DE60336150D1 - Methode zur überwachung der ätztiefe - Google Patents

Methode zur überwachung der ätztiefe

Info

Publication number
DE60336150D1
DE60336150D1 DE60336150T DE60336150T DE60336150D1 DE 60336150 D1 DE60336150 D1 DE 60336150D1 DE 60336150 T DE60336150 T DE 60336150T DE 60336150 T DE60336150 T DE 60336150T DE 60336150 D1 DE60336150 D1 DE 60336150D1
Authority
DE
Germany
Prior art keywords
etching
feature
depth
tool
deep
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60336150T
Other languages
German (de)
English (en)
Inventor
Tom A Kamp
Alan J Miller
Vijayakumar C Venugopal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE60336150D1 publication Critical patent/DE60336150D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Weting (AREA)
  • Blast Furnaces (AREA)
DE60336150T 2002-09-25 2003-09-18 Methode zur überwachung der ätztiefe Expired - Lifetime DE60336150D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/256,251 US6939811B2 (en) 2002-09-25 2002-09-25 Apparatus and method for controlling etch depth
PCT/US2003/030117 WO2004030050A2 (en) 2002-09-25 2003-09-18 Apparatus and method for controlling etch depth

Publications (1)

Publication Number Publication Date
DE60336150D1 true DE60336150D1 (de) 2011-04-07

Family

ID=32041765

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60336150T Expired - Lifetime DE60336150D1 (de) 2002-09-25 2003-09-18 Methode zur überwachung der ätztiefe

Country Status (10)

Country Link
US (1) US6939811B2 (https=)
EP (1) EP1543547B1 (https=)
JP (1) JP2006500781A (https=)
KR (1) KR101116589B1 (https=)
CN (1) CN100449706C (https=)
AT (1) ATE499701T1 (https=)
AU (1) AU2003275221A1 (https=)
DE (1) DE60336150D1 (https=)
TW (1) TWI324356B (https=)
WO (1) WO2004030050A2 (https=)

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US7393459B2 (en) * 2004-08-06 2008-07-01 Applied Materials, Inc. Method for automatic determination of substrates states in plasma processing chambers
JP4629421B2 (ja) * 2004-12-06 2011-02-09 パナソニック株式会社 ドライエッチング方法及びドライエッチング装置
JP2006186222A (ja) * 2004-12-28 2006-07-13 Matsushita Electric Ind Co Ltd プラズマ処理装置
KR100562657B1 (ko) * 2004-12-29 2006-03-20 주식회사 하이닉스반도체 리세스게이트 및 그를 구비한 반도체장치의 제조 방법
US20060154388A1 (en) * 2005-01-08 2006-07-13 Richard Lewington Integrated metrology chamber for transparent substrates
US7601272B2 (en) 2005-01-08 2009-10-13 Applied Materials, Inc. Method and apparatus for integrating metrology with etch processing
US7413992B2 (en) * 2005-06-01 2008-08-19 Lam Research Corporation Tungsten silicide etch process with reduced etch rate micro-loading
US7833381B2 (en) * 2005-08-18 2010-11-16 David Johnson Optical emission interferometry for PECVD using a gas injection hole
KR100707803B1 (ko) * 2005-10-28 2007-04-17 주식회사 하이닉스반도체 리세스 게이트를 갖는 반도체 소자의 제조방법
JP2007184356A (ja) * 2006-01-05 2007-07-19 Oki Electric Ind Co Ltd エッチング方法
US8525138B2 (en) 2006-03-31 2013-09-03 Energetiq Technology, Inc. Laser-driven light source
US7932181B2 (en) * 2006-06-20 2011-04-26 Lam Research Corporation Edge gas injection for critical dimension uniformity improvement
JP4101280B2 (ja) 2006-07-28 2008-06-18 住友精密工業株式会社 終点検出可能なプラズマエッチング方法及びプラズマエッチング装置
US20080078948A1 (en) * 2006-10-03 2008-04-03 Tokyo Electron Limited Processing termination detection method and apparatus
US7572734B2 (en) * 2006-10-27 2009-08-11 Applied Materials, Inc. Etch depth control for dual damascene fabrication process
US7521332B2 (en) * 2007-03-23 2009-04-21 Alpha & Omega Semiconductor, Ltd Resistance-based etch depth determination for SGT technology
CN100565839C (zh) * 2007-05-31 2009-12-02 联华电子股份有限公司 不同厚度的栅氧化层的制造方法
US7851370B2 (en) * 2007-09-25 2010-12-14 United Microelectronics Corp. Patterning method
US8304316B2 (en) * 2007-12-20 2012-11-06 Cambridge Semiconductor Limited Semiconductor device and method of forming a semiconductor device
JP5308080B2 (ja) * 2008-06-18 2013-10-09 Ｓｐｐテクノロジーズ株式会社 シリコン構造体の製造方法及びその製造装置並びにその製造プログラム
CN102044431A (zh) * 2009-10-20 2011-05-04 中芯国际集成电路制造(上海)有限公司 刻蚀方法和刻蚀系统
US9050394B2 (en) * 2011-05-09 2015-06-09 Palmaz Scientific, Inc. Method for making topographical features on a surface of a medical device
US12226301B2 (en) * 2011-05-09 2025-02-18 Vactronix Scientific, Llc Method of making topographical features and patterns on a surface of a medical device
JP5792613B2 (ja) * 2011-12-28 2015-10-14 株式会社日立ハイテクノロジーズ プラズマエッチング方法
JP5724945B2 (ja) * 2012-05-18 2015-05-27 株式会社デンソー 炭化珪素半導体装置の製造方法
US9275916B2 (en) * 2013-05-03 2016-03-01 Infineon Technologies Ag Removable indicator structure in electronic chips of a common substrate for process adjustment
CN104377141B (zh) * 2013-08-16 2017-05-03 无锡华润华晶微电子有限公司 检测晶片深沟槽结构的实际关键尺寸及是否过刻蚀的方法
US9484214B2 (en) 2014-02-19 2016-11-01 Lam Research Corporation Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasma
US20160181111A1 (en) * 2014-12-19 2016-06-23 Lam Research Corporation Silicon etch and clean
US11107738B2 (en) 2016-11-16 2021-08-31 Nova Ltd. Layer detection for high aspect ratio etch control
CN110574397B (zh) * 2018-12-29 2021-04-27 共达电声股份有限公司 Mems声音传感器、mems麦克风及电子设备
CN111341656A (zh) * 2020-03-19 2020-06-26 常州星海电子股份有限公司 光阻玻璃芯片全自动腐蚀工艺
US11587781B2 (en) 2021-05-24 2023-02-21 Hamamatsu Photonics K.K. Laser-driven light source with electrodeless ignition
US12165856B2 (en) 2022-02-21 2024-12-10 Hamamatsu Photonics K.K. Inductively coupled plasma light source
US12144072B2 (en) 2022-03-29 2024-11-12 Hamamatsu Photonics K.K. All-optical laser-driven light source with electrodeless ignition
US12156322B2 (en) 2022-12-08 2024-11-26 Hamamatsu Photonics K.K. Inductively coupled plasma light source with switched power supply
US12578076B2 (en) 2023-06-05 2026-03-17 Hamamatsu Photonics K.K. Dual-output laser-driven light source

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US52113A (en) * 1866-01-16 Improvement in feed apparatus for steam-generators
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US5362356A (en) * 1990-12-20 1994-11-08 Lsi Logic Corporation Plasma etching process control
US5450205A (en) * 1993-05-28 1995-09-12 Massachusetts Institute Of Technology Apparatus and method for real-time measurement of thin film layer thickness and changes thereof
JPH08316200A (ja) * 1995-05-18 1996-11-29 Toshiba Corp ドライエッチング方法及びドライエッチング装置
JPH09129619A (ja) * 1995-08-31 1997-05-16 Toshiba Corp エッチング深さ測定装置
US6159297A (en) * 1996-04-25 2000-12-12 Applied Materials, Inc. Semiconductor process chamber and processing method
US5807789A (en) * 1997-03-20 1998-09-15 Taiwan Semiconductor Manufacturing, Co., Ltd. Method for forming a shallow trench with tapered profile and round corners for the application of shallow trench isolation (STI)
US6127237A (en) * 1998-03-04 2000-10-03 Kabushiki Kaisha Toshiba Etching end point detecting method based on junction current measurement and etching apparatus
JPH11318398A (ja) * 1998-03-10 1999-11-24 Kagisho:Kk 超微粉末海苔及びその応用
US6081334A (en) * 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes
CN1064177C (zh) * 1998-05-13 2001-04-04 中国航天工业总公司第二研究院二十三所 变深度刻蚀方法及其装置
JP2000329525A (ja) * 1999-05-18 2000-11-30 Toshiba Corp 段差測定方法並びにエッチング深さ測定方法及びそれらの装置
US6492186B1 (en) * 1999-08-05 2002-12-10 Eaton Corporation Method for detecting an endpoint for an oxygen free plasma process
US6400458B1 (en) * 1999-09-30 2002-06-04 Lam Research Corporation Interferometric method for endpointing plasma etch processes
US6391788B1 (en) 2000-02-25 2002-05-21 Applied Materials, Inc. Two etchant etch method
EP1320867A2 (en) * 2000-09-21 2003-06-25 Applied Materials, Inc. Reducing deposition of process residues on a surface in a chamber
US20030000922A1 (en) * 2001-06-27 2003-01-02 Ramkumar Subramanian Using scatterometry to develop real time etch image

Also Published As

Publication number Publication date
WO2004030050A2 (en) 2004-04-08
AU2003275221A1 (en) 2004-04-19
AU2003275221A8 (en) 2004-04-19
KR20050047126A (ko) 2005-05-19
US6939811B2 (en) 2005-09-06
CN100449706C (zh) 2009-01-07
CN1701420A (zh) 2005-11-23
EP1543547A2 (en) 2005-06-22
KR101116589B1 (ko) 2012-03-15
JP2006500781A (ja) 2006-01-05
US20040084406A1 (en) 2004-05-06
EP1543547B1 (en) 2011-02-23
TW200411734A (en) 2004-07-01
TWI324356B (en) 2010-05-01
ATE499701T1 (de) 2011-03-15
WO2004030050A3 (en) 2004-04-29

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