69206331D1
DE69206331D1 DE69206331T DE69206331T DE69206331D1 DE 69206331 D1 DE69206331 D1 DE 69206331D1 DE 69206331 T DE69206331 T DE 69206331T DE 69206331 T DE69206331 T DE 69206331T DE 69206331 D1 DE69206331 D1 DE 69206331D1
Authority
DE
Germany
Prior art keywords
adhesive tape
semiconductor chips
attaching semiconductor
attaching
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69206331T
Other languages
English (en)
Other versions
DE69206331T2 (de
Inventor
Koji Nakayama
Kenji Mougi
Eiji Shiramatsu
Kazushige Iwamoto
Shinichi Ishiwata
Morikuni Hasebe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09209492A external-priority patent/JP3326195B2/ja
Priority claimed from JP9209392A external-priority patent/JP3291017B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of DE69206331D1 publication Critical patent/DE69206331D1/de
Publication of DE69206331T2 publication Critical patent/DE69206331T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69206331T 1991-06-28 1992-06-29 Klebeband zum Befestigen von Halbleiterplättchen. Expired - Fee Related DE69206331T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP18539791 1991-06-28
JP09209492A JP3326195B2 (ja) 1991-06-28 1992-03-18 半導体ウエハ固定用粘着テープ
JP9209392A JP3291017B2 (ja) 1992-03-18 1992-03-18 半導体ウエハ固定用粘着テープ
JP11392892 1992-03-18

Publications (2)

Publication Number Publication Date
DE69206331D1 true DE69206331D1 (de) 1996-01-11
DE69206331T2 DE69206331T2 (de) 1996-08-29

Family

ID=27467997

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69206331T Expired - Fee Related DE69206331T2 (de) 1991-06-28 1992-06-29 Klebeband zum Befestigen von Halbleiterplättchen.

Country Status (5)

Country Link
EP (1) EP0520515B1 (de)
KR (1) KR0162103B1 (de)
DE (1) DE69206331T2 (de)
MY (1) MY111332A (de)
TW (1) TW215453B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9301929D0 (en) * 1993-02-01 1993-03-17 Raychem Ltd Low-temperature-tolerant gels
FR2717487B1 (fr) * 1994-03-16 1998-06-26 Atochem Elf Sa Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive.
FR2717489B1 (fr) * 1994-03-16 1999-09-24 Atochem Elf Sa Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive.
US5648136A (en) * 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
TW311927B (de) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
WO1997019140A1 (en) * 1995-11-22 1997-05-29 Sumitomo Bakelite Company, Limited Cover tape for packaging electronic components
JP4153577B2 (ja) * 1997-11-28 2008-09-24 旭化成ケミカルズ株式会社 耐油性に優れた熱可塑性エラストマー
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
EP1270210B1 (de) 2001-06-26 2006-08-16 Sumitomo Bakelite Company Limited Abdeckstreifen zum Verpacken von elektronischen Bauteilen
JP2012094834A (ja) * 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム
JP5680128B2 (ja) * 2012-04-13 2015-03-04 東京応化工業株式会社 接着剤組成物、接着フィルム、及び貼付方法
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
JP6216575B2 (ja) * 2012-10-25 2017-10-18 東京応化工業株式会社 接着剤組成物及び接着フィルム
CN104885202B (zh) * 2013-03-04 2017-07-11 琳得科株式会社 切割片用基材膜及具备该基材膜的切割片

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083081B2 (ja) * 1988-06-06 1996-01-17 日立化成工業株式会社 回路接続用接着剤組成物
JPH02215528A (ja) * 1989-02-17 1990-08-28 Sumitomo Bakelite Co Ltd 多層フィルム

Also Published As

Publication number Publication date
KR0162103B1 (ko) 1999-01-15
DE69206331T2 (de) 1996-08-29
EP0520515A3 (en) 1993-08-25
MY111332A (en) 1999-11-30
KR930000642A (ko) 1993-01-15
EP0520515B1 (de) 1995-11-29
EP0520515A2 (de) 1992-12-30
TW215453B (de) 1993-11-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee