DE68915429T2 - Sperrscheibe. - Google Patents

Sperrscheibe.

Info

Publication number
DE68915429T2
DE68915429T2 DE68915429T DE68915429T DE68915429T2 DE 68915429 T2 DE68915429 T2 DE 68915429T2 DE 68915429 T DE68915429 T DE 68915429T DE 68915429 T DE68915429 T DE 68915429T DE 68915429 T2 DE68915429 T2 DE 68915429T2
Authority
DE
Germany
Prior art keywords
lock washer
washer
lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68915429T
Other languages
English (en)
Other versions
DE68915429D1 (de
Inventor
John Whittier Slemmons
Francis John Woolston
Patrick Jordan Redmond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing North American Inc
Original Assignee
Rockwell International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rockwell International Corp filed Critical Rockwell International Corp
Publication of DE68915429D1 publication Critical patent/DE68915429D1/de
Application granted granted Critical
Publication of DE68915429T2 publication Critical patent/DE68915429T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/002—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of light metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
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    • H01L2224/033—Manufacturing methods by local deposition of the material of the bonding area
    • H01L2224/0333—Manufacturing methods by local deposition of the material of the bonding area in solid form
    • H01L2224/03334—Manufacturing methods by local deposition of the material of the bonding area in solid form using a preform
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    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48617—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950 °C
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
DE68915429T 1989-02-28 1989-12-04 Sperrscheibe. Expired - Fee Related DE68915429T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31674089A 1989-02-28 1989-02-28

Publications (2)

Publication Number Publication Date
DE68915429D1 DE68915429D1 (de) 1994-06-23
DE68915429T2 true DE68915429T2 (de) 1994-09-01

Family

ID=23230447

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68915429T Expired - Fee Related DE68915429T2 (de) 1989-02-28 1989-12-04 Sperrscheibe.

Country Status (3)

Country Link
EP (1) EP0384971B1 (de)
JP (1) JPH0626225B2 (de)
DE (1) DE68915429T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1153968B1 (de) 1998-10-01 2004-02-25 Tonen Chemical Corporation Mikroporöser polyolefinfilm und verfahren zu dessen herstellung
US10128116B2 (en) * 2016-10-17 2018-11-13 Lam Research Corporation Integrated direct dielectric and metal deposition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1279399A (fr) * 1960-11-08 1961-12-22 Corning Glass Works Fixation d'un cristal à une ligne à retard
US3436806A (en) * 1967-01-26 1969-04-08 North American Rockwell Method of forming an aluminum-ferrous tubular transition joint
GB1198257A (en) * 1967-04-29 1970-07-08 Int Computers Ltd Improvements in Methods of Bonding Electrical Conductors
US3689232A (en) * 1971-07-09 1972-09-05 Asahi Chemical Ind Jointing materials for steel and aluminum
GB1360213A (en) * 1971-12-16 1974-07-17 Lucas Industries Ltd Method of mounting a semi-conductor chip on a heat sink
DE2312724C2 (de) * 1973-03-14 1974-06-06 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren und Vorrichtung zum Ultraschallschweißen eines aus Metall bestehenden Bauteiles mit einem aus einem Nichtmetall gebildeten Bauteil unter Einfügung einer metallischen Zwischenlage

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DE68915429D1 (de) 1994-06-23
JPH0334334A (ja) 1991-02-14
EP0384971A1 (de) 1990-09-05
EP0384971B1 (de) 1994-05-18
JPH0626225B2 (ja) 1994-04-06

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