DE69120112D1 - Photoelektrisches Konverter-Modul - Google Patents
Photoelektrisches Konverter-ModulInfo
- Publication number
- DE69120112D1 DE69120112D1 DE69120112T DE69120112T DE69120112D1 DE 69120112 D1 DE69120112 D1 DE 69120112D1 DE 69120112 T DE69120112 T DE 69120112T DE 69120112 T DE69120112 T DE 69120112T DE 69120112 D1 DE69120112 D1 DE 69120112D1
- Authority
- DE
- Germany
- Prior art keywords
- photoelectric converter
- converter module
- photoelectric
- module
- converter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2062969A JP3067151B2 (ja) | 1990-03-13 | 1990-03-13 | 光電気変換素子サブキャリア |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69120112D1 true DE69120112D1 (de) | 1996-07-18 |
DE69120112T2 DE69120112T2 (de) | 1996-10-31 |
Family
ID=13215682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69120112T Expired - Fee Related DE69120112T2 (de) | 1990-03-13 | 1991-03-13 | Photoelektrisches Konverter-Modul |
Country Status (4)
Country | Link |
---|---|
US (1) | US5132532A (de) |
EP (1) | EP0447201B1 (de) |
JP (1) | JP3067151B2 (de) |
DE (1) | DE69120112T2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2568646Y2 (ja) * | 1991-11-27 | 1998-04-15 | 日本電気株式会社 | 光電気回路用チップキャリア |
US5337217A (en) * | 1993-02-25 | 1994-08-09 | Eastman Kodak Company | Integrated circuit package for an image sensor |
BE1007779A3 (nl) * | 1993-11-25 | 1995-10-17 | Philips Electronics Nv | Opto-electronische halfgeleiderinrichting met een straling-emitterende halfgeleiderdiode en werkwijze van een dergelijke inrichting. |
DE4342840C2 (de) * | 1993-12-10 | 1995-09-28 | Siemens Ag | Elektrooptisches Modul |
JP3047735B2 (ja) * | 1994-05-16 | 2000-06-05 | 住友電気工業株式会社 | 光受信モジュ−ルとその製造方法 |
DE4444311A1 (de) * | 1994-12-13 | 1996-06-20 | Siemens Ag | Elektrooptisches Modul mit einer Vielzahl optischer Anschlüsse |
DE69632228T2 (de) * | 1995-07-13 | 2005-04-14 | Eastman Kodak Co. | Bildsensor mit einem Trägergehäuse |
US5861654A (en) * | 1995-11-28 | 1999-01-19 | Eastman Kodak Company | Image sensor assembly |
JP3199611B2 (ja) * | 1995-08-09 | 2001-08-20 | 京セラ株式会社 | 光半導体素子収納用パッケージ |
JP3745860B2 (ja) * | 1996-05-28 | 2006-02-15 | 古河電気工業株式会社 | 光半導体素子用パッケージおよびその製法 |
US5841178A (en) * | 1996-10-04 | 1998-11-24 | Lucent Technologies Inc. | Optical component package |
US6020628A (en) * | 1997-07-21 | 2000-02-01 | Olin Corporation | Optical component package with a hermetic seal |
US6031253A (en) * | 1997-09-30 | 2000-02-29 | Kyocera Corporation | Package for housing photosemiconductor device |
US6511236B1 (en) | 1999-09-07 | 2003-01-28 | Intel Corporation | Optoelectronic assembly and method for fabricating the same |
US6227724B1 (en) | 1999-01-11 | 2001-05-08 | Lightlogic, Inc. | Method for constructing an optoelectronic assembly |
US6207950B1 (en) * | 1999-01-11 | 2001-03-27 | Lightlogic, Inc. | Optical electronic assembly having a flexure for maintaining alignment between optical elements |
US6585427B2 (en) | 1999-01-11 | 2003-07-01 | Intel Corporation | Flexure coupled to a substrate for maintaining the optical fibers in alignment |
JP4187376B2 (ja) * | 2000-02-16 | 2008-11-26 | ローム株式会社 | 受光増幅装置 |
DE10125374C1 (de) * | 2001-05-23 | 2003-01-16 | Osram Opto Semiconductors Gmbh | Gehäuse für einen elektromagnetische Strahlung emittierenden Halbleiterchip und Verfahren zu dessen Herstellung |
JP3703737B2 (ja) * | 2001-05-30 | 2005-10-05 | 住友電気工業株式会社 | 光半導体気密封止容器及び光半導体モジュール |
JP2003163403A (ja) * | 2001-11-29 | 2003-06-06 | Mitsubishi Electric Corp | 光素子モジュール |
JP4028270B2 (ja) * | 2002-03-19 | 2007-12-26 | 古河電気工業株式会社 | 光モジュール |
US7090412B2 (en) * | 2002-08-02 | 2006-08-15 | Sumitomo Electric Industries, Ltd. | Optical module |
CN1711646A (zh) * | 2002-11-19 | 2005-12-21 | 布克哈姆技术公共有限公司 | 一种光学元件固定和连接机构 |
DE10322071A1 (de) * | 2003-05-15 | 2004-09-02 | Infineon Technologies Ag | Mikrooptikmodul mit Gehäuse und Verfahren zur Herstellung desselben |
JP5378915B2 (ja) * | 2009-08-31 | 2013-12-25 | 日本オクラロ株式会社 | 光受信モジュール及び光受信器 |
JP5226856B1 (ja) * | 2011-12-26 | 2013-07-03 | 株式会社フジクラ | レーザモジュール及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3151278A (en) * | 1960-08-22 | 1964-09-29 | Amphenol Borg Electronics Corp | Electronic circuit module with weldable terminals |
FR2440009A1 (fr) * | 1978-10-25 | 1980-05-23 | Souriau & Cie | Embout-recepteur, connecteur optique et photodiode perfectionnee pour un tel embout-recepteur |
CA1267468C (en) * | 1983-11-21 | 1990-04-03 | OPTICS MOUNTING | |
US4587421A (en) * | 1984-04-19 | 1986-05-06 | Hei, Inc. | Photo-optic transducing head assembly |
JPS63176A (ja) * | 1986-06-19 | 1988-01-05 | Honda Motor Co Ltd | 複合型光センサ |
JPS63229765A (ja) * | 1987-03-18 | 1988-09-26 | Fujitsu Ltd | 赤外線検知器 |
JPH0258008A (ja) * | 1988-08-24 | 1990-02-27 | Sumitomo Electric Ind Ltd | 光モジュール |
-
1990
- 1990-03-13 JP JP2062969A patent/JP3067151B2/ja not_active Expired - Lifetime
-
1991
- 1991-03-13 US US07/669,438 patent/US5132532A/en not_active Expired - Fee Related
- 1991-03-13 DE DE69120112T patent/DE69120112T2/de not_active Expired - Fee Related
- 1991-03-13 EP EP91302099A patent/EP0447201B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0447201A3 (en) | 1991-10-23 |
US5132532A (en) | 1992-07-21 |
EP0447201A2 (de) | 1991-09-18 |
DE69120112T2 (de) | 1996-10-31 |
JP3067151B2 (ja) | 2000-07-17 |
EP0447201B1 (de) | 1996-06-12 |
JPH03263377A (ja) | 1991-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |