DE60330971D1 - Halbleiterschleif prozess zu seiner herstellung und polierverfahren - Google Patents

Halbleiterschleif prozess zu seiner herstellung und polierverfahren

Info

Publication number
DE60330971D1
DE60330971D1 DE60330971T DE60330971T DE60330971D1 DE 60330971 D1 DE60330971 D1 DE 60330971D1 DE 60330971 T DE60330971 T DE 60330971T DE 60330971 T DE60330971 T DE 60330971T DE 60330971 D1 DE60330971 D1 DE 60330971D1
Authority
DE
Germany
Prior art keywords
polishing
additive
polishing compound
compound
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60330971T
Other languages
English (en)
Inventor
Yoshinori Kon
Norihito Nakazawa
Chie Ishida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seimi Chemical Co Ltd
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Seimi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Seimi Chemical Co Ltd filed Critical Asahi Glass Co Ltd
Application granted granted Critical
Publication of DE60330971D1 publication Critical patent/DE60330971D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE60330971T 2002-07-22 2003-07-22 Halbleiterschleif prozess zu seiner herstellung und polierverfahren Expired - Lifetime DE60330971D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002212679 2002-07-22
PCT/JP2003/009259 WO2004010487A1 (ja) 2002-07-22 2003-07-22 半導体用研磨剤、その製造方法及び研磨方法

Publications (1)

Publication Number Publication Date
DE60330971D1 true DE60330971D1 (de) 2010-03-04

Family

ID=30767815

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60330971T Expired - Lifetime DE60330971D1 (de) 2002-07-22 2003-07-22 Halbleiterschleif prozess zu seiner herstellung und polierverfahren

Country Status (11)

Country Link
US (2) US20050126080A1 (de)
EP (1) EP1542266B1 (de)
JP (1) JP4554363B2 (de)
KR (2) KR101068068B1 (de)
CN (1) CN100369211C (de)
AT (1) ATE455367T1 (de)
AU (1) AU2003281655A1 (de)
DE (1) DE60330971D1 (de)
SG (1) SG155045A1 (de)
TW (1) TWI285668B (de)
WO (1) WO2004010487A1 (de)

Families Citing this family (32)

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TWI256971B (en) * 2002-08-09 2006-06-21 Hitachi Chemical Co Ltd CMP abrasive and method for polishing substrate
KR100582771B1 (ko) * 2004-03-29 2006-05-22 한화석유화학 주식회사 반도체 얕은 트렌치 소자 분리 공정용 화학적 기계적 연마슬러리
WO2005110679A1 (ja) * 2004-05-19 2005-11-24 Nissan Chemical Industries, Ltd. 研磨用組成物
CN101311205A (zh) 2004-07-23 2008-11-26 日立化成工业株式会社 Cmp研磨剂以及衬底的研磨方法
US20070218811A1 (en) * 2004-09-27 2007-09-20 Hitachi Chemical Co., Ltd. Cmp polishing slurry and method of polishing substrate
JP2006179678A (ja) * 2004-12-22 2006-07-06 Hitachi Chem Co Ltd 半導体絶縁膜用ｃｍｐ研磨剤及び基板の研磨方法
JP2006303348A (ja) * 2005-04-25 2006-11-02 Asahi Glass Co Ltd 化学的機械的研磨用研磨剤、研磨方法および半導体集積回路装置の製造方法
JP2006339594A (ja) * 2005-06-06 2006-12-14 Seimi Chem Co Ltd 半導体用研磨剤
WO2007029465A1 (ja) * 2005-09-09 2007-03-15 Asahi Glass Company, Limited 研磨剤、被研磨面の研磨方法および半導体集積回路装置の製造方法
JP2007103515A (ja) * 2005-09-30 2007-04-19 Fujimi Inc 研磨方法
KR100734305B1 (ko) * 2006-01-17 2007-07-02 삼성전자주식회사 디싱 현상 없이 평탄화된 막을 구비하는 반도체 소자의제조방법 및 그에 의해 제조된 반도체 소자
US7721415B2 (en) * 2006-04-19 2010-05-25 Headway Technologies, Inc Method of manufacturing a thin-film magnetic head
SG136886A1 (en) * 2006-04-28 2007-11-29 Asahi Glass Co Ltd Method for producing glass substrate for magnetic disk, and magnetic disk
JP2008010835A (ja) * 2006-05-31 2008-01-17 Sumitomo Electric Ind Ltd 窒化物結晶の表面処理方法、窒化物結晶基板、エピタキシャル層付窒化物結晶基板および半導体デバイス、ならびにエピタキシャル層付窒化物結晶基板および半導体デバイスの製造方法
JP4836731B2 (ja) * 2006-07-18 2011-12-14 旭硝子株式会社 磁気ディスク用ガラス基板の製造方法
EP2061070A4 (de) * 2006-09-11 2010-06-02 Asahi Glass Co Ltd Poliermittel für ein integriertes halbleiterschaltungsbauelement, polierverfahren und verfahren zum herstellen eines integrierten halbleiterschaltungsbauelements
WO2008032681A1 (fr) * 2006-09-13 2008-03-20 Asahi Glass Co., Ltd. Agent de polissage pour dispositif à semi-conducteur en circuit intégré, procédé de polissage, et procédé de fabrication du dispositif à semi-conducteur en circuit intégré
US20100015806A1 (en) * 2006-09-15 2010-01-21 Masato Fukasawa Cmp polishing slurry, additive liquid for cmp polishing slurry, and substrate-polishing processes using the same
US8357311B2 (en) 2006-12-28 2013-01-22 Kao Corporation Polishing liquid composition
JP4489108B2 (ja) * 2007-09-13 2010-06-23 株式会社東芝 半導体装置の製造方法
CN101608097B (zh) * 2009-07-14 2011-12-21 上海华明高纳稀土新材料有限公司 化学机械抛光用纳米氧化铈浆液及其制备方法
CN104024366A (zh) * 2011-12-27 2014-09-03 旭硝子株式会社 研磨剂用添加剂及研磨方法
JP5957292B2 (ja) 2012-05-18 2016-07-27 株式会社フジミインコーポレーテッド 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法
KR102198376B1 (ko) * 2012-11-02 2021-01-04 로렌스 리버모어 내쇼날 시큐리티, 엘엘시 표면 활성의 손실없이 대전된 콜로이드의 응집을 방지하는 방법
JP6191433B2 (ja) * 2013-12-11 2017-09-06 旭硝子株式会社 研磨剤および研磨方法
SG11201607359XA (en) 2014-03-20 2016-10-28 Fujimi Inc Polishing composition, polishing method, and method for producing substrate
KR102594932B1 (ko) * 2015-05-08 2023-10-27 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물
US10421890B2 (en) 2016-03-31 2019-09-24 Versum Materials Us, Llc Composite particles, method of refining and use thereof
JP7187770B2 (ja) 2017-11-08 2022-12-13 Ａｇｃ株式会社 研磨剤と研磨方法、および研磨用添加液
JP7467188B2 (ja) 2020-03-24 2024-04-15 キオクシア株式会社 Ｃｍｐ方法及びｃｍｐ用洗浄剤
CN111673607B (zh) * 2020-04-28 2021-11-26 北京烁科精微电子装备有限公司 一种化学机械平坦化设备
JP7437368B2 (ja) * 2020-11-06 2024-02-22 エスケー エンパルス カンパニー リミテッド 研磨パッド、研磨パッドの製造方法及びそれを用いた半導体素子の製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3278532B2 (ja) * 1994-07-08 2002-04-30 株式会社東芝 半導体装置の製造方法
