DE69120989D1 - Ausrichtungsmarke, insbesondere für Halbleiter - Google Patents
Ausrichtungsmarke, insbesondere für HalbleiterInfo
- Publication number
- DE69120989D1 DE69120989D1 DE69120989T DE69120989T DE69120989D1 DE 69120989 D1 DE69120989 D1 DE 69120989D1 DE 69120989 T DE69120989 T DE 69120989T DE 69120989 T DE69120989 T DE 69120989T DE 69120989 D1 DE69120989 D1 DE 69120989D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductors
- alignment mark
- mark
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6059390 | 1990-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69120989D1 true DE69120989D1 (de) | 1996-08-29 |
Family
ID=13146690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69120989T Expired - Lifetime DE69120989D1 (de) | 1990-03-12 | 1991-03-12 | Ausrichtungsmarke, insbesondere für Halbleiter |
Country Status (4)
Country | Link |
---|---|
US (1) | US5528372A (de) |
EP (1) | EP0446857B1 (de) |
KR (1) | KR950002171B1 (de) |
DE (1) | DE69120989D1 (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3239976B2 (ja) * | 1994-09-30 | 2001-12-17 | 株式会社東芝 | アライメントマーク、半導体装置の製造方法および半導体装置 |
DE4442596C1 (de) * | 1994-11-30 | 1996-04-04 | Heidelberg Instruments Mikrotechnik Gmbh | Verfahren zur Korrektur von Positionsmeßfehlern |
US5538924A (en) * | 1995-09-05 | 1996-07-23 | Vanguard International Semiconductor Co. | Method of forming a moisture guard ring for integrated circuit applications |
JP2870461B2 (ja) * | 1995-12-18 | 1999-03-17 | 日本電気株式会社 | フォトマスクの目合わせマーク及び半導体装置 |
US6759628B1 (en) * | 1996-06-20 | 2004-07-06 | Sony Corporation | Laser annealing apparatus |
US6501188B1 (en) * | 1997-07-03 | 2002-12-31 | Micron Technology, Inc. | Method for improving a stepper signal in a planarized surface over alignment topography |
US5933743A (en) | 1997-07-03 | 1999-08-03 | Micron Technology, Inc. | Method of improving alignment signal strength by reducing refraction index at interface of materials in semiconductors |
JP3081994B2 (ja) * | 1997-10-22 | 2000-08-28 | セイコーインスツルメンツ株式会社 | 半導体装置 |
TW335527B (en) * | 1997-11-08 | 1998-07-01 | United Microelectronics Corp | The rework testing method of semiconductor device |
US6160622A (en) * | 1997-12-29 | 2000-12-12 | Asm Lithography, B.V. | Alignment device and lithographic apparatus comprising such a device |
JP3650281B2 (ja) * | 1999-05-07 | 2005-05-18 | セイコーインスツル株式会社 | 半導体装置 |
JP2002043427A (ja) * | 2000-07-21 | 2002-02-08 | Mitsubishi Electric Corp | 半導体装置のトリミング方法と半導体装置のトリミング装置および半導体装置のトリミングテーブルの作成方法 |
JP3970546B2 (ja) | 2001-04-13 | 2007-09-05 | 沖電気工業株式会社 | 半導体装置及び半導体装置の製造方法 |
JP2003150027A (ja) * | 2001-11-08 | 2003-05-21 | Sankyo Seiki Mfg Co Ltd | 金属蒸着型熱転写用ホログラムシートおよびその加工方法 |
US6815838B2 (en) | 2002-02-20 | 2004-11-09 | International Business Machines Corporation | Laser alignment target and method |
US20040032030A1 (en) * | 2002-08-13 | 2004-02-19 | Texas Instruments Incorporated | Laser alignment structure |
JP2004120515A (ja) * | 2002-09-27 | 2004-04-15 | Oki Electric Ind Co Ltd | フェーズロックループ回路 |
US20040145066A1 (en) * | 2003-01-24 | 2004-07-29 | Swanson Leland S. | Laser alignment structure for integrated circuits |
JP4412922B2 (ja) * | 2003-06-27 | 2010-02-10 | 株式会社ルネサステクノロジ | 半導体装置 |
US7265850B2 (en) * | 2003-10-23 | 2007-09-04 | International Business Machines Corporation | Fortified, compensated and uncompensated process-sensitive scatterometry targets |
US7052968B1 (en) * | 2004-04-07 | 2006-05-30 | Advanced Micro Devices, Inc. | Method and system for aligning IC die to package substrate |
US8110775B2 (en) * | 2004-06-18 | 2012-02-07 | Electro Scientific Industries, Inc. | Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing |
US8049135B2 (en) * | 2004-06-18 | 2011-11-01 | Electro Scientific Industries, Inc. | Systems and methods for alignment of laser beam(s) for semiconductor link processing |
US7583834B2 (en) * | 2005-03-04 | 2009-09-01 | Eastman Kodak Company | Laser etched fiducials in roll-roll display |
US20070052114A1 (en) * | 2005-09-07 | 2007-03-08 | Shih-Chieh Huang | Alignment checking structure and process using thereof |
KR100990028B1 (ko) * | 2005-10-18 | 2010-10-26 | 지에스아이 그룹 코포레이션 | 레이저 프로세싱 방법, 정렬 방법 및 레이저 프로세싱 시스템 |
KR100809708B1 (ko) * | 2006-10-17 | 2008-03-06 | 삼성전자주식회사 | 레이저 얼라인먼트 모니터링 퓨즈 구조 및 이를 구비한반도체 소자 및 레이저 얼라인먼트 모니터링회로 |
KR101330706B1 (ko) * | 2006-11-03 | 2013-11-19 | 삼성전자주식회사 | 얼라인먼트 마크 |
US20080221559A1 (en) * | 2007-03-06 | 2008-09-11 | Phuoc Khanh Nguyen | Calibration and Quality Assurance System For Use With Ophthalmic Surgical Devices and Associated Methods |
JP4967904B2 (ja) * | 2007-07-31 | 2012-07-04 | 富士電機株式会社 | 半導体装置 |
US8379204B1 (en) | 2007-08-17 | 2013-02-19 | Gsi Group Corporation | System and method for automatic laser beam alignment |
JP5175616B2 (ja) * | 2008-05-23 | 2013-04-03 | シャープ株式会社 | 半導体装置およびその製造方法 |
US7916295B2 (en) * | 2008-09-03 | 2011-03-29 | Macronix International Co., Ltd. | Alignment mark and method of getting position reference for wafer |
US9076798B2 (en) | 2009-05-11 | 2015-07-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Dicing structures for semiconductor substrates and methods of fabrication thereof |
CN103999227B (zh) * | 2011-11-09 | 2017-06-09 | 天工方案公司 | 场效应晶体管结构以及相关的射频开关 |
KR101724459B1 (ko) * | 2015-07-13 | 2017-04-07 | 현대자동차 주식회사 | 레이저 가공 장치 및 이를 이용한 식별 마크 형성 방법 |
TWI606530B (zh) * | 2017-03-29 | 2017-11-21 | 台灣愛司帝科技股份有限公司 | 位置偵測與晶片分離裝置 |
CN113555345B (zh) * | 2020-04-23 | 2024-02-06 | 长鑫存储技术有限公司 | 半导体标记及其形成方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1816816A1 (de) * | 1967-12-28 | 1969-08-14 | Tokyo Shibaura Electric Co | Position- und Richtungsermittlungseinrichtung unter Verwendung von Kennzeichen oder Mustern |
US3660157A (en) * | 1969-08-18 | 1972-05-02 | Computervision Corp | Enhanced contrast semiconductor wafer alignment target |
US4240094A (en) * | 1978-03-20 | 1980-12-16 | Harris Corporation | Laser-configured logic array |
JPS5649516A (en) * | 1979-09-28 | 1981-05-06 | Nec Corp | Semiconductor wafer |
JPS5649537A (en) * | 1979-09-28 | 1981-05-06 | Nec Corp | Semiconductor wafer |
JPS5651838A (en) * | 1979-10-05 | 1981-05-09 | Nec Corp | Semiconductor device |
JPS56122128A (en) * | 1980-02-29 | 1981-09-25 | Telmec Co Ltd | Positioning system for printing device of semiconductor or the like |
JPS5890728A (ja) * | 1981-11-25 | 1983-05-30 | Nippon Telegr & Teleph Corp <Ntt> | 半導体ウエファ上の位置合せ用マ−クの製法 |
JPS59100257A (ja) * | 1982-11-30 | 1984-06-09 | Nippon Piston Ring Co Ltd | 回転式流体コンプレツサ |
US4632557A (en) * | 1985-01-23 | 1986-12-30 | Harris Corporation | Alignment target image enhancement for microlithography process |
US4769523A (en) * | 1985-03-08 | 1988-09-06 | Nippon Kogaku K.K. | Laser processing apparatus |
US4635345A (en) * | 1985-03-14 | 1987-01-13 | Harris Corporation | Method of making an intergrated vertical NPN and vertical oxide fuse programmable memory cell |
US4880309A (en) * | 1987-04-14 | 1989-11-14 | General Signal Corporation | Dark field target design system for alignment of semiconductor wafers |
JPS6450528A (en) * | 1987-08-21 | 1989-02-27 | Oki Electric Ind Co Ltd | Wafer alignment mark and manufacture thereof |
JPH01169926A (ja) * | 1987-12-24 | 1989-07-05 | Toshiba Corp | アライメント方法 |
-
1991
- 1991-03-12 DE DE69120989T patent/DE69120989D1/de not_active Expired - Lifetime
- 1991-03-12 EP EP91103737A patent/EP0446857B1/de not_active Expired - Lifetime
- 1991-03-12 KR KR1019910003926A patent/KR950002171B1/ko not_active IP Right Cessation
-
1994
- 1994-09-06 US US08/300,850 patent/US5528372A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR950002171B1 (ko) | 1995-03-14 |
EP0446857A2 (de) | 1991-09-18 |
EP0446857A3 (en) | 1992-08-05 |
US5528372A (en) | 1996-06-18 |
EP0446857B1 (de) | 1996-07-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |