DE60325626D1 - Vorrichtung zum transport von scheibenförmigen gegenständen - Google Patents

Vorrichtung zum transport von scheibenförmigen gegenständen

Info

Publication number
DE60325626D1
DE60325626D1 DE60325626T DE60325626T DE60325626D1 DE 60325626 D1 DE60325626 D1 DE 60325626D1 DE 60325626 T DE60325626 T DE 60325626T DE 60325626 T DE60325626 T DE 60325626T DE 60325626 D1 DE60325626 D1 DE 60325626D1
Authority
DE
Germany
Prior art keywords
wafer
shaped article
holding
cassette
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60325626T
Other languages
English (en)
Inventor
Christian Putzi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
SEZ AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEZ AG filed Critical SEZ AG
Application granted granted Critical
Publication of DE60325626D1 publication Critical patent/DE60325626D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
DE60325626T 2002-10-16 2003-10-09 Vorrichtung zum transport von scheibenförmigen gegenständen Expired - Lifetime DE60325626D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT15652002 2002-10-16
PCT/EP2003/011178 WO2004036628A2 (en) 2002-10-16 2003-10-09 Device and method for transporting wafer-shaped articles

Publications (1)

Publication Number Publication Date
DE60325626D1 true DE60325626D1 (de) 2009-02-12

Family

ID=32097256

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60325626T Expired - Lifetime DE60325626D1 (de) 2002-10-16 2003-10-09 Vorrichtung zum transport von scheibenförmigen gegenständen

Country Status (10)

Country Link
US (1) US7270510B2 (de)
EP (1) EP1554748B1 (de)
JP (2) JP4986399B2 (de)
KR (2) KR101276785B1 (de)
CN (1) CN100369185C (de)
AT (1) ATE419645T1 (de)
AU (1) AU2003294674A1 (de)
DE (1) DE60325626D1 (de)
TW (1) TWI262165B (de)
WO (1) WO2004036628A2 (de)

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KR101024789B1 (ko) 2003-12-03 2011-03-24 주식회사 하이닉스반도체 반도체소자의 트랜지스터 형성방법
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
WO2007099976A1 (ja) * 2006-02-22 2007-09-07 Ebara Corporation 基板処理装置、基板搬送装置、基板把持装置、および薬液処理装置
US7901539B2 (en) * 2006-09-19 2011-03-08 Intevac, Inc. Apparatus and methods for transporting and processing substrates
DE102006049488A1 (de) * 2006-10-17 2008-04-30 Höllmüller Maschinenbau GmbH Vorrichtung zum Behandeln von flachen, zerbrechlichen Substraten
JP4744426B2 (ja) * 2006-12-27 2011-08-10 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4726776B2 (ja) 2006-12-27 2011-07-20 大日本スクリーン製造株式会社 反転装置およびそれを備えた基板処理装置
JP2008172062A (ja) * 2007-01-12 2008-07-24 Murata Mach Ltd 物品供給装置
JP2008172160A (ja) * 2007-01-15 2008-07-24 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US20080310939A1 (en) * 2007-06-15 2008-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for use in a lithography tool
US20090162170A1 (en) * 2007-12-19 2009-06-25 Asm Japan K.K. Tandem type semiconductor-processing apparatus
JP4980978B2 (ja) * 2008-04-17 2012-07-18 大日本スクリーン製造株式会社 基板処理装置
WO2009148165A1 (ja) * 2008-06-06 2009-12-10 株式会社アルバック 成膜装置
JP4757924B2 (ja) * 2009-02-26 2011-08-24 東京エレクトロン株式会社 基板処理装置
JP2011009362A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd インプリントシステム、インプリント方法、プログラム及びコンピュータ記憶媒体
JP5060517B2 (ja) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 インプリントシステム
JP5657948B2 (ja) * 2009-09-02 2015-01-21 キヤノンアネルバ株式会社 真空処理装置及び基板移載方法
US8911554B2 (en) * 2010-01-05 2014-12-16 Applied Materials, Inc. System for batch processing of magnetic media
KR101796656B1 (ko) * 2010-04-30 2017-11-13 어플라이드 머티어리얼스, 인코포레이티드 수직 인라인 화학기상증착 시스템
US9869021B2 (en) 2010-05-25 2018-01-16 Aventa Technologies, Inc. Showerhead apparatus for a linear batch chemical vapor deposition system
US9169562B2 (en) * 2010-05-25 2015-10-27 Singulus Mocvd Gmbh I. Gr. Parallel batch chemical vapor deposition system
US9508582B2 (en) 2011-06-03 2016-11-29 Tel Nexx, Inc. Parallel single substrate marangoni module
JP5993625B2 (ja) * 2012-06-15 2016-09-14 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置、および、基板処理装置
US9099510B2 (en) * 2013-03-15 2015-08-04 Genmark Automation, Inc. Workpiece flipping mechanism for space-constrained environment
US9245783B2 (en) * 2013-05-24 2016-01-26 Novellus Systems, Inc. Vacuum robot with linear translation carriage
JP6346509B2 (ja) * 2014-07-07 2018-06-20 株式会社荏原製作所 基板処理装置及び基板搬送方法
JP2017183665A (ja) * 2016-03-31 2017-10-05 芝浦メカトロニクス株式会社 基板搬送装置、基板処理装置及び基板処理方法

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KR970003907B1 (ko) 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US4981408A (en) 1989-12-18 1991-01-01 Varian Associates, Inc. Dual track handling and processing system
JPH0917835A (ja) * 1995-04-27 1997-01-17 Sony Corp 偏平な被加工物の搬送方法
JPH1022359A (ja) 1996-07-01 1998-01-23 Dainippon Screen Mfg Co Ltd 基板搬送装置
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
JP2000049206A (ja) 1998-07-28 2000-02-18 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000138276A (ja) * 1998-10-30 2000-05-16 Tokyo Electron Ltd 基板処理装置
US6156580A (en) * 1998-11-18 2000-12-05 Advanced Micro Devices, Inc. Semiconductor wafer analysis system and method
JP2000260857A (ja) * 1999-03-12 2000-09-22 Sumitomo Heavy Ind Ltd ウェハ搬送ロボットを用いたウェハ受渡し方法、及び、ウェハ処理装置
JP2001219391A (ja) * 1999-12-01 2001-08-14 Ses Co Ltd 基板反転装置および基板洗浄システム
US6488462B1 (en) * 2000-01-12 2002-12-03 Quantum Corporation Transport mechanism for a storage system
JP2001274232A (ja) * 2000-03-27 2001-10-05 Tokyo Electron Ltd 基板処理装置
JP2002110609A (ja) * 2000-10-02 2002-04-12 Tokyo Electron Ltd 洗浄処理装置
US20020071756A1 (en) * 2000-12-13 2002-06-13 Gonzalez Jose R. Dual wafer edge gripping end effector and method therefor
JP4856308B2 (ja) * 2000-12-27 2012-01-18 キヤノンアネルバ株式会社 基板処理装置及び経由チャンバー
US6494666B2 (en) * 2001-01-26 2002-12-17 Fortrend Engineering Corporation Simplified and enhanced SCARA arm
WO2003043060A2 (en) * 2001-11-13 2003-05-22 Fsi International, Inc. Reduced footprint tool for automated processing of substrates

Also Published As

Publication number Publication date
ATE419645T1 (de) 2009-01-15
TWI262165B (en) 2006-09-21
EP1554748A2 (de) 2005-07-20
JP4986399B2 (ja) 2012-07-25
CN100369185C (zh) 2008-02-13
JP5367105B2 (ja) 2013-12-11
JP2012134533A (ja) 2012-07-12
AU2003294674A1 (en) 2004-05-04
CN1706024A (zh) 2005-12-07
KR101028782B1 (ko) 2011-04-14
US7270510B2 (en) 2007-09-18
WO2004036628A3 (en) 2004-07-01
US20060008342A1 (en) 2006-01-12
EP1554748B1 (de) 2008-12-31
KR20110014663A (ko) 2011-02-11
WO2004036628A2 (en) 2004-04-29
TW200416188A (en) 2004-09-01
KR101276785B1 (ko) 2013-06-24
KR20050052539A (ko) 2005-06-02
JP2006503428A (ja) 2006-01-26

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: LAM RESEARCH AG, VILLACH, AT

8364 No opposition during term of opposition