KR19980019046A (ko) * 1996-08-29 1998-06-05 고사이 아키오 연마용 조성물 및 이의 용도(Abrasive composition and use of the same)
JPH10125638A (ja) * 1996-08-29 1998-05-15 Sumitomo Chem Co Ltd 研磨用組成物及びそれを使用した半導体基板上の金属膜の平坦化方法
EP1610367B1 (de) * 1996-09-30 2010-03-17 Hitachi Chemical Co., Ltd. Schleifmittel auf Basis von Ceroxid und Verfahren zum Polieren von Oberflächen
JPH10102040A (ja) * 1996-09-30 1998-04-21 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
TW365563B (en) * 1997-04-28 1999-08-01 Seimi Chem Kk Polishing agent for semiconductor and method for its production
WO1999043761A1 (fr) * 1998-02-24 1999-09-02 Showa Denko K.K. Composition abrasive de polissage d'un dispositif semiconducteur et procede de production d'un dispositif semiconducteur afferent
JP3480323B2 (ja) * 1998-06-30 2003-12-15 日立化成工業株式会社 酸化セリウム研磨剤、基板の研磨法及び半導体装置
JP2000158341A (ja) * 1998-11-27 2000-06-13 Sumitomo Metal Ind Ltd 研磨方法及び研磨システム
KR100797218B1 (ko) * 1998-12-25 2008-01-23 히다치 가세고교 가부시끼가이샤 Ｃｍｐ 연마제, ｃｍｐ 연마제용 첨가액 및 기판의 연마방법
JP2000357795A (ja) * 1999-06-17 2000-12-26 Nec Kansai Ltd ディプレッション型半導体装置の製造方法
JP3957924B2 (ja) * 1999-06-28 2007-08-15 株式会社東芝 Ｃｍｐ研磨方法
JP4555936B2 (ja) * 1999-07-21 2010-10-06 日立化成工業株式会社 Ｃｍｐ研磨液
JP2001031951A (ja) * 1999-07-22 2001-02-06 Hitachi Chem Co Ltd 研磨剤及び基板の研磨方法
JP2001284296A (ja) * 2000-03-02 2001-10-12 Eternal Chemical Co Ltd 研磨性スラリー及びその使用
JP2001269859A (ja) * 2000-03-27 2001-10-02 Jsr Corp 化学機械研磨用水系分散体
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP4123730B2 (ja) * 2001-03-15 2008-07-23 日立化成工業株式会社 酸化セリウム研磨剤及びこれを用いた基板の研磨方法
US6540935B2 (en) * 2001-04-05 2003-04-01 Samsung Electronics Co., Ltd. Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same
JP5017574B2 (ja) * 2001-05-25 2012-09-05 エア プロダクツ アンド ケミカルズ インコーポレイテッド 酸化セリウム研磨剤及び基板の製造方法
KR100457743B1 (ko) * 2002-05-17 2004-11-18 주식회사 하이닉스반도체 산화막용 ｃｍｐ 슬러리 및 이를 이용한 반도체 소자의형성 방법
JPWO2006098141A1 (ja) * 2005-03-16 2008-08-21 旭硝子株式会社 半導体集積回路装置用研磨剤、研磨方法および半導体集積回路装置の製造方法
JP2006278522A (ja) * 2005-03-28 2006-10-12 Seimi Chem Co Ltd 半導体集積回路装置用研磨剤、研磨方法および半導体集積回路装置の製造方法
JP2006339594A (ja) * 2005-06-06 2006-12-14 Seimi Chem Co Ltd 半導体用研磨剤
EP2061070A4 (de) * 2006-09-11 2010-06-02 Asahi Glass Co Ltd Poliermittel für ein integriertes halbleiterschaltungsbauelement, polierverfahren und verfahren zum herstellen eines integrierten halbleiterschaltungsbauelements
WO2008032681A1 (fr) * 2006-09-13 2008-03-20 Asahi Glass Co., Ltd. Agent de polissage pour dispositif à semi-conducteur en circuit intégré, procédé de polissage, et procédé de fabrication du dispositif à semi-conducteur en circuit intégré

Also Published As

Publication number Publication date
AU2003281655A8 (en) 2004-02-09
EP1542266A4 (de) 2005-09-14
KR20100088629A (ko) 2010-08-09
TW200403317A (en) 2004-03-01
JP4554363B2 (ja) 2010-09-29
US20100055909A1 (en) 2010-03-04
EP1542266B1 (de) 2010-01-13
KR100988749B1 (ko) 2010-10-20
US20050126080A1 (en) 2005-06-16
CN1672246A (zh) 2005-09-21
TWI285668B (en) 2007-08-21
SG155045A1 (en) 2009-09-30
JPWO2004010487A1 (ja) 2005-11-17
AU2003281655A1 (en) 2004-02-09
EP1542266A1 (de) 2005-06-15
ATE455367T1 (de) 2010-01-15
KR101068068B1 (ko) 2011-09-28
CN100369211C (zh) 2008-02-13
WO2004010487A1 (ja) 2004-01-29
KR20050021533A (ko) 2005-03-07

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