DE60322734D1 - Wärmeleitfähige silikonzusammensetzung - Google Patents

Wärmeleitfähige silikonzusammensetzung

Info

Publication number
DE60322734D1
DE60322734D1 DE60322734T DE60322734T DE60322734D1 DE 60322734 D1 DE60322734 D1 DE 60322734D1 DE 60322734 T DE60322734 T DE 60322734T DE 60322734 T DE60322734 T DE 60322734T DE 60322734 D1 DE60322734 D1 DE 60322734D1
Authority
DE
Germany
Prior art keywords
silicone composition
heat
conductive silicone
component
heat conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60322734T
Other languages
English (en)
Inventor
Hiroshi Fukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of DE60322734D1 publication Critical patent/DE60322734D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lubricants (AREA)
DE60322734T 2002-11-08 2003-10-28 Wärmeleitfähige silikonzusammensetzung Expired - Lifetime DE60322734D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002325895A JP4587636B2 (ja) 2002-11-08 2002-11-08 熱伝導性シリコーン組成物
PCT/JP2003/013801 WO2004041938A1 (en) 2002-11-08 2003-10-28 Heat conductive silicone composition

Publications (1)

Publication Number Publication Date
DE60322734D1 true DE60322734D1 (de) 2008-09-18

Family

ID=32310488

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60322734T Expired - Lifetime DE60322734D1 (de) 2002-11-08 2003-10-28 Wärmeleitfähige silikonzusammensetzung

Country Status (9)

Country Link
US (1) US7592383B2 (de)
EP (1) EP1558679B1 (de)
JP (1) JP4587636B2 (de)
KR (1) KR100997371B1 (de)
AT (1) ATE403702T1 (de)
AU (1) AU2003276704A1 (de)
DE (1) DE60322734D1 (de)
TW (1) TWI302929B (de)
WO (1) WO2004041938A1 (de)

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JP4557136B2 (ja) 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4557137B2 (ja) * 2004-05-13 2010-10-06 信越化学工業株式会社 熱伝導性シリコーンゴム組成物及び成型品
JP4687887B2 (ja) * 2004-10-14 2011-05-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
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JP4828146B2 (ja) 2005-03-30 2011-11-30 東レ・ダウコーニング株式会社 熱伝導性シリコーンゴム組成物
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
WO2007025565A1 (en) 2005-09-01 2007-03-08 Freescale Semiconductor, Inc. Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
WO2007106209A2 (en) * 2006-02-23 2007-09-20 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US7803719B2 (en) 2006-02-24 2010-09-28 Freescale Semiconductor, Inc. Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and passivating coupling material comprising multiple organic components for use in a semiconductor device
US7834083B2 (en) * 2006-10-11 2010-11-16 Samsung Electro-Mechanics Co., Ltd. Nanocomposite composition comprising transparent nanoparticles
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KR101114923B1 (ko) * 2008-01-08 2012-03-13 주식회사 엘지화학 다기능 점착 필름, 이를 포함하는 플라즈마 디스플레이 패널 필터 및 이를 포함하는 플라즈마 디스플레이 패널
JP5372388B2 (ja) * 2008-01-30 2013-12-18 東レ・ダウコーニング株式会社 熱伝導性シリコーングリース組成物
US8808529B2 (en) * 2009-02-17 2014-08-19 Mcalister Technologies, Llc Systems and methods for sustainable economic development through integrated full spectrum production of renewable material resources using solar thermal
US9231267B2 (en) * 2009-02-17 2016-01-05 Mcalister Technologies, Llc Systems and methods for sustainable economic development through integrated full spectrum production of renewable energy
US8814983B2 (en) 2009-02-17 2014-08-26 Mcalister Technologies, Llc Delivery systems with in-line selective extraction devices and associated methods of operation
US9097152B2 (en) * 2009-02-17 2015-08-04 Mcalister Technologies, Llc Energy system for dwelling support
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JP2011140566A (ja) * 2010-01-07 2011-07-21 Dow Corning Toray Co Ltd 熱伝導性シリコーングリース組成物
JP5553006B2 (ja) * 2010-11-12 2014-07-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5755977B2 (ja) * 2011-09-08 2015-07-29 電気化学工業株式会社 高熱伝導性樹脂組成物
WO2016121563A1 (ja) * 2015-01-29 2016-08-04 ポリマテック・ジャパン株式会社 熱伝導性組成物
US10683444B2 (en) * 2015-05-22 2020-06-16 Momentive Performance Materials Japan Llc Thermally conductive composition
JP2019077843A (ja) * 2017-10-27 2019-05-23 信越化学工業株式会社 熱伝導性シリコーンポッティング組成物およびその硬化物
CN107964245A (zh) * 2017-12-18 2018-04-27 深圳德邦界面材料有限公司 一种点胶式凝胶导热垫片及其制备方法
CN108753265A (zh) * 2018-05-29 2018-11-06 苏州天脉导热科技股份有限公司 低热阻散热膏及其制备方法
CN111669956B (zh) 2019-03-06 2024-04-02 天津莱尔德电子材料有限公司 热管理和/或电磁干扰减轻材料以及相关装置和方法
WO2020203299A1 (ja) * 2019-03-29 2020-10-08 ダウ・東レ株式会社 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
CN113950511B (zh) 2019-06-21 2024-01-16 美国陶氏有机硅公司 用于制备触变可固化有机硅组合物的方法
KR102264954B1 (ko) * 2019-08-09 2021-06-15 정해영 봉지형 발열체 및 이를 포함하는 전기전열 매체
US11277545B2 (en) * 2020-02-27 2022-03-15 Gopro, Inc. Heatsink of an image capture device
US11146711B1 (en) 2020-04-10 2021-10-12 Gopro, Inc. Heatsinks for an image capture device
KR102469397B1 (ko) * 2020-10-28 2022-11-22 다우 실리콘즈 코포레이션 트라이알콕시 작용성 분지형 실록산 조성물
CN114539780A (zh) * 2020-11-24 2022-05-27 深圳先进电子材料国际创新研究院 一种单组份热界面材料及其制备方法
US20230106881A1 (en) * 2021-01-25 2023-04-06 Fuji Polymer Industries Co., Ltd. Thermally conductive silicone grease composition and method for producing the same
WO2022158029A1 (ja) * 2021-01-25 2022-07-28 富士高分子工業株式会社 熱伝導性シリコーングリース組成物及びその製造方法
CN113105744A (zh) * 2021-04-14 2021-07-13 中兴通讯股份有限公司 导热硅脂及其制备方法、芯片组件
EP4388045A1 (de) 2021-08-19 2024-06-26 Dow Silicones Corporation Wärmeleitfähige silikonzusammensetzung
WO2023147698A1 (en) 2022-02-07 2023-08-10 Dow Silicones Corporation Curable thermally conductive composition
TW202409154A (zh) 2022-08-08 2024-03-01 美商陶氏全球科技公司 聚矽氧烷填料處理劑及由其製備之組成物
TW202407064A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及用其製備之組成物
TW202406994A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及由其製備之組成物
TW202407058A (zh) 2022-08-08 2024-02-16 美商陶氏全球科技公司 聚矽氧烷填料處理劑及用其製備之組成物

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Also Published As

Publication number Publication date
TWI302929B (en) 2008-11-11
EP1558679A1 (de) 2005-08-03
US20060100336A1 (en) 2006-05-11
US7592383B2 (en) 2009-09-22
AU2003276704A1 (en) 2004-06-07
KR100997371B1 (ko) 2010-11-30
EP1558679B1 (de) 2008-08-06
ATE403702T1 (de) 2008-08-15
JP2004161797A (ja) 2004-06-10
KR20050074987A (ko) 2005-07-19
TW200418929A (en) 2004-10-01
WO2004041938A1 (en) 2004-05-21
JP4587636B2 (ja) 2010-11-24

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