DE69130662T2 - Vorrichtung und Verfahren zum Heizen von Substraten in der Halbleiterherstellung - Google Patents

Vorrichtung und Verfahren zum Heizen von Substraten in der Halbleiterherstellung

Info

Publication number
DE69130662T2
DE69130662T2 DE69130662T DE69130662T DE69130662T2 DE 69130662 T2 DE69130662 T2 DE 69130662T2 DE 69130662 T DE69130662 T DE 69130662T DE 69130662 T DE69130662 T DE 69130662T DE 69130662 T2 DE69130662 T2 DE 69130662T2
Authority
DE
Germany
Prior art keywords
semiconductor production
heating substrates
substrates
heating
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69130662T
Other languages
English (en)
Other versions
DE69130662D1 (de
Inventor
Roger N Anderson
Thomas E Deacon
David K Carlson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69130662D1 publication Critical patent/DE69130662D1/de
Publication of DE69130662T2 publication Critical patent/DE69130662T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation by radiant heating of the substrate
DE69130662T 1990-08-16 1991-08-14 Vorrichtung und Verfahren zum Heizen von Substraten in der Halbleiterherstellung Expired - Fee Related DE69130662T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56839390A 1990-08-16 1990-08-16
US07/651,668 US5179677A (en) 1990-08-16 1991-02-06 Apparatus and method for substrate heating utilizing various infrared means to achieve uniform intensity

Publications (2)

Publication Number Publication Date
DE69130662D1 DE69130662D1 (de) 1999-02-04
DE69130662T2 true DE69130662T2 (de) 1999-09-09

Family

ID=27074774

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69130662T Expired - Fee Related DE69130662T2 (de) 1990-08-16 1991-08-14 Vorrichtung und Verfahren zum Heizen von Substraten in der Halbleiterherstellung
DE69132982T Expired - Fee Related DE69132982T2 (de) 1990-08-16 1991-08-14 Reaktor mit Strahlungsheizung

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE69132982T Expired - Fee Related DE69132982T2 (de) 1990-08-16 1991-08-14 Reaktor mit Strahlungsheizung

Country Status (5)

Country Link
US (1) US5179677A (de)
EP (2) EP0476307B1 (de)
JP (1) JP2601957B2 (de)
KR (1) KR100217486B1 (de)
DE (2) DE69130662T2 (de)

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US7015422B2 (en) * 2000-12-21 2006-03-21 Mattson Technology, Inc. System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy
US6923821B2 (en) * 2001-02-28 2005-08-02 Theodore Wortrich Microkeratome blades and methods of making
US6600138B2 (en) * 2001-04-17 2003-07-29 Mattson Technology, Inc. Rapid thermal processing system for integrated circuits
US6778762B1 (en) * 2002-04-17 2004-08-17 Novellus Systems, Inc. Sloped chamber top for substrate processing
US20040040509A1 (en) * 2002-09-04 2004-03-04 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for preventing etchant condensation on wafer in a cooling chamber
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US7169233B2 (en) * 2003-11-21 2007-01-30 Asm America, Inc. Reactor chamber
US7396743B2 (en) * 2004-06-10 2008-07-08 Singh Kaushal K Low temperature epitaxial growth of silicon-containing films using UV radiation
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US7718225B2 (en) * 2005-08-17 2010-05-18 Applied Materials, Inc. Method to control semiconductor film deposition characteristics
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US7960236B2 (en) 2006-12-12 2011-06-14 Applied Materials, Inc. Phosphorus containing Si epitaxial layers in N-type source/drain junctions
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JP5402657B2 (ja) * 2010-01-14 2014-01-29 株式会社Ｓｕｍｃｏ エピタキシャル成長装置
JP5807522B2 (ja) * 2011-11-17 2015-11-10 信越半導体株式会社 エピタキシャル成長装置
JP6230073B2 (ja) * 2012-02-24 2017-11-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 加熱ランプのまわりの空気流の減少を容易にするための基部を有する加熱ランプ
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JP6820866B2 (ja) * 2015-05-29 2021-01-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ リフレクタを有する処理チャンバ
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Also Published As

Publication number Publication date
EP0872574A3 (de) 1998-11-25
DE69132982T2 (de) 2002-11-21
JP2601957B2 (ja) 1997-04-23
EP0476307A1 (de) 1992-03-25
US5179677A (en) 1993-01-12
EP0476307B1 (de) 1998-12-23
DE69132982D1 (de) 2002-05-08
EP0872574B1 (de) 2002-04-03
KR920005254A (ko) 1992-03-28
EP0872574A2 (de) 1998-10-21
JPH04255214A (ja) 1992-09-10
DE69130662D1 (de) 1999-02-04
KR100217486B1 (ko) 1999-09-01

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