DE60316664D1 - Verfahren zur Herstellung einer Festkörper-Bildaufnahmevorrichtung - Google Patents
Verfahren zur Herstellung einer Festkörper-BildaufnahmevorrichtungInfo
- Publication number
- DE60316664D1 DE60316664D1 DE60316664T DE60316664T DE60316664D1 DE 60316664 D1 DE60316664 D1 DE 60316664D1 DE 60316664 T DE60316664 T DE 60316664T DE 60316664 T DE60316664 T DE 60316664T DE 60316664 D1 DE60316664 D1 DE 60316664D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- image pickup
- solid state
- pickup device
- state image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000007787 solid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003123842 | 2003-04-28 | ||
JP2003123842A JP3729817B2 (ja) | 2003-04-28 | 2003-04-28 | 固体撮像装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60316664D1 true DE60316664D1 (de) | 2007-11-15 |
DE60316664T2 DE60316664T2 (de) | 2008-02-07 |
Family
ID=32985561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60316664T Expired - Lifetime DE60316664T2 (de) | 2003-04-28 | 2003-09-24 | Verfahren zur Herstellung einer Festkörper-Bildaufnahmevorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6864117B2 (de) |
EP (1) | EP1473775B1 (de) |
JP (1) | JP3729817B2 (de) |
KR (1) | KR100576765B1 (de) |
CN (1) | CN100401522C (de) |
DE (1) | DE60316664T2 (de) |
TW (1) | TW200423389A (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4180537B2 (ja) * | 2003-10-31 | 2008-11-12 | シャープ株式会社 | 光学素子の封止構造体および光結合器ならびに光学素子の封止方法 |
JP4324081B2 (ja) * | 2004-11-22 | 2009-09-02 | パナソニック株式会社 | 光学デバイス |
JP4196937B2 (ja) * | 2004-11-22 | 2008-12-17 | パナソニック株式会社 | 光学装置 |
JP4290134B2 (ja) * | 2005-03-14 | 2009-07-01 | パナソニック株式会社 | 固体撮像装置と固体撮像装置の製造方法 |
JP4595835B2 (ja) * | 2006-03-07 | 2010-12-08 | 株式会社日立製作所 | 鉛フリーはんだを用いたリード付き電子部品 |
KR100747610B1 (ko) * | 2006-04-06 | 2007-08-08 | 삼성전자주식회사 | 이미지 센서 및 이의 제조 방법 |
JP2008243869A (ja) * | 2007-03-26 | 2008-10-09 | Tdk Corp | 受光装置 |
JP4766435B2 (ja) * | 2008-07-24 | 2011-09-07 | Smk株式会社 | カメラモジュール用台座の製造方法 |
JP4693909B2 (ja) * | 2009-02-05 | 2011-06-01 | パナソニック株式会社 | 固体撮像装置とその製造方法 |
JP5489543B2 (ja) * | 2009-06-09 | 2014-05-14 | キヤノン株式会社 | 固体撮像装置 |
CN103579277B (zh) * | 2013-11-14 | 2016-02-03 | 华进半导体封装先导技术研发中心有限公司 | 基于倒装图像传感器芯片的封装结构和封装方法 |
US9666730B2 (en) | 2014-08-18 | 2017-05-30 | Optiz, Inc. | Wire bond sensor package |
JP2017139258A (ja) | 2016-02-01 | 2017-08-10 | ソニー株式会社 | 撮像素子パッケージ及び撮像装置 |
CN117981085A (zh) * | 2021-09-30 | 2024-05-03 | 索尼半导体解决方案公司 | 成像设备、电子设备以及成像设备的制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5748658A (en) * | 1993-10-22 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and optical pickup head |
JP3360504B2 (ja) * | 1995-11-10 | 2002-12-24 | ソニー株式会社 | 固体撮像装置の後処理方法及び製造方法 |
JP4372241B2 (ja) | 1998-08-05 | 2009-11-25 | パナソニック株式会社 | 固体撮像装置の製造方法 |
US6753922B1 (en) * | 1998-10-13 | 2004-06-22 | Intel Corporation | Image sensor mounted by mass reflow |
US6147389A (en) * | 1999-06-04 | 2000-11-14 | Silicon Film Technologies, Inc. | Image sensor package with image plane reference |
JP3461332B2 (ja) * | 1999-09-10 | 2003-10-27 | 松下電器産業株式会社 | リードフレーム及びそれを用いた樹脂パッケージと光電子装置 |
TW454309B (en) | 2000-07-17 | 2001-09-11 | Orient Semiconductor Elect Ltd | Package structure of CCD image-capturing chip |
JP2002043553A (ja) * | 2000-07-26 | 2002-02-08 | Canon Inc | 固体撮像装置 |
JP3540281B2 (ja) * | 2001-02-02 | 2004-07-07 | シャープ株式会社 | 撮像装置 |
-
2003
- 2003-04-28 JP JP2003123842A patent/JP3729817B2/ja not_active Expired - Fee Related
- 2003-09-23 TW TW092126171A patent/TW200423389A/zh not_active IP Right Cessation
- 2003-09-24 US US10/669,229 patent/US6864117B2/en not_active Expired - Lifetime
- 2003-09-24 DE DE60316664T patent/DE60316664T2/de not_active Expired - Lifetime
- 2003-09-24 EP EP03021542A patent/EP1473775B1/de not_active Expired - Lifetime
- 2003-09-26 CN CNB031598366A patent/CN100401522C/zh not_active Expired - Fee Related
- 2003-09-30 KR KR1020030067841A patent/KR100576765B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1542983A (zh) | 2004-11-03 |
US6864117B2 (en) | 2005-03-08 |
KR20040093361A (ko) | 2004-11-05 |
TWI309084B (de) | 2009-04-21 |
EP1473775A3 (de) | 2006-01-11 |
EP1473775A2 (de) | 2004-11-03 |
US20040214369A1 (en) | 2004-10-28 |
EP1473775B1 (de) | 2007-10-03 |
TW200423389A (en) | 2004-11-01 |
CN100401522C (zh) | 2008-07-09 |
JP2004327917A (ja) | 2004-11-18 |
DE60316664T2 (de) | 2008-02-07 |
JP3729817B2 (ja) | 2005-12-21 |
KR100576765B1 (ko) | 2006-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |