TW215453B - - Google Patents

Info

Publication number
TW215453B
TW215453B TW081105027A TW81105027A TW215453B TW 215453 B TW215453 B TW 215453B TW 081105027 A TW081105027 A TW 081105027A TW 81105027 A TW81105027 A TW 81105027A TW 215453 B TW215453 B TW 215453B
Authority
TW
Taiwan
Application number
TW081105027A
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09209492A external-priority patent/JP3326195B2/ja
Priority claimed from JP9209392A external-priority patent/JP3291017B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Application granted granted Critical
Publication of TW215453B publication Critical patent/TW215453B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
TW081105027A 1991-06-28 1992-06-26 TW215453B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP18539791 1991-06-28
JP09209492A JP3326195B2 (ja) 1991-06-28 1992-03-18 半導体ウエハ固定用粘着テープ
JP11392892 1992-03-18
JP9209392A JP3291017B2 (ja) 1992-03-18 1992-03-18 半導体ウエハ固定用粘着テープ

Publications (1)

Publication Number Publication Date
TW215453B true TW215453B (zh) 1993-11-01

Family

ID=27467997

Family Applications (1)

Application Number Title Priority Date Filing Date
TW081105027A TW215453B (zh) 1991-06-28 1992-06-26

Country Status (5)

Country Link
EP (1) EP0520515B1 (zh)
KR (1) KR0162103B1 (zh)
DE (1) DE69206331T2 (zh)
MY (1) MY111332A (zh)
TW (1) TW215453B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558781B (zh) * 2012-04-13 2016-11-21 東京應化工業股份有限公司 黏著劑組成物，黏著薄膜及黏貼方法
TWI586776B (zh) * 2012-10-25 2017-06-11 東京應化工業股份有限公司 接著劑組成物及接著薄膜

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9301929D0 (en) * 1993-02-01 1993-03-17 Raychem Ltd Low-temperature-tolerant gels
FR2717487B1 (fr) 1994-03-16 1998-06-26 Atochem Elf Sa Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive.
FR2717489B1 (fr) * 1994-03-16 1999-09-24 Atochem Elf Sa Composition de liant de coextrusion et complexe multicouche coextrudé dans lequel ladite composition est utilisée comme couche adhésive.
US5648136A (en) * 1995-07-11 1997-07-15 Minnesota Mining And Manufacturing Co. Component carrier tape
TW311927B (zh) * 1995-07-11 1997-08-01 Minnesota Mining & Mfg
WO1997019140A1 (en) * 1995-11-22 1997-05-29 Sumitomo Bakelite Company, Limited Cover tape for packaging electronic components
JP4153577B2 (ja) * 1997-11-28 2008-09-24 旭化成ケミカルズ株式会社 耐油性に優れた熱可塑性エラストマー
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
EP1270210B1 (en) * 2001-06-26 2006-08-16 Sumitomo Bakelite Company Limited Cover tape for packaging electronic components
JP2012094834A (ja) 2010-09-13 2012-05-17 Sumitomo Bakelite Co Ltd ダイシングフィルム
JP5117629B1 (ja) * 2012-06-28 2013-01-16 古河電気工業株式会社 ウェハ加工用粘着テープ
EP2985782A4 (en) * 2013-03-04 2016-10-05 Lintec Corp SUBSTRATE FILM FOR A CUTTING SHEET AND SHEET FILM WITH THIS SUBSTRATE

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH083081B2 (ja) * 1988-06-06 1996-01-17 日立化成工業株式会社 回路接続用接着剤組成物
JPH02215528A (ja) * 1989-02-17 1990-08-28 Sumitomo Bakelite Co Ltd 多層フィルム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558781B (zh) * 2012-04-13 2016-11-21 東京應化工業股份有限公司 黏著劑組成物，黏著薄膜及黏貼方法
US10793756B2 (en) 2012-04-13 2020-10-06 Tokyo Ohka Kogyo Co., Ltd. Adhesive composition, adhesive film, and bonding method
TWI586776B (zh) * 2012-10-25 2017-06-11 東京應化工業股份有限公司 接著劑組成物及接著薄膜

Also Published As

Publication number Publication date
DE69206331T2 (de) 1996-08-29
EP0520515A2 (en) 1992-12-30
KR930000642A (ko) 1993-01-15
EP0520515B1 (en) 1995-11-29
EP0520515A3 (en) 1993-08-25
MY111332A (en) 1999-11-30
DE69206331D1 (de) 1996-01-11
KR0162103B1 (ko) 1999-01-15

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent