DE68925596D1 - Verfahren zur Herstellung einer Polyimidstruktur auf einem Träger - Google Patents
Verfahren zur Herstellung einer Polyimidstruktur auf einem TrägerInfo
- Publication number
- DE68925596D1 DE68925596D1 DE68925596T DE68925596T DE68925596D1 DE 68925596 D1 DE68925596 D1 DE 68925596D1 DE 68925596 T DE68925596 T DE 68925596T DE 68925596 T DE68925596 T DE 68925596T DE 68925596 D1 DE68925596 D1 DE 68925596D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- support
- polyimide structure
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/196,641 US4883744A (en) | 1988-05-17 | 1988-05-17 | Forming a polymide pattern on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE68925596D1 true DE68925596D1 (de) | 1996-03-21 |
Family
ID=22726228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68925596T Expired - Lifetime DE68925596D1 (de) | 1988-05-17 | 1989-04-25 | Verfahren zur Herstellung einer Polyimidstruktur auf einem Träger |
Country Status (4)
Country | Link |
---|---|
US (1) | US4883744A (de) |
EP (1) | EP0342393B1 (de) |
JP (1) | JPH0634454B2 (de) |
DE (1) | DE68925596D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5264326A (en) * | 1989-07-31 | 1993-11-23 | Texas Instruments Incorporated | Polyimide thermal isolation mesa for a thermal imaging system |
JP2653582B2 (ja) * | 1991-09-17 | 1997-09-17 | 住友ベークライト株式会社 | 開口部を有する表面にポリアミック酸層のあるポリイミドフィルム及びこれを用いたフレキシブル印刷回路用基板乃至回路板 |
US5370974A (en) * | 1992-06-26 | 1994-12-06 | International Business Machines Corporation | Laser exposure of photosensitive polyimide for pattern formation |
EP0612812B1 (de) | 1993-02-24 | 2001-07-11 | Ibiden Co, Ltd. | Harzzusammensetzungen und Verfahren für Ihre Herstellung |
US5548486A (en) * | 1994-01-21 | 1996-08-20 | International Business Machines Corporation | Pinned module |
US5707902A (en) * | 1995-02-13 | 1998-01-13 | Industrial Technology Research Institute | Composite bump structure and methods of fabrication |
US5878483A (en) * | 1995-06-01 | 1999-03-09 | International Business Machines Corporation | Hammer for forming bulges in an array of compliant pin blanks |
JP4892798B2 (ja) * | 2000-10-12 | 2012-03-07 | 株式会社村田製作所 | 多層プリント回路基板の製造方法 |
JP2006310689A (ja) * | 2005-05-02 | 2006-11-09 | Nippon Mektron Ltd | ダブルアクセス型可撓性回路基板の製造方法 |
TW201026513A (en) * | 2009-01-08 | 2010-07-16 | Univ Nat Cheng Kung | Imprinting process of polyimide |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952822B2 (ja) * | 1978-04-14 | 1984-12-21 | 東レ株式会社 | 耐熱性感光材料 |
JPS54141128A (en) * | 1978-04-25 | 1979-11-02 | Fuji Photo Film Co Ltd | Processing method of picture image forming material |
JPS55120032A (en) * | 1979-03-09 | 1980-09-16 | Daicel Chem Ind Ltd | Treating solution for photosensitive laminate having alcohol-soluble polyamide layer |
US4576892A (en) * | 1980-07-28 | 1986-03-18 | Polychrome Corporation | Photosensitive materials |
US4369090A (en) * | 1980-11-06 | 1983-01-18 | Texas Instruments Incorporated | Process for etching sloped vias in polyimide insulators |
US4353778A (en) * | 1981-09-04 | 1982-10-12 | International Business Machines Corporation | Method of etching polyimide |
JPS5896632A (ja) * | 1981-12-02 | 1983-06-08 | Sumitomo Bakelite Co Ltd | ポリイミド系樹脂のエツチング方法 |
JPS58223149A (ja) * | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
KR860002082B1 (ko) * | 1983-01-19 | 1986-11-24 | 가부시기가이샤 도시바 | 레지스트 패턴의 형성 방법 및 장치 |
EP0119719B1 (de) * | 1983-03-03 | 1987-05-06 | Toray Industries, Inc. | Strahlungsempfindliche Polymermasse |
JPS59160139A (ja) * | 1983-03-04 | 1984-09-10 | Hitachi Ltd | 感光性重合体組成物 |
JPS6026033A (ja) * | 1983-07-01 | 1985-02-08 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 感光性ポリアミド酸誘導体およびこれを用いて基体上にポリイミドパタ−ンを形成する方法 |
US4578328A (en) * | 1984-07-09 | 1986-03-25 | General Electric Company | Photopatternable polyimide compositions and method for making |
US4624740A (en) * | 1985-01-22 | 1986-11-25 | International Business Machines Corporation | Tailoring of via-hole sidewall slope |
JPS62127738A (ja) * | 1985-11-28 | 1987-06-10 | Hitachi Chem Co Ltd | 感光性ポリイミド前駆体用現像液 |
US4639290A (en) * | 1985-12-09 | 1987-01-27 | Hughes Aircraft Company | Methods for selectively removing adhesives from polyimide substrates |
-
1988
- 1988-05-17 US US07/196,641 patent/US4883744A/en not_active Expired - Fee Related
-
1989
- 1989-02-20 JP JP1038539A patent/JPH0634454B2/ja not_active Expired - Lifetime
- 1989-04-25 DE DE68925596T patent/DE68925596D1/de not_active Expired - Lifetime
- 1989-04-25 EP EP89107431A patent/EP0342393B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4883744A (en) | 1989-11-28 |
JPH0222894A (ja) | 1990-01-25 |
EP0342393A2 (de) | 1989-11-23 |
JPH0634454B2 (ja) | 1994-05-02 |
EP0342393B1 (de) | 1996-02-07 |
EP0342393A3 (de) | 1991-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |