DE69007500T2 - Lösung für stromlose Kupferplattierung. - Google Patents
Lösung für stromlose Kupferplattierung.Info
- Publication number
- DE69007500T2 DE69007500T2 DE69007500T DE69007500T DE69007500T2 DE 69007500 T2 DE69007500 T2 DE 69007500T2 DE 69007500 T DE69007500 T DE 69007500T DE 69007500 T DE69007500 T DE 69007500T DE 69007500 T2 DE69007500 T2 DE 69007500T2
- Authority
- DE
- Germany
- Prior art keywords
- plating solution
- copper plating
- electroless copper
- electroless
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1007092A JP2794741B2 (ja) | 1989-01-13 | 1989-01-13 | 無電解銅めっき液 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69007500D1 DE69007500D1 (de) | 1994-04-28 |
DE69007500T2 true DE69007500T2 (de) | 1994-06-30 |
Family
ID=11656438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69007500T Expired - Fee Related DE69007500T2 (de) | 1989-01-13 | 1990-01-11 | Lösung für stromlose Kupferplattierung. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5076840A (de) |
EP (1) | EP0378407B1 (de) |
JP (1) | JP2794741B2 (de) |
KR (1) | KR920004506B1 (de) |
DE (1) | DE69007500T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5306336A (en) * | 1992-11-20 | 1994-04-26 | Monsanto Company | Sulfate-free electroless copper plating baths |
US6645557B2 (en) | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
US7829793B2 (en) * | 2005-09-09 | 2010-11-09 | Magnecomp Corporation | Additive disk drive suspension manufacturing using tie layers for vias and product thereof |
US8553364B1 (en) | 2005-09-09 | 2013-10-08 | Magnecomp Corporation | Low impedance, high bandwidth disk drive suspension circuit |
TWI347373B (en) * | 2006-07-07 | 2011-08-21 | Rohm & Haas Elect Mat | Formaldehyde free electroless copper compositions |
TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
TW200813255A (en) * | 2006-07-07 | 2008-03-16 | Rohm & Haas Elect Mat | Environmentally friendly electroless copper compositions |
TWI347982B (en) * | 2006-07-07 | 2011-09-01 | Rohm & Haas Elect Mat | Improved electroless copper compositions |
WO2014154702A1 (en) * | 2013-03-27 | 2014-10-02 | Atotech Deutschland Gmbh | Electroless copper plating solution |
CN110512198A (zh) * | 2019-09-24 | 2019-11-29 | 苏州天承化工有限公司 | 一种化学镀铜液、化学镀铜膜及其制备方法 |
CN114277278B (zh) * | 2021-12-29 | 2022-07-01 | 九江天时粉末制品有限公司 | 一种耐磨铝青铜板及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4171225A (en) * | 1976-01-23 | 1979-10-16 | U.S. Philips Corporation | Electroless copper plating solutions |
JPS5370931A (en) * | 1976-12-07 | 1978-06-23 | Tokyo Shibaura Electric Co | Nonnelectrolytic copper plating method |
US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
JPS59870A (ja) * | 1982-06-28 | 1984-01-06 | Shin Kobe Electric Mach Co Ltd | 密閉式鉛蓄電池 |
US4548644A (en) * | 1982-09-28 | 1985-10-22 | Hitachi Chemical Company, Ltd. | Electroless copper deposition solution |
JPS609880A (ja) * | 1983-06-29 | 1985-01-18 | Seiko Epson Corp | 無電解銅めつき液 |
JPS6033358A (ja) * | 1983-08-04 | 1985-02-20 | Hitachi Chem Co Ltd | 無電解銅めっき液 |
JPS6070183A (ja) * | 1983-09-28 | 1985-04-20 | C Uyemura & Co Ltd | 化学銅めっき方法 |
JPS60155684A (ja) * | 1984-01-25 | 1985-08-15 | Hitachi Chem Co Ltd | 無電解銅めつき液 |
JPS60218480A (ja) * | 1984-04-16 | 1985-11-01 | Hitachi Ltd | 化学銅めつき液 |
JPS6112871A (ja) * | 1984-06-27 | 1986-01-21 | Toshiba Corp | 無電解銅めつき液の連続的再生方法 |
JPS61253375A (ja) * | 1985-05-01 | 1986-11-11 | Canon Inc | 無電解銅めつき液 |
JPS6274087A (ja) * | 1985-09-28 | 1987-04-04 | Shimadzu Corp | 無電解銅めつき液 |
JPS6289877A (ja) * | 1985-10-16 | 1987-04-24 | Seiko Epson Corp | 化学銅めつき液 |
-
1989
- 1989-01-13 JP JP1007092A patent/JP2794741B2/ja not_active Expired - Lifetime
-
1990
- 1990-01-04 US US07/460,983 patent/US5076840A/en not_active Expired - Lifetime
- 1990-01-11 EP EP90300308A patent/EP0378407B1/de not_active Expired - Lifetime
- 1990-01-11 DE DE69007500T patent/DE69007500T2/de not_active Expired - Fee Related
- 1990-01-12 KR KR1019900000360A patent/KR920004506B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0378407A1 (de) | 1990-07-18 |
KR920004506B1 (ko) | 1992-06-08 |
US5076840A (en) | 1991-12-31 |
DE69007500D1 (de) | 1994-04-28 |
JPH02190477A (ja) | 1990-07-26 |
EP0378407B1 (de) | 1994-03-23 |
JP2794741B2 (ja) | 1998-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: HITACHI CHEMICAL CO., LTD., TOKIO/TOKYO, JP |
|
8339 | Ceased/non-payment of the annual fee |