ATE407236T1 - Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens - Google Patents
Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrensInfo
- Publication number
- ATE407236T1 ATE407236T1 AT03763688T AT03763688T ATE407236T1 AT E407236 T1 ATE407236 T1 AT E407236T1 AT 03763688 T AT03763688 T AT 03763688T AT 03763688 T AT03763688 T AT 03763688T AT E407236 T1 ATE407236 T1 AT E407236T1
- Authority
- AT
- Austria
- Prior art keywords
- anode
- cathode
- reference electrode
- monitoring
- metal deposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Electrolytic Production Of Metals (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10232612A DE10232612B4 (de) | 2002-07-12 | 2002-07-12 | Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE407236T1 true ATE407236T1 (de) | 2008-09-15 |
Family
ID=30010161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03763688T ATE407236T1 (de) | 2002-07-12 | 2003-07-02 | Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens |
Country Status (9)
Country | Link |
---|---|
US (1) | US20050173250A1 (de) |
EP (1) | EP1521868B1 (de) |
JP (1) | JP4221365B2 (de) |
CN (1) | CN100346007C (de) |
AT (1) | ATE407236T1 (de) |
AU (1) | AU2003249927A1 (de) |
DE (2) | DE10232612B4 (de) |
TW (1) | TWI257961B (de) |
WO (1) | WO2004007811A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100572613C (zh) * | 2004-11-24 | 2009-12-23 | 北京大学 | 一种制备纳米间隙电极的反馈控制系统 |
DE102005024910A1 (de) * | 2005-05-31 | 2006-12-07 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zur In-Line-Steuerung der Lothöcker-Abscheidung |
FR2892595B1 (fr) * | 2005-10-21 | 2010-11-05 | Siemens Vdo Automotive | Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise |
US20070150819A1 (en) * | 2005-12-09 | 2007-06-28 | Mks Instruments, Inc. | Graphical User Interface |
JP2007212326A (ja) * | 2006-02-10 | 2007-08-23 | Tokyo Institute Of Technology | 電位差計測装置および電位差計測方法 |
JP2013077619A (ja) * | 2011-09-29 | 2013-04-25 | Renesas Electronics Corp | 半導体装置の製造方法 |
AU2013303221B2 (en) * | 2012-08-17 | 2015-11-19 | Alcoa Usa Corp. | Systems and methods for preventing thermite reactions in electrolytic cells |
US20140367264A1 (en) * | 2013-06-18 | 2014-12-18 | Applied Materials, Inc. | Automatic in-situ control of an electro-plating processor |
JP5826952B2 (ja) * | 2014-01-17 | 2015-12-02 | 株式会社荏原製作所 | めっき方法およびめっき装置 |
WO2015120554A1 (en) * | 2014-02-14 | 2015-08-20 | Universite Du Quebec A Chicoutimi | A method for analyzing an anode and device thereof |
CN109518244A (zh) * | 2018-12-27 | 2019-03-26 | 中国电子科技集团公司第二研究所 | 可削弱镀层边缘效应的晶圆镀铜工艺 |
JP7108801B1 (ja) * | 2022-03-01 | 2022-07-28 | 株式会社荏原製作所 | めっき装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB871203A (en) * | 1959-02-24 | 1961-06-21 | Artur Riedel | Method of and circuit for controlling the electrolytic current in an electrolytic bath |
US4445990A (en) * | 1981-11-12 | 1984-05-01 | General Electric Company | Electrolytic reactor for cleaning wastewater |
DE3718584A1 (de) * | 1987-06-03 | 1988-12-15 | Norddeutsche Affinerie | Verfahren zur messung der wirksamen inhibitorkonzentration waehrend der metallabscheidung aus waessrigen elektrolyten |
JP2546089B2 (ja) * | 1991-07-09 | 1996-10-23 | 上村工業株式会社 | 錫又は半田めっき浴への金属イオン補給方法 |
EP0991795B1 (de) * | 1998-04-21 | 2006-02-22 | Applied Materials, Inc. | Elektroplattierungssystem und verfahren zur elektroplattierung auf substraten |
DE19915146C1 (de) * | 1999-01-21 | 2000-07-06 | Atotech Deutschland Gmbh | Verfahren zum galvanischen Bilden von Leiterstrukturen aus hochreinem Kupfer bei der Herstellung von integrierten Schaltungen |
CA2359473A1 (en) * | 1999-01-21 | 2000-07-27 | Atotech Deutschland Gmbh | Method for electrolytically forming conductor structures from highly pure copper when producing integrated circuits |
US6551483B1 (en) * | 2000-02-29 | 2003-04-22 | Novellus Systems, Inc. | Method for potential controlled electroplating of fine patterns on semiconductor wafers |
