DE69110961T2 - Optischer Schaltkreis für Oberflächenmontage, Substrat dafür und seine Herstellungsmethode. - Google Patents

Optischer Schaltkreis für Oberflächenmontage, Substrat dafür und seine Herstellungsmethode.

Info

Publication number
DE69110961T2
DE69110961T2 DE69110961T DE69110961T DE69110961T2 DE 69110961 T2 DE69110961 T2 DE 69110961T2 DE 69110961 T DE69110961 T DE 69110961T DE 69110961 T DE69110961 T DE 69110961T DE 69110961 T2 DE69110961 T2 DE 69110961T2
Authority
DE
Germany
Prior art keywords
manufacture
surface mount
optical circuit
substrate therefor
mount optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69110961T
Other languages
English (en)
Other versions
DE69110961D1 (de
Inventor
Teiji Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2113964A external-priority patent/JP2857222B2/ja
Priority claimed from JP2113963A external-priority patent/JP2857221B2/ja
Priority claimed from JP2176526A external-priority patent/JPH0766089B2/ja
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE69110961D1 publication Critical patent/DE69110961D1/de
Publication of DE69110961T2 publication Critical patent/DE69110961T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE69110961T 1990-04-27 1991-04-29 Optischer Schaltkreis für Oberflächenmontage, Substrat dafür und seine Herstellungsmethode. Expired - Lifetime DE69110961T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2113964A JP2857222B2 (ja) 1990-04-27 1990-04-27 光電子集積デバイス
JP11396290 1990-04-27
JP2113963A JP2857221B2 (ja) 1990-04-27 1990-04-27 光表面実装回路及びその光部品
JP2176526A JPH0766089B2 (ja) 1990-04-27 1990-07-05 光表面実装回路用基板の製造方法

Publications (2)

Publication Number Publication Date
DE69110961D1 DE69110961D1 (de) 1995-08-10
DE69110961T2 true DE69110961T2 (de) 1995-12-21

Family

ID=27470130

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69110961T Expired - Lifetime DE69110961T2 (de) 1990-04-27 1991-04-29 Optischer Schaltkreis für Oberflächenmontage, Substrat dafür und seine Herstellungsmethode.

Country Status (3)

Country Link
US (1) US5195154A (de)
EP (1) EP0454502B1 (de)
DE (1) DE69110961T2 (de)

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EP0548440A1 (de) * 1991-12-23 1993-06-30 International Business Machines Corporation Zweiteilige Zusammensetzung für optoelektronische Integration
US5282071A (en) * 1992-07-13 1994-01-25 Motorola, Inc. Contact areas on an optical waveguide and method of making
US5384873A (en) * 1993-10-04 1995-01-24 Motorola, Inc. Optical interface unit and method of making
IT1291779B1 (it) 1997-02-17 1999-01-21 Magnetek Spa Procedimento per la realizzazione di circuiti stampati e circuiti stampati cosi'ottenuti
WO1999000806A2 (de) * 1997-06-27 1999-01-07 Kolb Elektro Sbw Ag Verfahren zum ausführen einer elektroinstallation und bausatz für elektroinstallation
US5876222A (en) * 1997-11-07 1999-03-02 Molex Incorporated Electrical connector for printed circuit boards
JP4129071B2 (ja) * 1998-03-20 2008-07-30 富士通株式会社 半導体部品および半導体実装装置
US6301401B1 (en) * 1999-04-02 2001-10-09 Convergence Technologies, Ltd. Electro-optical package for reducing parasitic effects
US6304695B1 (en) * 1999-05-17 2001-10-16 Chiaro Networks Ltd. Modulated light source
US6366720B1 (en) 1999-07-09 2002-04-02 Chiaro Networks Ltd. Integrated optics beam deflector assemblies utilizing side mounting blocks for precise alignment
DE10043353B4 (de) * 2000-08-29 2004-04-29 Infineon Technologies Ag Kopplungsanordnung
US7178994B2 (en) 2000-10-31 2007-02-20 Viasystems Group, Inc. Fiber optic circuit connector
EP1500961A3 (de) * 2000-10-31 2005-05-04 Viasystems Group, Inc. Faseroptische Leiterplatte und Verfahren zu deren optischen Verbindung durch Einbetten einer optischen Schnittstelle
US7079775B2 (en) * 2001-02-05 2006-07-18 Finisar Corporation Integrated memory mapped controller circuit for fiber optics transceiver
US6736552B2 (en) * 2001-07-03 2004-05-18 Intel Corporation Optically interconnecting integrated circuit chips
US6640021B2 (en) 2001-12-11 2003-10-28 International Business Machines Corporation Fabrication of a hybrid integrated circuit device including an optoelectronic chip
US6813023B2 (en) 2002-01-03 2004-11-02 Chiaro Nerwork Ltd. Automatic optical inter-alignment of two linear arrangements
GB0201969D0 (en) * 2002-01-29 2002-03-13 Qinetiq Ltd Integrated optics devices
US6944377B2 (en) * 2002-03-15 2005-09-13 Hitachi Maxell, Ltd. Optical communication device and laminated optical communication module
US6886994B2 (en) * 2002-07-18 2005-05-03 Chiaro Networks Ltd. Optical assembly and method for manufacture thereof
US20040064050A1 (en) * 2002-09-20 2004-04-01 Jun Liu System and method for screening tissue
DE112004000724B4 (de) * 2003-04-30 2021-08-05 Fujikura Ltd. Optischer Transceiver
JP4001900B2 (ja) * 2003-04-30 2007-10-31 株式会社フジクラ 光コネクタアッセンブリ
AT413891B (de) * 2003-12-29 2006-07-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
CN1645172A (zh) * 2004-01-22 2005-07-27 松下电器产业株式会社 光传送路基板、光传送路内置基板、及它们的制造方法
KR100679253B1 (ko) * 2004-09-10 2007-02-06 한국정보통신대학교 산학협력단 광 피씨비, 광 피씨비용 송수신 모듈 및 광연결블록연결구조
US7257295B2 (en) 2004-09-20 2007-08-14 Fujitsu Limited Attachment-type optical coupler apparatuses
CN101167005B (zh) * 2005-04-21 2010-10-06 日本电气株式会社 光背板连接器、光电转换模块和光背板
TW200709475A (en) * 2005-06-27 2007-03-01 Lamina Ceramics Inc Light emitting diode package and method for making same
JP2007187742A (ja) * 2006-01-11 2007-07-26 Fuji Xerox Co Ltd 光コネクタおよび基板
WO2009107908A1 (en) * 2008-02-26 2009-09-03 Icu Research And Industrial Cooperation Group A optical printed circuit board and a optical module connected to the optical printed circuit board
US8159956B2 (en) * 2008-07-01 2012-04-17 Finisar Corporation Diagnostics for serial communication busses
US9146348B2 (en) * 2011-01-07 2015-09-29 Panasonic Intellectual Property Management Co., Ltd. Optical-electrical composite flexible circuit substrate including optical circuit and electrical circuit
TWI548901B (zh) * 2012-03-28 2016-09-11 鴻海精密工業股份有限公司 光纖連接器機構件及光纖連接器
CN103364892B (zh) * 2012-03-28 2016-05-11 鸿富锦精密工业（深圳）有限公司 光纤连接器机构件及光纤连接器
US8606057B1 (en) * 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
CN115308850A (zh) * 2021-05-08 2022-11-08 鹏鼎控股(深圳)股份有限公司 光电复合电路板以及光电复合电路板的制作方法

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US4169001A (en) * 1976-10-18 1979-09-25 International Business Machines Corporation Method of making multilayer module having optical channels therein
JPS5758115A (en) * 1980-09-26 1982-04-07 Toshiba Corp Photocoupler
JPS6093923A (ja) * 1983-10-28 1985-05-25 Sumitomo Electric Ind Ltd 光電変換器
GB2162336B (en) * 1984-07-25 1988-07-13 Magnetic Controls Co Bi-directional optical fibre coupler
JPS61186908A (ja) * 1985-02-15 1986-08-20 Fujikura Ltd 光−電子複合積層基板装置
EP0219356B1 (de) * 1985-10-16 1989-12-06 BRITISH TELECOMMUNICATIONS public limited company Bewegliches Gehäuse für ein Element
DE3807606A1 (de) * 1988-03-09 1989-09-21 Fraunhofer Ges Forschung Verfahren zum herstellen eines doppelbrechenden streifenwellenleiters in einem integriert-optischen bauelement sowie ein nach dem verfahren hergestelltes integriert-optisches bauelement
US4930858A (en) * 1988-05-09 1990-06-05 Tektronix, Inc. Fiber optic mounting and alignment apparatus
US4930857A (en) * 1989-05-19 1990-06-05 At&T Bell Laboratories Hybrid package arrangement
ES2150409T3 (es) * 1989-05-31 2000-12-01 Osram Opto Semiconductors Gmbh Procedimiento para montar un opto-componente que se puede montar sobre una superficie.
EP0400175B1 (de) * 1989-05-31 1994-12-28 Siemens Aktiengesellschaft Oberflächenmontierbares Opto-Bauelement
US5011249A (en) * 1989-12-20 1991-04-30 Raychem Corp. Circuit for the transmission of optical signals

Also Published As

Publication number Publication date
EP0454502A1 (de) 1991-10-30
DE69110961D1 (de) 1995-08-10
EP0454502B1 (de) 1995-07-05
US5195154A (en) 1993-03-16

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