DE68925596D1 - Verfahren zur Herstellung einer Polyimidstruktur auf einem Träger - Google Patents

Verfahren zur Herstellung einer Polyimidstruktur auf einem Träger

Info

Publication number
DE68925596D1
DE68925596D1 DE68925596T DE68925596T DE68925596D1 DE 68925596 D1 DE68925596 D1 DE 68925596D1 DE 68925596 T DE68925596 T DE 68925596T DE 68925596 T DE68925596 T DE 68925596T DE 68925596 D1 DE68925596 D1 DE 68925596D1
Authority
DE
Germany
Prior art keywords
producing
support
polyimide structure
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68925596T
Other languages
English (en)
Inventor
Natalie Barbara Feilchenfeld
Stephen Joseph Fuerniss
John Joseph Glenning
Walter Paul Pawlowski
Giana Marrone Phelan
Paul George Rickerl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68925596D1 publication Critical patent/DE68925596D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387Polyamides or polyimides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/30Imagewise removal using liquid means
    • G03F7/32Liquid compositions therefor, e.g. developers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
DE68925596T 1988-05-17 1989-04-25 Verfahren zur Herstellung einer Polyimidstruktur auf einem Träger Expired - Lifetime DE68925596D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/196,641 US4883744A (en) 1988-05-17 1988-05-17 Forming a polymide pattern on a substrate

Publications (1)

Publication Number Publication Date
DE68925596D1 true DE68925596D1 (de) 1996-03-21

Family

ID=22726228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68925596T Expired - Lifetime DE68925596D1 (de) 1988-05-17 1989-04-25 Verfahren zur Herstellung einer Polyimidstruktur auf einem Träger

Country Status (4)

Country Link
US (1) US4883744A (de)
EP (1) EP0342393B1 (de)
JP (1) JPH0634454B2 (de)
DE (1) DE68925596D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264326A (en) * 1989-07-31 1993-11-23 Texas Instruments Incorporated Polyimide thermal isolation mesa for a thermal imaging system
JP2653582B2 (ja) * 1991-09-17 1997-09-17 住友ベークライト株式会社 開口部を有する表面にポリアミック酸層のあるポリイミドフィルム及びこれを用いたフレキシブル印刷回路用基板乃至回路板
US5370974A (en) * 1992-06-26 1994-12-06 International Business Machines Corporation Laser exposure of photosensitive polyimide for pattern formation
EP0612812B1 (de) 1993-02-24 2001-07-11 Ibiden Co, Ltd. Harzzusammensetzungen und Verfahren für Ihre Herstellung
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5707902A (en) * 1995-02-13 1998-01-13 Industrial Technology Research Institute Composite bump structure and methods of fabrication
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
JP4892798B2 (ja) * 2000-10-12 2012-03-07 株式会社村田製作所 多層プリント回路基板の製造方法
JP2006310689A (ja) * 2005-05-02 2006-11-09 Nippon Mektron Ltd ダブルアクセス型可撓性回路基板の製造方法
TW201026513A (en) * 2009-01-08 2010-07-16 Univ Nat Cheng Kung Imprinting process of polyimide

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
JPS54141128A (en) * 1978-04-25 1979-11-02 Fuji Photo Film Co Ltd Processing method of picture image forming material
JPS55120032A (en) * 1979-03-09 1980-09-16 Daicel Chem Ind Ltd Treating solution for photosensitive laminate having alcohol-soluble polyamide layer
US4576892A (en) * 1980-07-28 1986-03-18 Polychrome Corporation Photosensitive materials
US4369090A (en) * 1980-11-06 1983-01-18 Texas Instruments Incorporated Process for etching sloped vias in polyimide insulators
US4353778A (en) * 1981-09-04 1982-10-12 International Business Machines Corporation Method of etching polyimide
JPS5896632A (ja) * 1981-12-02 1983-06-08 Sumitomo Bakelite Co Ltd ポリイミド系樹脂のエツチング方法
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
KR860002082B1 (ko) * 1983-01-19 1986-11-24 가부시기가이샤 도시바 레지스트 패턴의 형성 방법 및 장치
EP0119719B1 (de) * 1983-03-03 1987-05-06 Toray Industries, Inc. Strahlungsempfindliche Polymermasse
JPS59160139A (ja) * 1983-03-04 1984-09-10 Hitachi Ltd 感光性重合体組成物
JPS6026033A (ja) * 1983-07-01 1985-02-08 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン 感光性ポリアミド酸誘導体およびこれを用いて基体上にポリイミドパタ−ンを形成する方法
US4578328A (en) * 1984-07-09 1986-03-25 General Electric Company Photopatternable polyimide compositions and method for making
US4624740A (en) * 1985-01-22 1986-11-25 International Business Machines Corporation Tailoring of via-hole sidewall slope
JPS62127738A (ja) * 1985-11-28 1987-06-10 Hitachi Chem Co Ltd 感光性ポリイミド前駆体用現像液
US4639290A (en) * 1985-12-09 1987-01-27 Hughes Aircraft Company Methods for selectively removing adhesives from polyimide substrates

Also Published As

Publication number Publication date
US4883744A (en) 1989-11-28
JPH0222894A (ja) 1990-01-25
EP0342393A2 (de) 1989-11-23
JPH0634454B2 (ja) 1994-05-02
EP0342393B1 (de) 1996-02-07
EP0342393A3 (de) 1991-12-18

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Legal Events

Date Code Title Description
8332 No legal effect for de