JP2002322592A (ja) * | 2001-04-24 | 2002-11-08 | Hitachi Ltd | 半導体装置の製造方法 |
-
2002
- 2002-07-12 DE DE10232612A patent/DE10232612B4/de not_active Expired - Fee Related
-
2003
- 2003-07-02 WO PCT/EP2003/007051 patent/WO2004007811A2/en active IP Right Grant
- 2003-07-02 CN CNB03816583XA patent/CN100346007C/zh not_active Expired - Fee Related
- 2003-07-02 DE DE60323375T patent/DE60323375D1/de not_active Expired - Lifetime
- 2003-07-02 US US10/518,100 patent/US20050173250A1/en not_active Abandoned
- 2003-07-02 EP EP03763688A patent/EP1521868B1/de not_active Expired - Lifetime
- 2003-07-02 AT AT03763688T patent/ATE407236T1/de not_active IP Right Cessation
- 2003-07-02 JP JP2004520462A patent/JP4221365B2/ja not_active Expired - Fee Related
- 2003-07-02 AU AU2003249927A patent/AU2003249927A1/en not_active Abandoned
- 2003-07-11 TW TW092119187A patent/TWI257961B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200415257A (en) | 2004-08-16 |
CN100346007C (zh) | 2007-10-31 |
JP2005536633A (ja) | 2005-12-02 |
TWI257961B (en) | 2006-07-11 |
EP1521868B1 (de) | 2008-09-03 |
EP1521868A2 (de) | 2005-04-13 |
DE10232612A1 (de) | 2004-02-05 |
US20050173250A1 (en) | 2005-08-11 |
DE60323375D1 (de) | 2008-10-16 |
AU2003249927A1 (en) | 2004-02-02 |
AU2003249927A8 (en) | 2004-02-02 |
WO2004007811A3 (en) | 2004-07-08 |
CN1668785A (zh) | 2005-09-14 |
JP4221365B2 (ja) | 2009-02-12 |
DE10232612B4 (de) | 2006-05-18 |
WO2004007811A2 (en) | 2004-01-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE506468T1 (de) | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer | |
ATE407236T1 (de) | Vorrichtung und verfahren zur überwachung eines elektrolytischen verfahrens | |
EP1562412A3 (de) | Verfahren und Vorrichtung zur elektrolytishen Erhöhung der Stärke einer elektrisch leitfähigen Struktur auf einem dielektrischen Substrat | |
ATE484943T1 (de) | Elektrolytisches verfahren zum füllen von löchern und vertiefungen mit metallen | |
DE69608579D1 (de) | Elektrolytisches verfahren zur reinigung von elektrisch leitenden oberflächen | |
TW200702497A (en) | In-situ profile measurement in an electroplating process | |
MY145206A (en) | Apparatus for plating semiconductor wafers | |
EP1520915A3 (de) | Verfahren und Apparatur zum teilweisen Beschichten von Oberflächen eines Werkstückes | |
TW200513548A (en) | Insoluble anode with an auxiliary electrode | |
NO20091422L (no) | Fremgangsmater og systemer for elektroplettering av elektroder pa stedet | |
ATE440158T1 (de) | Verfahren zur elektrochemischen strukturierung eines leiter- oder halbleitermaterials und vorrichtung dafür | |
JP2006063448A (ja) | 被加工物を電気メッキするための装置及び方法 | |
WO2005033371A3 (en) | Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation | |
NO20052570L (no) | Fremgangsmate for a frembringe en god kontaktflate pa en elektrolysecelleskinne og stromskinne | |
TW200627515A (en) | Method and apparatus for electrochemical plating semiconductor wafers | |
JPH10227730A (ja) | 人工孔食作製方法 | |
TW200638479A (en) | Uniform current distribution for ECP loading of wafers | |
DE602004022268D1 (de) | Verfahren und vorrichtung zur herstellung elektrisch isolierter schichten von elektrochemischen zellenschichtstoffen | |
Hoshi et al. | Interpretation of negative resistance observed in electrochemical impedance during copper electrodeposition containing thiourea | |
JP2006283151A (ja) | 半導体製造方法及び半導体製造装置 | |
EP1598446A3 (de) | Verfahren und Anordnung zum Erfassen von Wechselstromkorrosion an kathodisch geschützten Anlagen | |
ATE532596T1 (de) | Verfahren zur elektrochemischen bearbeitung | |
MY180984A (en) | Method for removing adhered metals from metal plate | |
TW200617381A (en) | Method for detecting defects in a package containing metal foil by cyclic voltammetry | |
Büchler et al. | Effect of variation of cathodic protection level over time on the ac corrosion process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |