DE60327916D1 - Verfahren zur Herstellung einer elektro-optischen Vorrichtung - Google Patents

Verfahren zur Herstellung einer elektro-optischen Vorrichtung

Info

Publication number
DE60327916D1
DE60327916D1 DE60327916T DE60327916T DE60327916D1 DE 60327916 D1 DE60327916 D1 DE 60327916D1 DE 60327916 T DE60327916 T DE 60327916T DE 60327916 T DE60327916 T DE 60327916T DE 60327916 D1 DE60327916 D1 DE 60327916D1
Authority
DE
Germany
Prior art keywords
electro
producing
optical device
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60327916T
Other languages
English (en)
Inventor
Mutsumi Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE60327916D1 publication Critical patent/DE60327916D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/26—Light sources with substantially two-dimensional radiating surfaces characterised by the composition or arrangement of the conductive material used as an electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
DE60327916T 2002-10-24 2003-10-22 Verfahren zur Herstellung einer elektro-optischen Vorrichtung Expired - Lifetime DE60327916D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002310010A JP2004145011A (ja) 2002-10-24 2002-10-24 配線基板、回路基板、電気光学装置及びその製造方法、電子機器

Publications (1)

Publication Number Publication Date
DE60327916D1 true DE60327916D1 (de) 2009-07-23

Family

ID=32064366

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60327916T Expired - Lifetime DE60327916D1 (de) 2002-10-24 2003-10-22 Verfahren zur Herstellung einer elektro-optischen Vorrichtung

Country Status (7)

Country Link
US (2) US6989882B2 (de)
EP (1) EP1414067B1 (de)
JP (1) JP2004145011A (de)
KR (2) KR100643642B1 (de)
CN (1) CN1315183C (de)
DE (1) DE60327916D1 (de)
TW (1) TWI229366B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060199274A1 (en) * 2005-03-01 2006-09-07 Canon Kabushiki Kaisha Atmosphere conditioning method, exposure apparatus, and device manufacturing method
KR100696508B1 (ko) * 2005-04-14 2007-03-19 삼성에스디아이 주식회사 평판표시장치
KR100696525B1 (ko) * 2005-06-23 2007-03-19 삼성에스디아이 주식회사 평판표시장치
KR20070039398A (ko) * 2005-10-07 2007-04-11 히다치 막셀 가부시키가이샤 반도체장치, 반도체 모듈 및 반도체 모듈의 제조방법
JP4939045B2 (ja) * 2005-11-30 2012-05-23 セイコーエプソン株式会社 発光装置および電子機器
JP5316659B2 (ja) * 2006-01-24 2013-10-16 セイコーエプソン株式会社 発光装置および電子機器
JP5250960B2 (ja) * 2006-01-24 2013-07-31 セイコーエプソン株式会社 発光装置および電子機器
JP5076925B2 (ja) * 2007-04-11 2012-11-21 セイコーエプソン株式会社 アクティブマトリクス基板、及びその製造方法、電気光学装置、電子機器
JP5199638B2 (ja) * 2007-10-16 2013-05-15 株式会社ジャパンディスプレイイースト 液晶表示装置
US8259095B2 (en) * 2009-08-20 2012-09-04 Global Oled Technology Llc Optically testing chiplets in display device
JP2010160526A (ja) * 2010-04-23 2010-07-22 Seiko Epson Corp 発光装置および電子機器
JP5966412B2 (ja) * 2011-04-08 2016-08-10 ソニー株式会社 画素チップ、表示パネル、照明パネル、表示装置および照明装置
JP5141812B2 (ja) * 2011-11-09 2013-02-13 セイコーエプソン株式会社 発光装置および電子機器
KR101969952B1 (ko) * 2012-06-05 2019-04-18 삼성디스플레이 주식회사 표시 장치
WO2022162496A1 (ja) * 2021-01-28 2022-08-04 株式会社半導体エネルギー研究所 表示装置の作製方法、表示装置、表示モジュール、及び、電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3293135B2 (ja) * 1990-04-24 2002-06-17 セイコーエプソン株式会社 回路セル・アレイを備えた半導体装置
JPH0936328A (ja) * 1995-07-14 1997-02-07 Hitachi Ltd ダイナミック型ｒａｍ
KR100481994B1 (ko) * 1996-08-27 2005-12-01 세이코 엡슨 가부시키가이샤 박리방법,박막디바이스의전사방법,및그것을이용하여제조되는박막디바이스,박막집적회로장치및액정표시장치
JP3520396B2 (ja) * 1997-07-02 2004-04-19 セイコーエプソン株式会社 アクティブマトリクス基板と表示装置
JP3541625B2 (ja) * 1997-07-02 2004-07-14 セイコーエプソン株式会社 表示装置及びアクティブマトリクス基板
JP3634138B2 (ja) * 1998-02-23 2005-03-30 株式会社 日立ディスプレイズ 液晶表示装置
JP4482949B2 (ja) * 1999-01-29 2010-06-16 ソニー株式会社 平面表示素子及びその配線方法
US6531713B1 (en) * 1999-03-19 2003-03-11 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and manufacturing method thereof
JP4578609B2 (ja) * 1999-03-19 2010-11-10 株式会社半導体エネルギー研究所 電気光学装置
JP5210473B2 (ja) * 1999-06-21 2013-06-12 株式会社半導体エネルギー研究所 表示装置
JP3447619B2 (ja) * 1999-06-25 2003-09-16 株式会社東芝 アクティブマトリクス基板の製造方法、中間転写基板
TW465122B (en) * 1999-12-15 2001-11-21 Semiconductor Energy Lab Light-emitting device
KR100391843B1 (ko) * 2001-03-26 2003-07-16 엘지.필립스 엘시디 주식회사 액정 표시 장치의 실장 방법 및 그 구조
US6545731B2 (en) * 2001-04-13 2003-04-08 Koninklijke Philips Electronics N.V. Liquid crystal display device having light isolation structure
JP4776801B2 (ja) * 2001-04-24 2011-09-21 株式会社半導体エネルギー研究所 メモリ回路
JP3666413B2 (ja) * 2001-05-24 2005-06-29 セイコーエプソン株式会社 半導体装置、メモリシステムおよび電子機器
JP4310984B2 (ja) * 2002-02-06 2009-08-12 株式会社日立製作所 有機発光表示装置
JP2004101948A (ja) * 2002-09-10 2004-04-02 Dainippon Printing Co Ltd 表示装置およびその製造方法

Also Published As

Publication number Publication date
US20040125551A1 (en) 2004-07-01
KR20040036546A (ko) 2004-04-30
KR100711745B1 (ko) 2007-04-25
TW200409180A (en) 2004-06-01
EP1414067B1 (de) 2009-06-10
US6989882B2 (en) 2006-01-24
US7215403B2 (en) 2007-05-08
CN1499615A (zh) 2004-05-26
EP1414067A3 (de) 2005-04-06
KR100643642B1 (ko) 2006-11-10
TWI229366B (en) 2005-03-11
JP2004145011A (ja) 2004-05-20
KR20060038965A (ko) 2006-05-04
CN1315183C (zh) 2007-05-09
US20060051909A1 (en) 2006-03-09
EP1414067A2 (de) 2004-04-28

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