DE69111327T2 - Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung. - Google Patents

Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung.

Info

Publication number
DE69111327T2
DE69111327T2 DE69111327T DE69111327T DE69111327T2 DE 69111327 T2 DE69111327 T2 DE 69111327T2 DE 69111327 T DE69111327 T DE 69111327T DE 69111327 T DE69111327 T DE 69111327T DE 69111327 T2 DE69111327 T2 DE 69111327T2
Authority
DE
Germany
Prior art keywords
micro
production
block
connecting pins
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69111327T
Other languages
English (en)
Other versions
DE69111327D1 (de
Inventor
Jun Inasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69111327D1 publication Critical patent/DE69111327D1/de
Publication of DE69111327T2 publication Critical patent/DE69111327T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
DE69111327T 1990-07-30 1991-07-26 Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung. Expired - Fee Related DE69111327T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2202936A JP2536676B2 (ja) 1990-07-30 1990-07-30 マイクロピン集合体及びその製造方法

Publications (2)

Publication Number Publication Date
DE69111327D1 DE69111327D1 (de) 1995-08-24
DE69111327T2 true DE69111327T2 (de) 1996-04-04

Family

ID=16465616

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69111327T Expired - Fee Related DE69111327T2 (de) 1990-07-30 1991-07-26 Block von Mikroverbindungsstiften und Verfahren zu dessen Herstellung.

Country Status (5)

Country Link
US (2) US5364276A (de)
EP (1) EP0469798B1 (de)
JP (1) JP2536676B2 (de)
CA (1) CA2048170C (de)
DE (1) DE69111327T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3442895B2 (ja) * 1994-07-04 2003-09-02 新光電気工業株式会社 基板製造用焼成体、基板およびその製造方法
US6000126A (en) * 1996-03-29 1999-12-14 General Dynamics Information Systems, Inc. Method and apparatus for connecting area grid arrays to printed wire board
JP3420435B2 (ja) * 1996-07-09 2003-06-23 松下電器産業株式会社 基板の製造方法、半導体装置及び半導体装置の製造方法
WO1998007216A1 (fr) 1996-08-08 1998-02-19 Nitto Denko Corporation Film conducteur anisotrope et procede de fabrication
US6039580A (en) * 1998-07-16 2000-03-21 Raytheon Company RF connector having a compliant contact
US6401333B1 (en) 1998-11-02 2002-06-11 Ngk Insulators, Ltd. Method and device for three-dimensional arrangement of wire and method of manufacturing conductive material
DE10118816A1 (de) 2000-04-18 2001-10-31 Nitto Denko Corp Herstellungsverfahren für eine anisotrope leitfähige Folie und nach diesem Verfahren hergestellte anisotrope leitfähige Folie
US6802918B1 (en) * 2001-05-09 2004-10-12 Raytheon Company Fabrication method for adhesive pressure bonding two components together with closed-loop control
DE10215654A1 (de) * 2002-04-09 2003-11-06 Infineon Technologies Ag Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung
JP2004146210A (ja) * 2002-10-24 2004-05-20 Fuji Polymer Industries Co Ltd 異方導電性エラスチックコネクタ
JP4260871B1 (ja) * 2008-05-02 2009-04-30 株式会社 水口研究所 プローブカード
JP2012019108A (ja) * 2010-07-08 2012-01-26 Seiko Instruments Inc ガラス基板の製造方法及び電子部品の製造方法
JP5511557B2 (ja) * 2010-07-08 2014-06-04 セイコーインスツル株式会社 ガラス基板の製造方法及び電子部品の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3893233A (en) * 1971-06-11 1975-07-08 Amp Inc Method of connecting a contact pin to laminated bus bars
BE794428A (fr) * 1972-01-29 1973-07-23 Amp Inc Connecteur electrique et son procede de fabrication
NL158033B (nl) * 1974-02-27 1978-09-15 Amp Inc Verbetering van een elektrisch verbindingsorgaan voor het losneembaar verbinden van twee vaste contactdragers en werkwijze voor het vervaardigen van zulk een elektrisch verbindingsorgaan.
CA1056031A (en) * 1974-05-10 1979-06-05 Leonard S. Buchoff Layered strip connector
US4199209A (en) * 1978-08-18 1980-04-22 Amp Incorporated Electrical interconnecting device
JPS568081U (de) * 1979-06-29 1981-01-23
AU553463B2 (en) * 1981-07-06 1986-07-17 Honeywell Information Systems High density connector
US4729166A (en) * 1985-07-22 1988-03-08 Digital Equipment Corporation Method of fabricating electrical connector for surface mounting
JPS6224916A (ja) * 1985-07-22 1987-02-02 Masahiko Suzuki 放電加工による表面層の形成方法
US4754546A (en) * 1985-07-22 1988-07-05 Digital Equipment Corporation Electrical connector for surface mounting and method of making thereof
JPH0658700B2 (ja) * 1985-08-05 1994-08-03 三洋電機株式会社 自動販売機の商品送出装置
JPH0812716B2 (ja) * 1985-08-06 1996-02-07 大日本印刷株式会社 サービススタンプカードシステム
JPS6328515A (ja) * 1986-07-18 1988-02-06 Hitachi Seiko Ltd ワイヤ放電加工機の位置補正方法
JP2810101B2 (ja) * 1989-04-17 1998-10-15 日本エー・エム・ピー株式会社 電気ピンおよびその製造方法
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure

Also Published As

Publication number Publication date
US5460677A (en) 1995-10-24
EP0469798A2 (de) 1992-02-05
EP0469798A3 (en) 1993-01-13
US5364276A (en) 1994-11-15
EP0469798B1 (de) 1995-07-19
DE69111327D1 (de) 1995-08-24
JP2536676B2 (ja) 1996-09-18
JPH0487355A (ja) 1992-03-19
CA2048170C (en) 1996-07-30
CA2048170A1 (en) 1992-01-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee