DE69105597D1 - Klebemittelzusammensetzung für Halbleiter. - Google Patents

Klebemittelzusammensetzung für Halbleiter.

Info

Publication number
DE69105597D1
DE69105597D1 DE69105597T DE69105597T DE69105597D1 DE 69105597 D1 DE69105597 D1 DE 69105597D1 DE 69105597 T DE69105597 T DE 69105597T DE 69105597 T DE69105597 T DE 69105597T DE 69105597 D1 DE69105597 D1 DE 69105597D1
Authority
DE
Germany
Prior art keywords
semiconductors
adhesive composition
adhesive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69105597T
Other languages
English (en)
Other versions
DE69105597T2 (de
Inventor
Man-Sheung Chan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/515,698 external-priority patent/US5006575A/en
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69105597D1 publication Critical patent/DE69105597D1/de
Application granted granted Critical
Publication of DE69105597T2 publication Critical patent/DE69105597T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Conductive Materials (AREA)
DE69105597T 1990-04-26 1991-04-20 Klebemittelzusammensetzung für Halbleiter. Expired - Fee Related DE69105597T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/515,698 US5006575A (en) 1989-10-20 1990-04-26 Die attach adhesive composition

Publications (2)

Publication Number Publication Date
DE69105597D1 true DE69105597D1 (de) 1995-01-19
DE69105597T2 DE69105597T2 (de) 1995-05-11

Family

ID=24052381

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69105597T Expired - Fee Related DE69105597T2 (de) 1990-04-26 1991-04-20 Klebemittelzusammensetzung für Halbleiter.

Country Status (5)

Country Link
EP (1) EP0454005B1 (de)
JP (1) JP2589892B2 (de)
CA (1) CA2041295A1 (de)
DE (1) DE69105597T2 (de)
MY (1) MY106072A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100450004B1 (ko) 1994-12-26 2004-09-24 히다치 가세고교 가부시끼가이샤 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체 장치의 제조 방법
JP3260253B2 (ja) * 1995-01-06 2002-02-25 松下電器産業株式会社 半導体装置の検査方法と検査用導電性接着剤
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (de) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US5912282A (en) * 1996-12-16 1999-06-15 Shell Oil Company Die attach adhesive compositions
CN102056973B (zh) * 2008-07-22 2014-02-12 E.I.内穆尔杜邦公司 用于薄膜光伏电池的聚合物厚膜银电极组合物
ES2758189T3 (es) 2016-04-06 2020-05-04 Novel Tech Holdings Limited Materiales antimicrobianos que contienen plata

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412043A (en) * 1966-08-05 1968-11-19 Dexter Corp Electrically conductive resinous compositions
US4516836A (en) * 1982-09-20 1985-05-14 Crystaloid Electronics Company Conductor for use in electro-optical displays
JPS59159640A (ja) * 1983-02-28 1984-09-10 Fujikura Ltd 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機
US4747968A (en) * 1985-05-08 1988-05-31 Sheldahl, Inc. Low temperature cure having single component conductive adhesive
JPS63178181A (ja) * 1987-01-20 1988-07-22 Hitachi Chem Co Ltd 接着剤組成物
US4769399A (en) * 1987-03-12 1988-09-06 Minnesota Mining And Manufacturing Company Epoxy adhesive film for electronic applications
US4976813A (en) * 1988-07-01 1990-12-11 Amoco Corporation Process for using a composition for a solder mask
JPH02206670A (ja) * 1989-02-06 1990-08-16 Hitachi Chem Co Ltd 異方導電性を有する回路接続用熱伝導性接着剤組成物及び熱伝導性接着フィルム

Also Published As

Publication number Publication date
EP0454005B1 (de) 1994-12-07
EP0454005A2 (de) 1991-10-30
JPH04227782A (ja) 1992-08-17
MY106072A (en) 1995-03-31
EP0454005A3 (en) 1992-11-25
CA2041295A1 (en) 1991-10-27
JP2589892B2 (ja) 1997-03-12
DE69105597T2 (de) 1995-05-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee