DE3668011D1 - Loesung zum stromlosen goldplattieren. - Google Patents
Loesung zum stromlosen goldplattieren.Info
- Publication number
- DE3668011D1 DE3668011D1 DE8686308308T DE3668011T DE3668011D1 DE 3668011 D1 DE3668011 D1 DE 3668011D1 DE 8686308308 T DE8686308308 T DE 8686308308T DE 3668011 T DE3668011 T DE 3668011T DE 3668011 D1 DE3668011 D1 DE 3668011D1
- Authority
- DE
- Germany
- Prior art keywords
- powerful
- plating solution
- gold plating
- gold
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60239150A JPS6299477A (ja) | 1985-10-25 | 1985-10-25 | 無電解金めつき液 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3668011D1 true DE3668011D1 (de) | 1990-02-08 |
Family
ID=17040493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686308308T Expired - Lifetime DE3668011D1 (de) | 1985-10-25 | 1986-10-24 | Loesung zum stromlosen goldplattieren. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4792469A (de) |
EP (1) | EP0225041B1 (de) |
JP (1) | JPS6299477A (de) |
DE (1) | DE3668011D1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4021681A1 (de) * | 1989-07-12 | 1991-03-14 | Kojima Chemicals Co Ltd | Nichtelektrolytische goldplattierloesung |
US4985076A (en) * | 1989-11-03 | 1991-01-15 | General Electric Company | Autocatalytic electroless gold plating composition |
US4978559A (en) * | 1989-11-03 | 1990-12-18 | General Electric Company | Autocatalytic electroless gold plating composition |
US4979988A (en) * | 1989-12-01 | 1990-12-25 | General Electric Company | Autocatalytic electroless gold plating composition |
JP2538461B2 (ja) * | 1991-02-22 | 1996-09-25 | 奥野製薬工業株式会社 | 無電解金めっき方法 |
US5470381A (en) * | 1992-11-25 | 1995-11-28 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating solution |
JP3331260B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JP3331261B2 (ja) * | 1994-08-19 | 2002-10-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
JP3302512B2 (ja) * | 1994-08-19 | 2002-07-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 無電解金めっき液 |
US5750018A (en) * | 1997-03-18 | 1998-05-12 | Learonal, Inc. | Cyanide-free monovalent copper electroplating solutions |
DE19745797C2 (de) * | 1997-10-16 | 2001-11-08 | Bosch Gmbh Robert | Lösung und Verfahren zum stromlosen Vergolden |
JP3466521B2 (ja) * | 1999-10-04 | 2003-11-10 | 新光電気工業株式会社 | 置換型無電解金めっき液及び無電解金めっき方法 |
JP4649666B2 (ja) * | 2006-07-11 | 2011-03-16 | 独立行政法人産業技術総合研究所 | 無電解金メッキ液 |
JP5526459B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
JP5526458B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE361056B (de) * | 1969-10-30 | 1973-10-15 | Western Electric Co | |
JPS52124428A (en) * | 1976-04-13 | 1977-10-19 | Hideji Sasaki | Nonnelectrolytic gold plating bath |
GB1547028A (en) * | 1976-11-19 | 1979-06-06 | Mine Safety Appliances Co | Electroless gold plating baths |
FR2441666A1 (fr) * | 1978-11-16 | 1980-06-13 | Prost Tournier Patrick | Procede de depot chimique d'or par reduction autocatalytique |
US4337091A (en) * | 1981-03-23 | 1982-06-29 | Hooker Chemicals & Plastics Corp. | Electroless gold plating |
SE8302798L (sv) * | 1982-06-07 | 1983-12-08 | Occidental Chem Co | Vattenhaltigt bad for stromlos utfellning av guld och sett att pa stromlos veg utfella guld med anvendning av badet |
JPS59229478A (ja) * | 1983-06-09 | 1984-12-22 | Noritoshi Honma | 無電解金めつき液の安定剤 |
-
1985
- 1985-10-25 JP JP60239150A patent/JPS6299477A/ja active Granted
-
1986
- 1986-10-24 DE DE8686308308T patent/DE3668011D1/de not_active Expired - Lifetime
- 1986-10-24 US US06/923,135 patent/US4792469A/en not_active Expired - Lifetime
- 1986-10-24 EP EP86308308A patent/EP0225041B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0320471B2 (de) | 1991-03-19 |
EP0225041A1 (de) | 1987-06-10 |
JPS6299477A (ja) | 1987-05-08 |
US4792469A (en) | 1988-12-20 |
EP0225041B1 (de) | 1990-01-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3672284D1 (de) | Stromloses plattierungsverfahren. | |
NO863185L (no) | Benmorfogeniske midler. | |
DE3672769D1 (de) | Amorphe legierung. | |
FI870638A0 (fi) | Uppvaermningsapparat foer under tryck staoende oeverfoeringsvaetska. | |
DE3687250T2 (de) | Kupfer-chrom-polyimid-verbundwerkstoffe. | |
NO860692L (no) | Silanordning. | |
DE3563508D1 (de) | Parenteral alimentation solution | |
DE3672530D1 (de) | Verbindungskopf. | |
DE3668011D1 (de) | Loesung zum stromlosen goldplattieren. | |
FI861106A0 (fi) | Metallurgisk process ii. | |
DE3686115T2 (de) | Spanndorn. | |
FI861107A0 (fi) | Metallurgisk process iii. | |
AT380902B (de) | Goldplattierungsbad | |
FI860165A (fi) | Sidovaegg i en metallurgisk smaeltugn. | |
FI861105A (fi) | Metallurgisk process i. | |
NO864837D0 (no) | Redningsvest. | |
DE68902551D1 (de) | Stromlose kupferplattierloesung. | |
DE3770928D1 (de) | Elektrode zum elektroraffinieren. | |
IT8620246A0 (it) | Apparecchio estrusore-turbomescolatore. | |
DE3670644D1 (de) | Querverbindbare polyimidverbindungen. | |
DE3874106D1 (de) | Mechanisches plattierungsverfahren. | |
KR870003235A (ko) | 도금, 전해용 도전부재 | |
ES2025152B3 (es) | Soldador. | |
DE3780174T2 (de) | Vorrichtung zum selektiven elektrolytischen plattieren von kontaktstiften. | |
DE3667416D1 (de) | Legierung zum aufschweissen. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |