DE69009973D1 - Verfahren zur Behandlung einer Polyimidoberfläche im Hinblick auf eine anschliessend darauf aufzubringende Plattierung. - Google Patents

Verfahren zur Behandlung einer Polyimidoberfläche im Hinblick auf eine anschliessend darauf aufzubringende Plattierung.

Info

Publication number
DE69009973D1
DE69009973D1 DE69009973T DE69009973T DE69009973D1 DE 69009973 D1 DE69009973 D1 DE 69009973D1 DE 69009973 T DE69009973 T DE 69009973T DE 69009973 T DE69009973 T DE 69009973T DE 69009973 D1 DE69009973 D1 DE 69009973D1
Authority
DE
Germany
Prior art keywords
treating
view
subsequent plating
polyimide surface
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69009973T
Other languages
English (en)
Other versions
DE69009973T2 (de
Inventor
William Vincent Dumas
Donald Franklin Foust
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE69009973D1 publication Critical patent/DE69009973D1/de
Publication of DE69009973T2 publication Critical patent/DE69009973T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/926—Polyamide or polyimide, e.g. nylon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
DE69009973T 1990-01-05 1990-12-24 Verfahren zur Behandlung einer Polyimidoberfläche im Hinblick auf eine anschliessend darauf aufzubringende Plattierung. Expired - Fee Related DE69009973T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/461,579 US4959121A (en) 1990-01-05 1990-01-05 Method for treating a polyimide surface for subsequent plating thereon

Publications (2)

Publication Number Publication Date
DE69009973D1 true DE69009973D1 (de) 1994-07-21
DE69009973T2 DE69009973T2 (de) 1995-02-02

Family

ID=23833148

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69009973T Expired - Fee Related DE69009973T2 (de) 1990-01-05 1990-12-24 Verfahren zur Behandlung einer Polyimidoberfläche im Hinblick auf eine anschliessend darauf aufzubringende Plattierung.

Country Status (5)

Country Link
US (1) US4959121A (de)
EP (1) EP0440981B1 (de)
JP (1) JPH04211192A (de)
CA (1) CA2031110A1 (de)
DE (1) DE69009973T2 (de)

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US5322976A (en) * 1987-02-24 1994-06-21 Polyonics Corporation Process for forming polyimide-metal laminates
JP2775647B2 (ja) * 1989-11-17 1998-07-16 宇部興産株式会社 メタライズドポリイミドフィルムの製法
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
EP0481811B1 (de) * 1990-10-19 1997-12-17 Purex Co.Ltd. Behandlungsmethode zur Reinigung der Oberfläche von geformten Kunststoffgegenständen
US5350489A (en) * 1990-10-19 1994-09-27 Purex Co., Ltd. Treatment method of cleaning surface of plastic molded item
US5132191A (en) * 1990-10-26 1992-07-21 General Electric Company Polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5180639A (en) * 1990-10-26 1993-01-19 General Electric Company Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5198096A (en) * 1990-11-28 1993-03-30 General Electric Company Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5498440A (en) * 1992-01-21 1996-03-12 General Electric Company Adhesion of electroless coating to resinous articles
US5229169A (en) * 1992-01-21 1993-07-20 General Electric Company Adhesion of electroless coatings to resinous articles by treatment with permanganate
US5310580A (en) * 1992-04-27 1994-05-10 International Business Machines Corporation Electroless metal adhesion to organic dielectric material with phase separated morphology
JPH06298975A (ja) * 1993-03-18 1994-10-25 General Electric Co <Ge> テトラカルボキシビフェニルポリイミドへの金属被覆の付着性の改良
US5350487A (en) * 1993-05-03 1994-09-27 Ameen Thomas J Method of etching polyimide
KR0126792B1 (ko) * 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
US6063445A (en) * 1998-08-17 2000-05-16 Mcdonnell Douglas Corporation Method of preparation of polymer substrates for metal plating
US6906120B1 (en) 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
US6908561B1 (en) * 2001-11-06 2005-06-21 Lockhead Martin Corporation Polymide-to-substrate adhesion promotion in HDI
JP2005223065A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 配線基板の製造方法及び電子デバイスの製造方法
EP1630252A1 (de) * 2004-08-27 2006-03-01 ATOTECH Deutschland GmbH Verfahren zur beschichtung von Substraten enthaltend Antimonverbindungen mit Zinn und Zinnlegierungen
JP4701667B2 (ja) * 2004-09-30 2011-06-15 味の素株式会社 回路基板用金属付きポリイミドフィルム及びその製造方法
JP4654647B2 (ja) * 2004-09-30 2011-03-23 味の素株式会社 回路基板用金属付きポリアミドイミドフィルム及びその製造方法
EP2129199A1 (de) * 2008-05-28 2009-12-02 LG Electronics Inc. Verfahren zur Herstellung von flexibler Folie
EP2287357B1 (de) * 2009-08-18 2016-04-13 Rohm and Haas Electronic Materials, L.L.C. Herstellung von Substraten mit Polymeren zur Metallisierung
CN106134299B (zh) 2014-03-20 2018-10-23 住友电气工业株式会社 印刷线路板用基板、印刷线路板以及制造印刷线路板用基板的方法
WO2015147219A1 (ja) 2014-03-27 2015-10-01 住友電気工業株式会社 プリント配線板用基板、プリント配線板及びプリント配線板用基板の製造方法
US10920321B2 (en) * 2014-05-30 2021-02-16 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
US9825226B2 (en) * 2014-12-03 2017-11-21 Electronics And Telecommunications Research Institute Method for controlling an increase in conductivity of a polymer thin-film to provide a conductive film
KR102295547B1 (ko) * 2014-12-03 2021-09-01 한국전자통신연구원 전도성 필름 제조 방법
JPWO2016117575A1 (ja) 2015-01-22 2017-10-26 住友電気工業株式会社 プリント配線板用基材、プリント配線板及びプリント配線板の製造方法
KR101660035B1 (ko) * 2015-04-16 2016-09-27 풍원화학(주) 폴리이미드 식각액
KR102387071B1 (ko) 2019-08-06 2022-04-18 주식회사 비티엘첨단소재 이차전지용 알루미늄 파우치 필름 및 이의 제조방법
KR102387069B1 (ko) * 2019-08-06 2022-04-18 주식회사 비티엘첨단소재 이차전지용 알루미늄 파우치 필름 및 이의 제조방법
CN114107965A (zh) * 2021-10-29 2022-03-01 北京卫星制造厂有限公司 一种聚酰亚胺表面金属层制备方法

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US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
US3523874A (en) * 1967-03-16 1970-08-11 Hooker Chemical Corp Metal coating of aromatic polymers
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US3841881A (en) * 1972-09-13 1974-10-15 Rca Corp Method for electroless deposition of metal using improved colloidal catalyzing solution
US3983093A (en) * 1975-05-19 1976-09-28 General Electric Company Novel polyetherimides
US4525508A (en) * 1976-12-28 1985-06-25 General Electric Company Plasticized reinforced compositions of a polyphenylene ether resin
JPS5936514B2 (ja) * 1979-03-24 1984-09-04 株式会社明電舎 インバ−タ装置とその駆動方法
US4360633A (en) * 1981-07-27 1982-11-23 General Electric Company Coating solution of polyetherimide oligomers
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
JPS6071560A (ja) * 1983-08-29 1985-04-23 日曹マスタ−ビルダ−ズ株式会社 セメント組成物
DE3437084A1 (de) * 1984-10-05 1986-04-10 Schering AG, Berlin und Bergkamen, 1000 Berlin Verfahren zum an- und abaetzen von kunststoffschichten in bohrungen von basismaterial fuer leiterplatten
US4775449A (en) * 1986-12-29 1988-10-04 General Electric Company Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
US4806395A (en) * 1987-02-24 1989-02-21 Polyonics Corporation Textured polyimide film
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US4842946A (en) * 1987-09-28 1989-06-27 General Electric Company Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
US4810333A (en) * 1987-12-14 1989-03-07 Shipley Company Inc. Electroplating process
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
JPH02164275A (ja) * 1988-12-19 1990-06-25 Fuji Electric Co Ltd インバータの電源供給装置

Also Published As

Publication number Publication date
JPH04211192A (ja) 1992-08-03
DE69009973T2 (de) 1995-02-02
EP0440981A1 (de) 1991-08-14
EP0440981B1 (de) 1994-06-15
US4959121A (en) 1990-09-25
CA2031110A1 (en) 1991-07-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee