DE3885054D1 - Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände. - Google Patents

Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände.

Info

Publication number
DE3885054D1
DE3885054D1 DE88113776T DE3885054T DE3885054D1 DE 3885054 D1 DE3885054 D1 DE 3885054D1 DE 88113776 T DE88113776 T DE 88113776T DE 3885054 T DE3885054 T DE 3885054T DE 3885054 D1 DE3885054 D1 DE 3885054D1
Authority
DE
Germany
Prior art keywords
adhesion
treatment
improve
metal deposited
articles produced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88113776T
Other languages
English (en)
Other versions
DE3885054T2 (de
Inventor
Donald Franklin Foust
William Vincent Dumas
Edward John Lamby
Bradley Ross Karas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE3885054D1 publication Critical patent/DE3885054D1/de
Application granted granted Critical
Publication of DE3885054T2 publication Critical patent/DE3885054T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/26—Roughening, e.g. by etching using organic liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin
    • Y10S205/926—Polyamide or polyimide, e.g. nylon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE88113776T 1987-09-28 1988-08-24 Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände. Expired - Fee Related DE3885054T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/103,618 US4842946A (en) 1987-09-28 1987-09-28 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
CA 598048 CA1331541C (en) 1987-09-28 1989-04-27 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby

Publications (2)

Publication Number Publication Date
DE3885054D1 true DE3885054D1 (de) 1993-11-25
DE3885054T2 DE3885054T2 (de) 1994-05-11

Family

ID=25672655

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88113776T Expired - Fee Related DE3885054T2 (de) 1987-09-28 1988-08-24 Behandlung einer Polyimid-Oberfläche zur Verbesserung der Adhäsion des darauf abgeschiedenen Metalls und nach diesem Verfahren hergestellte Gegenstände.

Country Status (5)

Country Link
US (1) US4842946A (de)
EP (1) EP0310803B1 (de)
JP (1) JPH0645900B2 (de)
CA (1) CA1331541C (de)
DE (1) DE3885054T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931310A (en) * 1988-11-25 1990-06-05 International Business Machines Corporation Process for treating the surface of polyimides to improve properties to receive metal layer
US5156731A (en) * 1988-12-13 1992-10-20 Sumitomo Metal Mining Co. Ltd. Polyimide substrate and method of manufacturing a printed wiring board using the substrate
JP2678055B2 (ja) * 1989-03-30 1997-11-17 シャープ株式会社 有機化合物薄膜の製法
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5124192A (en) * 1989-11-15 1992-06-23 General Electric Company Plastic mold structure and method of making
US4959121A (en) * 1990-01-05 1990-09-25 General Electric Company Method for treating a polyimide surface for subsequent plating thereon
US5093466A (en) * 1990-02-20 1992-03-03 Exxon Chemical Patents Inc. Polyoxamide oxygen barrier
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5133840A (en) * 1990-05-15 1992-07-28 International Business Machines Corporation Surface midification of a polyimide
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5156732A (en) * 1990-07-11 1992-10-20 Sumitomo Metal Mining Co. Ltd. Polyimide substrate and method of manufacturing a printed wiring board using the substrate
JP2622016B2 (ja) * 1990-07-11 1997-06-18 住友金属鉱山 株式会社 銅ポリイミド基板およびこれを用いたプリント配線板の製造方法
JP2574535B2 (ja) * 1990-11-21 1997-01-22 住友金属鉱山株式会社 銅ポリイミド基板の製造方法
US5198096A (en) * 1990-11-28 1993-03-30 General Electric Company Method of preparing polycarbonate surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom
US5147518A (en) * 1991-03-07 1992-09-15 E. I. Du Pont De Nemours And Company Process for adhering metal to polyimide film
US5461203A (en) * 1991-05-06 1995-10-24 International Business Machines Corporation Electronic package including lower water content polyimide film
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
US5264248A (en) * 1992-08-03 1993-11-23 General Electric Company Adhesion of metal coatings of polypyromellitimides
KR0126792B1 (ko) * 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
US5712039A (en) * 1995-04-11 1998-01-27 Minnesota Mining And Manufacturing Company Epoxy adhesives with dithiooxamide adhesion promoters
JPH0948864A (ja) * 1995-08-03 1997-02-18 Kanegafuchi Chem Ind Co Ltd ポリイミドフィルムの接着性改善方法及び接着性を改善したポリイミドフィルム
JP3253921B2 (ja) * 1998-06-15 2002-02-04 奥野製薬工業株式会社 無電解部分めっき方法
SG87814A1 (en) 1999-06-29 2002-04-16 Univ Singapore Method for low temperature lamination of metals to polyimides
US7394153B2 (en) * 1999-12-17 2008-07-01 Osram Opto Semiconductors Gmbh Encapsulation of electronic devices
EP1240808B1 (de) * 1999-12-17 2003-05-21 Osram Opto Semiconductors GmbH Kapselung für organische leds
US6906120B1 (en) 2000-06-20 2005-06-14 General Electric Poly(arylene ether) adhesive compositions
CN100383278C (zh) * 2002-02-28 2008-04-23 日本瑞翁株式会社 部分镀敷方法、部分镀敷树脂基材以及多层电路基板的制造方法
US7057264B2 (en) * 2002-10-18 2006-06-06 National Starch And Chemical Investment Holding Corporation Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates
JP4638690B2 (ja) * 2003-05-20 2011-02-23 株式会社カネカ 積層体およびプリント配線板
WO2004104103A1 (ja) * 2003-05-20 2004-12-02 Kaneka Corporation ポリイミド樹脂組成物、ポリイミド樹脂を含む高分子フィルムおよびこれをもちいた積層体並びにプリント配線板の製造方法
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
JP4618488B2 (ja) * 2004-10-01 2011-01-26 石原薬品株式会社 無電解スズメッキ方法
US20100159260A1 (en) * 2008-12-23 2010-06-24 E. I. Du Pont De Nemours And Company Chrome-free method of conditioning and etching of a thermoplastic substrate for metal plating
KR101344065B1 (ko) * 2012-02-08 2013-12-24 주식회사 호진플라텍 구리 도금용액

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50100121A (de) * 1974-01-08 1975-08-08
US3954570A (en) * 1974-11-11 1976-05-04 Amp Incorporated Sensitized polyimides and circuit elements thereof
JPS5265576A (en) * 1975-11-27 1977-05-31 Nitto Electric Ind Co Method of treating metallized substrate of surface of plastics substrate
US4089622A (en) * 1976-06-22 1978-05-16 Borg-Warner Corporation Vacuum generator
JPS5437969A (en) * 1977-08-31 1979-03-20 Toshiba Corp Centrifugal gas separator
DE2755374A1 (de) * 1977-12-12 1979-06-13 Stauffer Chemical Co Verfahren zum metallisieren von substraten
JPS54125235A (en) * 1978-03-23 1979-09-28 Pentel Kk Polymerization accelerator for adhesive
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
DE3242162A1 (de) * 1982-11-13 1984-05-17 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von verbundwerkstoffen
FR2544340A1 (fr) * 1983-04-15 1984-10-19 Rhone Poulenc Rech Procede de metallisation de films souples electriquement isolants en matiere plastique thermostable et articles obtenus
US4806395A (en) * 1987-02-24 1989-02-21 Polyonics Corporation Textured polyimide film

Also Published As

Publication number Publication date
JPH01132772A (ja) 1989-05-25
JPH0645900B2 (ja) 1994-06-15
EP0310803A1 (de) 1989-04-12
EP0310803B1 (de) 1993-10-20
US4842946A (en) 1989-06-27
CA1331541C (en) 1994-08-23
DE3885054T2 (de) 1994-05-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee