DE69111327D1 - Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung. - Google Patents
Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung.Info
- Publication number
- DE69111327D1 DE69111327D1 DE69111327T DE69111327T DE69111327D1 DE 69111327 D1 DE69111327 D1 DE 69111327D1 DE 69111327 T DE69111327 T DE 69111327T DE 69111327 T DE69111327 T DE 69111327T DE 69111327 D1 DE69111327 D1 DE 69111327D1
- Authority
- DE
- Germany
- Prior art keywords
- micro
- production
- block
- connecting pins
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2202936A JP2536676B2 (ja) | 1990-07-30 | 1990-07-30 | マイクロピン集合体及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69111327D1 true DE69111327D1 (de) | 1995-08-24 |
DE69111327T2 DE69111327T2 (de) | 1996-04-04 |
Family
ID=16465616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69111327T Expired - Fee Related DE69111327T2 (de) | 1990-07-30 | 1991-07-26 | Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5364276A (de) |
EP (1) | EP0469798B1 (de) |
JP (1) | JP2536676B2 (de) |
CA (1) | CA2048170C (de) |
DE (1) | DE69111327T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3442895B2 (ja) * | 1994-07-04 | 2003-09-02 | 新光電気工業株式会社 | 基板製造用焼成体、基板およびその製造方法 |
US6000126A (en) * | 1996-03-29 | 1999-12-14 | General Dynamics Information Systems, Inc. | Method and apparatus for connecting area grid arrays to printed wire board |
JP3420435B2 (ja) * | 1996-07-09 | 2003-06-23 | 松下電器産業株式会社 | 基板の製造方法、半導体装置及び半導体装置の製造方法 |
JP3179503B2 (ja) * | 1996-08-08 | 2001-06-25 | 日東電工株式会社 | 異方導電性フィルムおよびその製造方法 |
US6039580A (en) * | 1998-07-16 | 2000-03-21 | Raytheon Company | RF connector having a compliant contact |
ID26505A (id) * | 1998-11-02 | 2001-01-11 | Ngk Insulators Ltd | Metode pelurusan kabel tiga-dimensi dan aparatusnya serta metode pembuatan bahan konduktif listrik |
DE10118816A1 (de) * | 2000-04-18 | 2001-10-31 | Nitto Denko Corp | Herstellungsverfahren für eine anisotrope leitfähige Folie und nach diesem Verfahren hergestellte anisotrope leitfähige Folie |
US6802918B1 (en) * | 2001-05-09 | 2004-10-12 | Raytheon Company | Fabrication method for adhesive pressure bonding two components together with closed-loop control |
DE10215654A1 (de) * | 2002-04-09 | 2003-11-06 | Infineon Technologies Ag | Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung |
JP2004146210A (ja) * | 2002-10-24 | 2004-05-20 | Fuji Polymer Industries Co Ltd | 異方導電性エラスチックコネクタ |
JP4260871B1 (ja) * | 2008-05-02 | 2009-04-30 | 株式会社 水口研究所 | プローブカード |
JP5511557B2 (ja) * | 2010-07-08 | 2014-06-04 | セイコーインスツル株式会社 | ガラス基板の製造方法及び電子部品の製造方法 |
JP2012019108A (ja) * | 2010-07-08 | 2012-01-26 | Seiko Instruments Inc | ガラス基板の製造方法及び電子部品の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3893233A (en) * | 1971-06-11 | 1975-07-08 | Amp Inc | Method of connecting a contact pin to laminated bus bars |
BE794428A (fr) * | 1972-01-29 | 1973-07-23 | Amp Inc | Connecteur electrique et son procede de fabrication |
NL158033B (nl) * | 1974-02-27 | 1978-09-15 | Amp Inc | Verbetering van een elektrisch verbindingsorgaan voor het losneembaar verbinden van twee vaste contactdragers en werkwijze voor het vervaardigen van zulk een elektrisch verbindingsorgaan. |
JPS5836513B2 (ja) * | 1974-05-10 | 1983-08-09 | 東レ株式会社 | 積層片コネクタ−とその製造方法 |
US4199209A (en) * | 1978-08-18 | 1980-04-22 | Amp Incorporated | Electrical interconnecting device |
JPS568081U (de) * | 1979-06-29 | 1981-01-23 | ||
AU553463B2 (en) * | 1981-07-06 | 1986-07-17 | Honeywell Information Systems | High density connector |
US4754546A (en) * | 1985-07-22 | 1988-07-05 | Digital Equipment Corporation | Electrical connector for surface mounting and method of making thereof |
JPS6224916A (ja) * | 1985-07-22 | 1987-02-02 | Masahiko Suzuki | 放電加工による表面層の形成方法 |
US4729166A (en) * | 1985-07-22 | 1988-03-08 | Digital Equipment Corporation | Method of fabricating electrical connector for surface mounting |
JPH0658700B2 (ja) * | 1985-08-05 | 1994-08-03 | 三洋電機株式会社 | 自動販売機の商品送出装置 |
JPH0812716B2 (ja) * | 1985-08-06 | 1996-02-07 | 大日本印刷株式会社 | サービススタンプカードシステム |
JPS6328515A (ja) * | 1986-07-18 | 1988-02-06 | Hitachi Seiko Ltd | ワイヤ放電加工機の位置補正方法 |
JP2810101B2 (ja) * | 1989-04-17 | 1998-10-15 | 日本エー・エム・ピー株式会社 | 電気ピンおよびその製造方法 |
US4999460A (en) * | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
-
1990
- 1990-07-30 JP JP2202936A patent/JP2536676B2/ja not_active Expired - Lifetime
-
1991
- 1991-07-26 EP EP91306834A patent/EP0469798B1/de not_active Expired - Lifetime
- 1991-07-26 DE DE69111327T patent/DE69111327T2/de not_active Expired - Fee Related
- 1991-07-30 CA CA002048170A patent/CA2048170C/en not_active Expired - Fee Related
-
1993
- 1993-04-30 US US08/054,834 patent/US5364276A/en not_active Expired - Lifetime
-
1994
- 1994-05-24 US US08/248,159 patent/US5460677A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2048170C (en) | 1996-07-30 |
US5460677A (en) | 1995-10-24 |
EP0469798B1 (de) | 1995-07-19 |
JP2536676B2 (ja) | 1996-09-18 |
JPH0487355A (ja) | 1992-03-19 |
EP0469798A2 (de) | 1992-02-05 |
DE69111327T2 (de) | 1996-04-04 |
EP0469798A3 (en) | 1993-01-13 |
CA2048170A1 (en) | 1992-01-31 |
US5364276A (en) | 1994-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |