DE69118548D1 - Verfahren zur leiterplattenreinigung mittels wasser - Google Patents
Verfahren zur leiterplattenreinigung mittels wasserInfo
- Publication number
- DE69118548D1 DE69118548D1 DE69118548T DE69118548T DE69118548D1 DE 69118548 D1 DE69118548 D1 DE 69118548D1 DE 69118548 T DE69118548 T DE 69118548T DE 69118548 T DE69118548 T DE 69118548T DE 69118548 D1 DE69118548 D1 DE 69118548D1
- Authority
- DE
- Germany
- Prior art keywords
- boiling point
- acid
- water
- alcohols
- point alcohols
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Processing Of Solid Wastes (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/583,629 US5092943A (en) | 1990-09-17 | 1990-09-17 | Method of cleaning printed circuit boards using water |
PCT/US1991/005759 WO1992005008A1 (en) | 1990-09-17 | 1991-08-13 | Method of cleaning printed circuit boards using water |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69118548D1 true DE69118548D1 (de) | 1996-05-09 |
DE69118548T2 DE69118548T2 (de) | 1996-10-31 |
Family
ID=24333925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69118548T Expired - Fee Related DE69118548T2 (de) | 1990-09-17 | 1991-08-13 | Verfahren zur leiterplattenreinigung mittels wasser |
Country Status (5)
Country | Link |
---|---|
US (1) | US5092943A (de) |
EP (1) | EP0549616B1 (de) |
AT (1) | ATE136243T1 (de) |
DE (1) | DE69118548T2 (de) |
WO (1) | WO1992005008A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1995020460A1 (en) * | 1994-01-27 | 1995-08-03 | Indium Corporation Of America | Solder paste utilizing aromatic carboxylic acids |
US5507882A (en) * | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
US5615827A (en) * | 1994-05-31 | 1997-04-01 | International Business Machines Corporation | Flux composition and corresponding soldering method |
US5443660A (en) * | 1994-10-24 | 1995-08-22 | Ford Motor Company | Water-based no-clean flux formulation |
US5447577A (en) * | 1994-10-24 | 1995-09-05 | Ford Motor Company | Carbon dioxide-based fluxing media for non-VOC, no-clean soldering |
DE69635203T2 (de) * | 1995-07-11 | 2006-06-29 | Delphi Technologies, Inc., Troy | Beschichtungen und Verfahren, insbesondere für Leiterplatten |
US5958151A (en) * | 1996-07-22 | 1999-09-28 | Ford Global Technologies, Inc. | Fluxing media for non-VOC, no-clean soldering |
JP3785435B2 (ja) * | 1998-08-27 | 2006-06-14 | 株式会社デンソー | はんだペーストおよび表面実装型電子装置 |
US6585150B1 (en) | 2000-10-12 | 2003-07-01 | International Business Machines Corporation | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2898255A (en) * | 1958-06-30 | 1959-08-04 | Ibm | Soldering flux composition |
US3436278A (en) * | 1966-08-08 | 1969-04-01 | Ibm | Glycol soldering fluxes |
US3734791A (en) * | 1970-10-23 | 1973-05-22 | Ibm | Surfactant-containing soldering fluxes |
US3796610A (en) * | 1972-09-28 | 1974-03-12 | Ibm | Glycerol soldering fluxes |
US4460414A (en) * | 1983-10-31 | 1984-07-17 | Scm Corporation | Solder paste and vehicle therefor |
US4541876A (en) * | 1983-10-31 | 1985-09-17 | Scm Corporation | Nonaqueous powdered metal paste composition |
US4601763A (en) * | 1984-10-11 | 1986-07-22 | Lgz Landis & Gyr Zug Ag | Method for the mechanical soft-soldering of heavy metals utilizing a fluxing agent |
US4708751A (en) * | 1984-12-14 | 1987-11-24 | Alpha Grillo-Lotsysteme Gmbh | Halogen-free foam fluxes |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
US4738732A (en) * | 1987-02-04 | 1988-04-19 | Hughes Aircraft Co. | Self cleaning liquid solder flux |
US4940498A (en) * | 1989-08-14 | 1990-07-10 | Multicore Solders Limited | Flux composition |
US5064481A (en) * | 1990-05-17 | 1991-11-12 | Motorola, Inc. | Use or organic acids in low residue solder pastes |
-
1990
- 1990-09-17 US US07/583,629 patent/US5092943A/en not_active Expired - Fee Related
-
1991
- 1991-08-13 EP EP91915385A patent/EP0549616B1/de not_active Expired - Lifetime
- 1991-08-13 AT AT91915385T patent/ATE136243T1/de not_active IP Right Cessation
- 1991-08-13 WO PCT/US1991/005759 patent/WO1992005008A1/en active IP Right Grant
- 1991-08-13 DE DE69118548T patent/DE69118548T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0549616B1 (de) | 1996-04-03 |
US5092943A (en) | 1992-03-03 |
WO1992005008A1 (en) | 1992-04-02 |
ATE136243T1 (de) | 1996-04-15 |
DE69118548T2 (de) | 1996-10-31 |
EP0549616A4 (de) | 1994-01-19 |
EP0549616A1 (de) | 1993-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |