DE60323375D1 - Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens - Google Patents

Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens

Info

Publication number
DE60323375D1
DE60323375D1 DE60323375T DE60323375T DE60323375D1 DE 60323375 D1 DE60323375 D1 DE 60323375D1 DE 60323375 T DE60323375 T DE 60323375T DE 60323375 T DE60323375 T DE 60323375T DE 60323375 D1 DE60323375 D1 DE 60323375D1
Authority
DE
Germany
Prior art keywords
anode
cathode
reference electrode
monitoring
metal deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60323375T
Other languages
English (en)
Inventor
Andreas Thies
Thomas Dretschkow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Application granted granted Critical
Publication of DE60323375D1 publication Critical patent/DE60323375D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE60323375T 2002-07-12 2003-07-02 Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens Expired - Lifetime DE60323375D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10232612A DE10232612B4 (de) 2002-07-12 2002-07-12 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses
PCT/EP2003/007051 WO2004007811A2 (en) 2002-07-12 2003-07-02 Device and method for monitoring an electrolytic process

Publications (1)

Publication Number Publication Date
DE60323375D1 true DE60323375D1 (de) 2008-10-16

Family

ID=30010161

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10232612A Expired - Fee Related DE10232612B4 (de) 2002-07-12 2002-07-12 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses
DE60323375T Expired - Lifetime DE60323375D1 (de) 2002-07-12 2003-07-02 Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10232612A Expired - Fee Related DE10232612B4 (de) 2002-07-12 2002-07-12 Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses

Country Status (9)

Country Link
US (1) US20050173250A1 (de)
EP (1) EP1521868B1 (de)
JP (1) JP4221365B2 (de)
CN (1) CN100346007C (de)
AT (1) ATE407236T1 (de)
AU (1) AU2003249927A1 (de)
DE (2) DE10232612B4 (de)
TW (1) TWI257961B (de)
WO (1) WO2004007811A2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100572613C (zh) * 2004-11-24 2009-12-23 北京大学 一种制备纳米间隙电极的反馈控制系统
DE102005024910A1 (de) * 2005-05-31 2006-12-07 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zur In-Line-Steuerung der Lothöcker-Abscheidung
FR2892595B1 (fr) * 2005-10-21 2010-11-05 Siemens Vdo Automotive Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise
US20070150819A1 (en) * 2005-12-09 2007-06-28 Mks Instruments, Inc. Graphical User Interface
JP2007212326A (ja) * 2006-02-10 2007-08-23 Tokyo Institute Of Technology 電位差計測装置および電位差計測方法
JP2013077619A (ja) * 2011-09-29 2013-04-25 Renesas Electronics Corp 半導体装置の製造方法
AU2013303221B2 (en) 2012-08-17 2015-11-19 Alcoa Usa Corp. Systems and methods for preventing thermite reactions in electrolytic cells
US20140367264A1 (en) * 2013-06-18 2014-12-18 Applied Materials, Inc. Automatic in-situ control of an electro-plating processor
JP5826952B2 (ja) * 2014-01-17 2015-12-02 株式会社荏原製作所 めっき方法およびめっき装置
CA2939413C (en) * 2014-02-14 2022-08-23 Universite Du Quebec A Chicoutimi A method for analyzing an anode and device thereof
CN109518244A (zh) * 2018-12-27 2019-03-26 中国电子科技集团公司第二研究所 可削弱镀层边缘效应的晶圆镀铜工艺
JP7108801B1 (ja) * 2022-03-01 2022-07-28 株式会社荏原製作所 めっき装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB871203A (en) * 1959-02-24 1961-06-21 Artur Riedel Method of and circuit for controlling the electrolytic current in an electrolytic bath
US4445990A (en) * 1981-11-12 1984-05-01 General Electric Company Electrolytic reactor for cleaning wastewater
DE3718584A1 (de) * 1987-06-03 1988-12-15 Norddeutsche Affinerie Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten
JP2546089B2 (ja) * 1991-07-09 1996-10-23 上村工業株式会社 錫又は半田めっき浴への金属イオン補給方法
DE69929967T2 (de) * 1998-04-21 2007-05-24 Applied Materials, Inc., Santa Clara Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten
DE19915146C1 (de) * 1999-01-21 2000-07-06 Atotech Deutschland Gmbh Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen
BR0007639A (pt) * 1999-01-21 2001-11-06 Atotech Deutschland Gmbh Processo para formação galvânica de estruturas condutoras de cobre de alta pureza na produção de circuitos integrados
US6551483B1 (en) * 2000-02-29 2003-04-22 Novellus Systems, Inc. Method for potential controlled electroplating of fine patterns on semiconductor wafers
JP2002322592A (ja) * 2001-04-24 2002-11-08 Hitachi Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
DE10232612A1 (de) 2004-02-05
TW200415257A (en) 2004-08-16
US20050173250A1 (en) 2005-08-11
JP4221365B2 (ja) 2009-02-12
AU2003249927A1 (en) 2004-02-02
DE10232612B4 (de) 2006-05-18
TWI257961B (en) 2006-07-11
EP1521868B1 (de) 2008-09-03
ATE407236T1 (de) 2008-09-15
JP2005536633A (ja) 2005-12-02
AU2003249927A8 (en) 2004-02-02
WO2004007811A2 (en) 2004-01-22
EP1521868A2 (de) 2005-04-13
CN1668785A (zh) 2005-09-14
WO2004007811A3 (en) 2004-07-08
CN100346007C (zh) 2007-10-31

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