DE69115378T2 - Verfahren zur Herstellung eines Halbleiterlasers - Google Patents
Verfahren zur Herstellung eines HalbleiterlasersInfo
- Publication number
- DE69115378T2 DE69115378T2 DE69115378T DE69115378T DE69115378T2 DE 69115378 T2 DE69115378 T2 DE 69115378T2 DE 69115378 T DE69115378 T DE 69115378T DE 69115378 T DE69115378 T DE 69115378T DE 69115378 T2 DE69115378 T2 DE 69115378T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- semiconductor laser
- laser
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
- H01S5/164—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions comprising semiconductor material with a wider bandgap than the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0281—Coatings made of semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/028—Coatings ; Treatment of the laser facets, e.g. etching, passivation layers or reflecting layers
- H01S5/0282—Passivation layers or treatments
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2205507A JP2680917B2 (ja) | 1990-08-01 | 1990-08-01 | 半導体レーザ素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69115378D1 DE69115378D1 (de) | 1996-01-25 |
DE69115378T2 true DE69115378T2 (de) | 1996-06-05 |
Family
ID=16508010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69115378T Expired - Fee Related DE69115378T2 (de) | 1990-08-01 | 1991-08-01 | Verfahren zur Herstellung eines Halbleiterlasers |
Country Status (4)
Country | Link |
---|---|
US (1) | US5171706A (de) |
EP (1) | EP0469900B1 (de) |
JP (1) | JP2680917B2 (de) |
DE (1) | DE69115378T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10323860A1 (de) * | 2003-03-28 | 2004-11-11 | Osram Opto Semiconductors Gmbh | Halbleiterlaservorrichtung und Herstellungsverfahren |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5358898A (en) * | 1989-07-15 | 1994-10-25 | Fujitsu Limited | Method of making a tunable laser diode having a distributed feedback structure |
US5413956A (en) * | 1992-03-04 | 1995-05-09 | Sharp Kabushiki Kaisha | Method for producing a semiconductor laser device |
EP0637862A3 (de) * | 1993-08-05 | 1995-05-24 | Hitachi Ltd | Halbleiterlaservorrichtung und Herstellungsverfahren. |
JPH07111357A (ja) * | 1993-10-05 | 1995-04-25 | Mitsubishi Electric Corp | 半導体レーザの製造方法 |
BE1007661A3 (nl) * | 1993-10-18 | 1995-09-05 | Philips Electronics Nv | Werkwijze ter vervaardiging van een straling-emitterende halfgeleiderdiode. |
US5814533A (en) * | 1994-08-09 | 1998-09-29 | Rohm Co., Ltd. | Semiconductor light emitting element and manufacturing method therefor |
JP3734849B2 (ja) * | 1995-05-08 | 2006-01-11 | 三菱電機株式会社 | 半導体レーザ装置の製造方法 |
US5684319A (en) * | 1995-08-24 | 1997-11-04 | National Semiconductor Corporation | Self-aligned source and body contact structure for high performance DMOS transistors and method of fabricating same |
DE19537545A1 (de) * | 1995-10-09 | 1997-04-10 | Telefunken Microelectron | Verfahren zur Herstellung einer Lumineszenzdiode |
US5668049A (en) * | 1996-07-31 | 1997-09-16 | Lucent Technologies Inc. | Method of making a GaAs-based laser comprising a facet coating with gas phase sulphur |
JPH10223992A (ja) * | 1997-01-31 | 1998-08-21 | Oki Electric Ind Co Ltd | 半導体素子製造方法 |
JPH10242557A (ja) * | 1997-02-21 | 1998-09-11 | Sony Corp | 半導体発光装置の製造方法 |
KR100767658B1 (ko) * | 2000-05-04 | 2007-10-17 | 엘지전자 주식회사 | 질화물 발광소자 제조 방법 |
DE60238195D1 (de) * | 2001-05-31 | 2010-12-16 | Nichia Corp | Halbleiterlaserelement |
JP2003195082A (ja) * | 2001-12-26 | 2003-07-09 | Hitachi Cable Ltd | 溝部の形成方法および光導波路素子の製造方法 |
EP1520329A2 (de) * | 2002-06-26 | 2005-04-06 | AMMONO Sp.z o.o. | Nitrid halbleiterlaservorrichtung und verfahren zur leistungsverbesserung |
US20070254111A1 (en) * | 2006-04-26 | 2007-11-01 | Lineton Warran B | Method for forming a tribologically enhanced surface using laser treating |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5946113A (ja) * | 1982-09-06 | 1984-03-15 | Mitsubishi Heavy Ind Ltd | ガス処理装置のシ−ル方法 |
JPS6058692A (ja) * | 1983-09-12 | 1985-04-04 | Nec Corp | 半導体レ−ザ素子の製造方法 |
JPS61265888A (ja) * | 1985-05-20 | 1986-11-25 | Nec Corp | 半導体レ−ザの製造方法 |
JPS62238678A (ja) * | 1986-04-09 | 1987-10-19 | Fujitsu Ltd | 半導体発光装置 |
US4751201A (en) * | 1987-03-04 | 1988-06-14 | Bell Communications Research, Inc. | Passivation of gallium arsenide devices with sodium sulfide |
JP2740170B2 (ja) * | 1987-08-06 | 1998-04-15 | 日本電気株式会社 | 半導体レーザの共振器製造方法 |
US4843037A (en) * | 1987-08-21 | 1989-06-27 | Bell Communications Research, Inc. | Passivation of indium gallium arsenide surfaces |
US4871692A (en) * | 1988-09-30 | 1989-10-03 | Lee Hong H | Passivation of group III-V surfaces |
DE69033959T2 (de) * | 1989-02-03 | 2002-10-31 | Sharp Kk | Halbleiterlaser-Vorrichtung und Verfahren zu ihrer Herstellung |
-
1990
- 1990-08-01 JP JP2205507A patent/JP2680917B2/ja not_active Expired - Fee Related
-
1991
- 1991-08-01 US US07/739,767 patent/US5171706A/en not_active Expired - Lifetime
- 1991-08-01 DE DE69115378T patent/DE69115378T2/de not_active Expired - Fee Related
- 1991-08-01 EP EP91307060A patent/EP0469900B1/de not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10323860A1 (de) * | 2003-03-28 | 2004-11-11 | Osram Opto Semiconductors Gmbh | Halbleiterlaservorrichtung und Herstellungsverfahren |
Also Published As
Publication number | Publication date |
---|---|
JP2680917B2 (ja) | 1997-11-19 |
EP0469900A3 (en) | 1992-04-15 |
JPH0491484A (ja) | 1992-03-24 |
DE69115378D1 (de) | 1996-01-25 |
EP0469900A2 (de) | 1992-02-05 |
EP0469900B1 (de) | 1995-12-13 |
US5171706A (en) | 1992-12-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |