DE69115756D1 - Röntgenbelichtungsvorrichtung und eine darin verwendbare Maske - Google Patents

Röntgenbelichtungsvorrichtung und eine darin verwendbare Maske

Info

Publication number
DE69115756D1
DE69115756D1 DE69115756T DE69115756T DE69115756D1 DE 69115756 D1 DE69115756 D1 DE 69115756D1 DE 69115756 T DE69115756 T DE 69115756T DE 69115756 T DE69115756 T DE 69115756T DE 69115756 D1 DE69115756 D1 DE 69115756D1
Authority
DE
Germany
Prior art keywords
exposure device
ray exposure
mask usable
usable
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115756T
Other languages
English (en)
Other versions
DE69115756T2 (de
Inventor
Shinichi Hara
Mitsuaki Amemiya
Shunichi Uzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69115756D1 publication Critical patent/DE69115756D1/de
Application granted granted Critical
Publication of DE69115756T2 publication Critical patent/DE69115756T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69115756T 1990-05-21 1991-05-17 Röntgenbelichtungsvorrichtung und eine darin verwendbare Maske Expired - Fee Related DE69115756T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2129240A JP2958913B2 (ja) 1990-05-21 1990-05-21 Ｘ線露光装置

Publications (2)

Publication Number Publication Date
DE69115756D1 true DE69115756D1 (de) 1996-02-08
DE69115756T2 DE69115756T2 (de) 1996-05-15

Family

ID=15004659

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115756T Expired - Fee Related DE69115756T2 (de) 1990-05-21 1991-05-17 Röntgenbelichtungsvorrichtung und eine darin verwendbare Maske

Country Status (4)

Country Link
US (1) US5323440A (de)
EP (1) EP0458539B1 (de)
JP (1) JP2958913B2 (de)
DE (1) DE69115756T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593800A (en) * 1994-01-06 1997-01-14 Canon Kabushiki Kaisha Mask manufacturing method and apparatus and device manufacturing method using a mask manufactured by the method or apparatus
JP3666951B2 (ja) 1995-10-06 2005-06-29 キヤノン株式会社 マーク検出方法、これを用いた位置合わせ方法、露光方法及び装置、ならびにデバイス生産方法
US5854819A (en) * 1996-02-07 1998-12-29 Canon Kabushiki Kaisha Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same
JP3814359B2 (ja) 1996-03-12 2006-08-30 キヤノン株式会社 Ｘ線投影露光装置及びデバイス製造方法
JP3728015B2 (ja) * 1996-06-12 2005-12-21 キヤノン株式会社 電子ビーム露光システム及びそれを用いたデバイス製造方法
US6268228B1 (en) * 1999-01-27 2001-07-31 International Business Machines Corporation Electrical mask identification of memory modules
JP3873696B2 (ja) * 2001-09-18 2007-01-24 株式会社日立製作所 電力半導体モジュール及び電力変換装置
DE10352639B4 (de) * 2003-11-11 2007-03-01 Infineon Technologies Ag Verfahren zur dynamischen Kontrolle eines Reticles
KR20050063439A (ko) 2003-12-22 2005-06-28 삼성전자주식회사 레티클 관리 방법 및 시스템
JP2011040460A (ja) * 2009-08-07 2011-02-24 Toshiba Corp 露光装置、及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3485291D1 (de) * 1983-03-29 1992-01-09 Toshiba Kawasaki Kk Verfahren fuer die herstellung mittels projektion einer integrierten schaltungsabbildung auf einer halbleiterplatte.
JPS60201626A (ja) * 1984-03-27 1985-10-12 Canon Inc 位置合わせ装置
JPH0666241B2 (ja) * 1985-10-14 1994-08-24 株式会社日立製作所 位置検出方法
JPH0820518B2 (ja) * 1987-02-26 1996-03-04 キヤノン株式会社 露光装置
US4804978A (en) * 1988-02-19 1989-02-14 The Perkin-Elmer Corporation Exposure control system for full field photolithography using pulsed sources
JPH0276212A (ja) * 1988-09-13 1990-03-15 Canon Inc 多重露光方法
US5112724A (en) * 1989-11-30 1992-05-12 Texas Instruments Incorporated Lithographic method

Also Published As

Publication number Publication date
JP2958913B2 (ja) 1999-10-06
US5323440A (en) 1994-06-21
JPH0425106A (ja) 1992-01-28
EP0458539A3 (en) 1992-06-03
EP0458539A2 (de) 1991-11-27
EP0458539B1 (de) 1995-12-27
DE69115756T2 (de) 1996-05-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee