FR2892595B1 - Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise - Google Patents
Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realiseInfo
- Publication number
- FR2892595B1 FR2892595B1 FR0510771A FR0510771A FR2892595B1 FR 2892595 B1 FR2892595 B1 FR 2892595B1 FR 0510771 A FR0510771 A FR 0510771A FR 0510771 A FR0510771 A FR 0510771A FR 2892595 B1 FR2892595 B1 FR 2892595B1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- metallization
- monitoring
- quality
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001465 metallisation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0510771A FR2892595B1 (fr) | 2005-10-21 | 2005-10-21 | Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise |
DE102006048034A DE102006048034B4 (de) | 2005-10-21 | 2006-10-09 | Verfahren zur Kontrolle der Qualität der Metallisierung einer Leiterplatte |
US11/545,526 US7571399B2 (en) | 2005-10-21 | 2006-10-11 | Process for checking the quality of the metallization of a printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0510771A FR2892595B1 (fr) | 2005-10-21 | 2005-10-21 | Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2892595A1 FR2892595A1 (fr) | 2007-04-27 |
FR2892595B1 true FR2892595B1 (fr) | 2010-11-05 |
Family
ID=36587081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0510771A Active FR2892595B1 (fr) | 2005-10-21 | 2005-10-21 | Procede de controle de la qualite de la metallisation d'un circuit imprime et circuit imprime realise |
Country Status (3)
Country | Link |
---|---|
US (1) | US7571399B2 (fr) |
DE (1) | DE102006048034B4 (fr) |
FR (1) | FR2892595B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2962807B1 (fr) * | 2010-07-16 | 2012-08-10 | Thales Sa | Dispositif de mise en évidence de nano coupures dans des vias d'un circuit imprime |
FR3088798B1 (fr) * | 2018-11-16 | 2020-10-30 | Continental Automotive France | Procede et circuit de controle d'une qualite de metallisation d'un circuit imprime a plusieurs couches |
JP6848119B1 (ja) * | 2020-11-11 | 2021-03-24 | Ngkエレクトロデバイス株式会社 | 複合配線基板、パッケージおよび電子機器 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4477484A (en) * | 1982-12-10 | 1984-10-16 | International Business Machines Corporation | Electroless plating monitor |
GB2189657B (en) * | 1986-04-25 | 1990-02-14 | Plessey Co Plc | Improvements in or relating to electrical contactors |
US4992144A (en) * | 1987-02-24 | 1991-02-12 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
US6210537B1 (en) * | 1995-06-19 | 2001-04-03 | Lynntech, Inc. | Method of forming electronically conducting polymers on conducting and nonconducting substrates |
CN1081652C (zh) * | 1996-08-09 | 2002-03-27 | 东丽株式会社 | 聚丙烯膜及用其作电介质的电容器 |
US6493861B1 (en) * | 1999-12-28 | 2002-12-10 | Intel Corporation | Interconnected series of plated through hole vias and method of fabrication therefor |
DE10232612B4 (de) * | 2002-07-12 | 2006-05-18 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zur Überwachung eines elektrolytischen Prozesses |
-
2005
- 2005-10-21 FR FR0510771A patent/FR2892595B1/fr active Active
-
2006
- 2006-10-09 DE DE102006048034A patent/DE102006048034B4/de active Active
- 2006-10-11 US US11/545,526 patent/US7571399B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE102006048034A1 (de) | 2007-05-10 |
US7571399B2 (en) | 2009-08-04 |
DE102006048034B4 (de) | 2010-04-08 |
FR2892595A1 (fr) | 2007-04-27 |
US20070090852A1 (en) | 2007-04-26 |
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