KR930014326U - 반도체 다이 접착제 - Google Patents

반도체 다이 접착제

Info

Publication number
KR930014326U
KR930014326U KR2019910024029U KR910024029U KR930014326U KR 930014326 U KR930014326 U KR 930014326U KR 2019910024029 U KR2019910024029 U KR 2019910024029U KR 910024029 U KR910024029 U KR 910024029U KR 930014326 U KR930014326 U KR 930014326U
Authority
KR
South Korea
Prior art keywords
semiconductor die
die adhesive
adhesive
semiconductor
die
Prior art date
Application number
KR2019910024029U
Other languages
English (en)
Other versions
KR950005070Y1 (ko
Inventor
김구성
송영재
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Priority to KR2019910024029U priority Critical patent/KR950005070Y1/ko
Publication of KR930014326U publication Critical patent/KR930014326U/ko
Application granted granted Critical
Publication of KR950005070Y1 publication Critical patent/KR950005070Y1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR2019910024029U 1991-12-26 1991-12-26 반도체 다이 접착제 KR950005070Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019910024029U KR950005070Y1 (ko) 1991-12-26 1991-12-26 반도체 다이 접착제

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019910024029U KR950005070Y1 (ko) 1991-12-26 1991-12-26 반도체 다이 접착제

Publications (2)

Publication Number Publication Date
KR930014326U true KR930014326U (ko) 1993-07-27
KR950005070Y1 KR950005070Y1 (ko) 1995-06-22

Family

ID=19325704

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019910024029U KR950005070Y1 (ko) 1991-12-26 1991-12-26 반도체 다이 접착제

Country Status (1)

Country Link
KR (1) KR950005070Y1 (ko)

Also Published As

Publication number Publication date
KR950005070Y1 (ko) 1995-06-22

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