DE68919453D1 - Vorläufer für ein Polymid mit geringer thermischer Spannung und einen Polymidvorläufer enthaltende photopolymensierbare Zusammensetzung. - Google Patents

Vorläufer für ein Polymid mit geringer thermischer Spannung und einen Polymidvorläufer enthaltende photopolymensierbare Zusammensetzung.

Info

Publication number
DE68919453D1
DE68919453D1 DE68919453T DE68919453T DE68919453D1 DE 68919453 D1 DE68919453 D1 DE 68919453D1 DE 68919453 T DE68919453 T DE 68919453T DE 68919453 T DE68919453 T DE 68919453T DE 68919453 D1 DE68919453 D1 DE 68919453D1
Authority
DE
Germany
Prior art keywords
polymide
precursors
composition containing
thermal stress
low thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68919453T
Other languages
English (en)
Other versions
DE68919453T2 (de
Inventor
Hideo Ai
Hideaki Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Application granted granted Critical
Publication of DE68919453D1 publication Critical patent/DE68919453D1/de
Publication of DE68919453T2 publication Critical patent/DE68919453T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE68919453T 1988-08-24 1989-08-23 Vorläufer für ein Polymid mit geringer thermischer Spannung und einen Polymidvorläufer enthaltende photopolymensierbare Zusammensetzung. Expired - Fee Related DE68919453T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20845488 1988-08-24
JP28760288 1988-11-16

Publications (2)

Publication Number Publication Date
DE68919453D1 true DE68919453D1 (de) 1995-01-05
DE68919453T2 DE68919453T2 (de) 1995-03-30

Family

ID=26516838

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68919453T Expired - Fee Related DE68919453T2 (de) 1988-08-24 1989-08-23 Vorläufer für ein Polymid mit geringer thermischer Spannung und einen Polymidvorläufer enthaltende photopolymensierbare Zusammensetzung.

Country Status (4)

Country Link
EP (1) EP0355927B1 (de)
KR (1) KR910007212B1 (de)
CA (1) CA1335817C (de)
DE (1) DE68919453T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04120542A (ja) * 1990-09-12 1992-04-21 Hitachi Ltd 感光性耐熱重合体組成物
DE69222824D1 (de) * 1991-09-13 1997-11-27 Ibm Fluorierten Kohlenstoff und Polyimide enthaltende Verbundwerkstoffe
JP2635901B2 (ja) * 1992-03-13 1997-07-30 インターナショナル・ビジネス・マシーンズ・コーポレイション ポリイミドのネガティブ像形成方法
DE69308671T2 (de) * 1992-07-22 1997-10-16 Asahi Chemical Ind Photoempfindliche Polyimid-Zusammensetzung
JPH0680776A (ja) * 1992-09-02 1994-03-22 Asahi Chem Ind Co Ltd ポリイミド前駆体及び組成物
US5919892A (en) * 1994-10-31 1999-07-06 The Dow Chemical Company Polyamic acids and methods to convert polyamic acids into polyimidebenzoxazole films
JP3170174B2 (ja) 1995-04-18 2001-05-28 日本ゼオン株式会社 ポリイミド系樹脂組成物
US5741585A (en) * 1995-04-24 1998-04-21 The Dow Chemical Company Polyamic acid precursors and methods for preparing higher molecular weight polyamic acids and polyimidebenzoxazole
JP3321548B2 (ja) * 1996-06-17 2002-09-03 株式会社日立製作所 感光性ポリイミド前駆体組成物、およびそれを用いたパターン形成方法
US6342333B1 (en) 1999-09-23 2002-01-29 Hitachi Chemical Dupont Microsystems, L.L.C. Photosensitive resin composition, patterning method, and electronic components
JP5092399B2 (ja) * 2005-03-15 2012-12-05 東レ株式会社 感光性樹脂組成物
CN104684966B (zh) * 2012-09-04 2017-11-28 日产化学工业株式会社 聚酰亚胺及耐热性材料
CN104177639B (zh) * 2014-09-09 2017-08-15 北京航空航天大学 一种高效隔热聚酰亚胺薄膜及其制备方法
CN106256827A (zh) * 2015-06-17 2016-12-28 上海和辉光电有限公司 一种化合物及其合成方法和应用
CN111848624A (zh) * 2019-04-30 2020-10-30 上海和辉光电有限公司 一种苯并二咪唑类的化合物、空穴注入材料、oled器件及其制备方法和应用
KR20220004189A (ko) * 2019-07-29 2022-01-11 아사히 가세이 가부시키가이샤 네거티브형 감광성 수지 조성물, 폴리이미드의 제조 방법, 경화 릴리프 패턴의 제조 방법, 및 반도체 장치
TW202128841A (zh) * 2019-12-05 2021-08-01 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件及樹脂

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1294731C (en) * 1986-04-25 1992-01-21 Masakazu Uekita Copolymeric and amphiphilic polyimide precursor, process for preparing the same and thin film
US4954608A (en) * 1986-05-30 1990-09-04 Kanegafuchi Kagaku Kogyo Kabushiki Copolymerized polyamic acid salts and process of producing them

Also Published As

Publication number Publication date
DE68919453T2 (de) 1995-03-30
EP0355927B1 (de) 1994-11-23
EP0355927A2 (de) 1990-02-28
CA1335817C (en) 1995-06-06
KR900003679A (ko) 1990-03-26
EP0355927A3 (de) 1991-07-31
KR910007212B1 (ko) 1991-09-20

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